• Journal of the Semiconductor & Display Technology
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• v.3 no.3
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• pp.5-9
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• 2004

A new wafer level packaging scheme is presented as an alternative to MEMS package. The proof-of-concept structure is fabricated and evaluated to confirm the feasibility of the idea for MEMS wafer level packaging. The scheme of this work is developed using an electroplated tin (Sn) solder. The critical difference over conventional ones is that wafers are laterally bonded by solder reflow after LEGO-like assembly. This lateral bonding scheme has merits basically in morphological insensitivity and its better bonding strength over conventional ones and also enables not only the hermetic sealing but also its electrical interconnection solving an open-circuit problem by notching through via-hole. The bonding strength of the lateral bonding is over 30 Mpa as evaluated under shear and the hermeticity of the encapsulation is 2.0$\times10^{-9}$mbar.$l$/sec as examined by pressurized Helium leak rate. Results show that the new scheme is feasible and could be an alternative method for high yield wafer level packaging.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.29-36
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• 2008

In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.

• Progress in Superconductivity and Cryogenics
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• v.5 no.1
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• pp.107-110
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• 2003

High Temperature Superconductor (HTS) transmission cable can carry more than 2 to 5 times higher electricity and also obtain substantially lower transmission losses than conventional cables. Liquid nitrogen is to be used to cool the HTS power cable and its cost is much cheaper than the liquid helium used for the cooling of metal superconducting wire. In Korea the HTS power cable development project has been ongoing since July, 2001 with the basic specifications of 22.9kV, 50MVA and told dielectric type as the first 3-year stage. The cryogenic system of the HTS cable is composed of HTS cable cryostat termination and refrigeration system. Termination of HTS cable is a connecting part between copper electrical cable at room temperature and HTS cable at liquid nitrogen temperature. In order to design the termination cryostat, it is required that the conduction heat leak and Joule heating on the current lead be reduced, the cryostat be insulated electrically and good vacuum insulation be maintained during long time operation. Heat loads calculations on the copper current lead have been performed by analytical and numerical method and the feasibility study fer the other candidate materials has also been executed.

• The Bulletin of The Korean Astronomical Society
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• v.35 no.1
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• pp.54.2-54.2
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• 2010

The most massive galactic globular cluster, $\omega$ Cen has been observed using recently mounted WFC3/UVIS cameras of Hubble Space Telescope at both near-UV and optical bands. We present the photometry of stars in the central region of $\omega$ Cen in F225W, F275W and F336W bands. The near-UV color-magnitude diagrams and color-color diagrams of stars in $\omega$ Cen show multiple red giant branches and main sequences as already discovered in both ground-based and HST/ACS observations in the optical bands. We modelled the stellar populations of $\omega$ Cen using Yonsei Isochrone, where $\alpha$-particles and helium enhancement processes have been included properly. We compare the best-fit stellar populations obtained from the current near-UV observations to the suggested stellar population models based on optical band data. We also discuss the methodological issues arising when dealing with the near-UV observations; red-leak in near-UV filters and the huge interstellar extinction in near-UV bands compared to the optical bands and its non-linear effect in color-magnitude diagrams.

• Journal of the Korean Society of Mechanical Technology
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• v.13 no.2
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• pp.137-143
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• 2011

Fuel Test Loop(FTL) is a facility which could conduct a fuel irradiation test at HANARO(High-flux Advanced Neutron Application Reactor). FTL simulates commercial NPP's operating conditions such as the pressure, temperature and neutron flux levels to conduct the irradiation and thermo-hydraulic tests. The In-Pile Test Section(IPS) installed in HANARO FTL is designed as a pressure vessel design conditions of $350^{\circ}C$, 17.5MPa. The instrumentation MI-cables for thermocouples, SPND and LVDT are passed through the sealing plug, which is in the pressure boundary region and is a part of instrumentation feedthrough of MI-cable. In this study, the brazing method and performance test results are introduced to the sealing plug with BNi-2 filler metal, which is selected with consideration of the compatibility for the coolant. The performance was verified through the insulation resistance test, hydrostatic test, and helium leak test.

• Journal of the Korean Society of Marine Environment & Safety
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• v.30 no.2
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• pp.165-175
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• 2024

Hydrogen is being touted as one of the energy sources to combat the climate change crisis. However, hydrogen can leak into enclosed spaces, rise to the ceiling, accumulate, and cause fires and explosions if it encounters an ignition source. In particular, ships that transport hydrogen or use it as a fuel comprise multiple enclosed spaces. Therefore, the dif usion characteristics within these spaces must be understood to ensure the safe use of hydrogen. The purpose of this study is to experimentally determine the diffusion characteristics of helium, which has similar properties to hydrogen, in a closed space on board a ship, and to determine the change in the oxygen concentration along the leakage direction as the air change per hour(ACH) increases to 25, 30, 35, 40, and 45 through CFD simulation. The study, results revealed that the oxygen concentration reduction rate was 2% for leakage in the -z direction and 1% for leakage in the +x and +z directions, and the ventilation time was 15 min 30 s for leakage in the -z direction, 7 min for leakage in the +x direction, and 9 min for leakage in the +z direction, showing that differences existed in the oxygen concentration and ventilation time depending on the leakage direction. In addition, no significant difference was observed in the rate of oxygen concentration reduction and ventilation time in all leakage directions from the ACH of 35 and above in the experimental space. Therefore, because the oxygen concentration and ventilation time were not improved by increasing the ACH, 35 was noted as the optimal ACH in this experimental environment.

• Journal of Sensor Science and Technology
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• v.15 no.1
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• pp.58-64
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• 2006

In this study, we describe a low-temperature wafer-level thermocompression bonding using electroplated gold seal line and bonding pads by electroplating method for RF-MEMS devices. Silicon wafers, electroplated with gold (Au), were completely bonded at $320^{\circ}C$ for 30 min at a pressure of 2.5 MPa. The through-hole interconnection between the packaged devices and external terminal did not need metal filling process and was made by gold films deposited on the sidewall of the throughhole. This process was low-cost and short in duration. Helium leak rate, which is measured to evaluate the reliability of bonded wafers, was $2.7{\pm}0.614{\times}10^{-10}Pam^{3}/s$. The insertion loss of the CPW packaged was $-0.069{\sim}-0.085\;dB$. The difference of the insertion loss between the unpackaged and packaged CPW was less than -0.03. These values show very good RF characteristics of the packaging. Therefore, gold thermocompression bonding can be applied to high quality hermetic wafer level packaging of RF-MEMS devices.