• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.236.1-236.1
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• 2015

The surface morphology of front transparent conductive oxide (TCO) films is very important to achieve high current density in amorphous silicon (a-Si) thin film solar cells since it can scatter the light in a better way. In this study, we present the low cost hydrothermal deposited uniform zinc oxide (ZnO) nano-flower structure with various aspect ratios for a-Si thin film solar cells. The ZnO nano-flower structures with various aspect ratios were grown on the RF magnetron sputtered AZO films. The diameters and length of the ZnO nano-flowers was controlled by varying the annealing time. The length of ZnO nano-flowers were varied from 400 nm to $2{\mu}m$ while diameter was kept higher than 200 nm to obtain different aspect ratios. The ZnO nano-flowers with higher surface area as compared to conventional ZnO nano structure are preferred for the better light scattering. The conductivity and crystallinity of ZnO nano-flowers can be enhanced by annealing in hydrogen atmosphere at 350 oC. The vertical aligned ZnO nano-flowers showed higher haze ratio as compared to the commercially available FTO films. We also observed that the scattering in the longer wavelength region was favored for the high aspect ratio of ZnO nano-flowers. Therefore, we proposed low cost and vertically aligned ZnO nano-flowers for the high performance of thin film solar cells.

• Structural Engineering and Mechanics
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• v.74 no.5
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• pp.657-670
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• 2020

Due to the high compressive and tensile strength of ultra-high performance concrete (UHPC), UHPC used in steel concrete composite structures provided thinner concrete layer compared to ordinary concrete. This leaded to the headed stud shear connectors embedded in UHPC had a low aspect ratio. In order to systematic investigate the effect of headed stud with low aspect ratio on the structural behaviors of steel UHPC composite structure s this paper firstly carried out a test program consisted of twelve push out specimens. The effects of stud height, aspect ratio and reinforcement bars in UHPC on the structural behaviors of headed studs were investigated. The push out test results shows that the increasing of stud height did not obviously influence the structural behaviors of headed studs and the aspect ratio of 2.16 was proved enough to take full advantage of the headed stud strength. Based on the test results, the equation considering the contribution of weld collar was modified to predict the shear strength of headed stud embedded in UHPC. The modified equation could accurately predict the shear strength of headed stud by comparing with the experimental results. On the basis of push out test results, bending tests consisted of three steel UHPC composite slabs were conducted to investigate the effect of shear connection degree on the structural behaviors of composite slabs. The bending test results revealed that the shear connection degree had a significantly influence on the failure modes and ultimate resistance of composite slabs and composite slab with connection degree of 96% in s hear span exhibited a ductile failure accompanied by the tensile yield of steel plate and crushing of UHPC. Finally, analytical model based on the failure mode of composite slabs was proposed to predict the ultimate resistance of steel UHPC composite slabs with different shear connection degrees at the interface.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.12
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• pp.119-127
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• 2007

Recently, microstructures fabricated using microstereolithography technology have been used in the biological, medical and mechanical fields. Microstereolithography can fabricate real 3D microstructures with fine features, although there is presently a limited number of materials available for use in the process. Deformation of the fine features on a fabricated microstructure remains a critical issue for successful part fabrication, and part deformation can occur during rinsing or during fabrication as a result of fluid flow forces that occur during movement of mechanical parts of the system. Deformation can result in failure to fabricate a particular feature by breaking the feature completely, spatial deflection of the feature, or attaching the feature to neighboring microstructures. To improve mechanical strength of fabricated microstructures, a clay nanocomposite can be used. In particular, a high-aspect ratio microstructure can be fabricated without distortion using photocurable liquid resin containing a clay nanocomposite. In this paper, a clay nanocomposite was blended with a photocurable liquid resin to solve the deformation problem that occurs during fabrication and rinsing. An optimal mixture ratio of a clay nanocomposite was found through tensile testing and the minimal allowable distance between microstructures was found through fabrication experimentation. Finally, using these results, high-aspect ratio microstructures were fabricated using a clay nanocomposite resin without distortion.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1974-1976
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• 1996

An electrostatically driven comb actuator with $525{\mu}m$ height was fabricated using (110) Si anisotropic etching in the Potassium Hydroxide(KOH) solution. The etch-rate and etch-rate ratio are strongly dependent on the weight % and temperature of KOH solution. We developed the optimal condition for the anisotropic etching on (110) wafer with varying these conditions. The force that the comb-drive actuator generates is inversely proportional to the distance of gap and proportional to the height of the comb electrodes. The electrodes must have the high aspect ratio. The (110) Si anisotropic etching is very useful to get a high aspect ratio structure.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.356-359
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• 2007

Continuing improvements in integrated circuit chip density and functionality have mostly contributed toward a very large-scale integrated circuit(VLSI) and display device. In order to test (pass or fail) all of the high integrated semiconductor chip and display device, fine pitch probes are used. Fine pitch probes are manufactured by electroforming process of a Ni alloy in an electrolytic bath. In this paper, we expect that the electric field in bath with the Finite Element Method and applying the FEM result. So, we can obtained the probes that have high aspect ratio of 10 : 1

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1175-1178
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• 2005

Brittle materials, especially single-crystal silicon wafer, are widely used for sensors, IC industry, and MEMS applications. e general machining process of crack easy materials is by chemical agents, but it is hazardous and time consuming. Also, it is difficult to get high aspect ratio micro structure. As an alternative tool, an AJM(Abrasive jet machining) is promising method in terms of high aspect ratio and production cost. In this study, to get more precise detail compared to general AJM, photo polymer mask, SU-8, used in photolithography was applied in AJM. Process parameters such as abrasive diameter, air pressure, nozzle diameter, flow rate of abrasive in AJM and a variety of conditions in spin coating were decided. Finally, micro channel and mixer was fabricated to see the efficiency of the AJM with photo polymer mask.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.9
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• pp.1517-1523
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• 2003

Deep X-ray lithography (DXRL), a fabrication method for the production of microstructures with a high aspect ratio, plays an important role in the subsequent electroplanting process. However, secondary radiation is generated during X-ray exposure and damages the resist adhesion to the metal layer. To solve adhesion problems, we modified the conventional DXRL process, changing the sequence of polymer adhesion in DXRL process. With optimized X-ray exposure and development conditions based on a calculated and modified X-ray power spectrum, we fabricated various polymer microstructures and achieved a maximum aspect ratio of 40.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.1
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• pp.33-38
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• 2001

We investigate the via-size dependance of as-electroplated- and reflow-bump shapes for realizing both high-density and high-aspect ratio of solder bump. The solder bump is fabricated by subsequent processes as follows. After sputtering a TiW/Al electrode on a 5-inch Si-wafer, a thick photoresist for via formation it obtained by multiple-codling method and then vias with various diameters are defined by a conventional photolithography technique using a contact alinger with an I-line source. After via formation the under ball metallurgy (UBM) structure with Ti-adhesion and Cu-seed layers is sputtered on a sample. Cu-layer and Sn/pb-layer with a competition ratio of 6 to 4 are electroplated by a selective electroplating method. The reflow-bump diameters at bottom are unchanged, compared with as-electroplated diameters. As-electroplated- and reflow-bump shapes, however, depend significantly on the via size. The heights of as-electroplated and reflow bumps increase with the larger cia, while the aspect ratio of bump decreases. The nearest bumps may be touched by decreasing the bump pitch in order to obtain high-density bump. The touching between the nearest bumps occurs during the overplating procedure rather than the reflowing procedure because the mushroom diameter formed by overplating is larger than the reflow-bump diameter. The arrangement as zig-zag rows can be effective for realizing the flip-chip-interconnect bump with both high-density and high-aspect ratio.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.02a
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• pp.274-284
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• 2002

Deep drawing process for rectangular drawn section is different with that for axisymmetric circular one. Therefore deep drawing process for rectangular drawn section requires several intermediate steps to generate the final configuration without any significant defect. In this study, finite element analysis for multi-stage deep drawing process for high precision rectangular cases is carried out especially for an extreme aspect ratio. The analysis is performed using rigid-plastic finite element method with an explicit time integration scheme of the commercial program, LS-DYNA3D. The sheet blank is modeled using eight-node continuum brick elements. The results of analysis show that the irregular contact condition between blank and die affects the occurrence of failure, and the difference of aspect ratio in the drawn section leads to non-uniform metal flow, which may cause failure. A series of experiments for multi-stage deep drawing process for the rectangular cases are conducted, and the deformation configuration and the thickness distribution of the drawn rectangular cases are investigated by comparing with the results of the numerical analysis. The numerical analysis with an explicit time integration scheme shows good agreement with the experimental observation.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.143-144
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• 2006

In this paper, we proposed XP KMPR-1050 negative tone resist to replace SU-8 resist for multi-layer micro-structures and thick plating mold fabrication using UV-LIGA process. XP KMPR resist proposed in this paper can be easily striped using a common stripping solution such as NMP without damage of micro-structure. The conditions for the fabrication of XP KMPR micro-structure were optimized by adjustment of exposure and post-exposure bake(PEB). The $140{\mu}m$ -thick and an aspect ratio at least 10 micro-structure and multi-layer structures were successfully fabricated through the process conditions. Through-mold electroplating and PR striping of XP KMPR has been successfully demonstrated.