• 제목/요약/키워드: halogen free

검색결과 39건 처리시간 0.021초

할로겐이 없는 저연성 폴리올레핀에 관한 연구 (Study on Halogen Free Low Smoke Polyolefin)

  • 김영두;정광수;김태호
    • Elastomers and Composites
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    • 제37권3호
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    • pp.177-182
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    • 2002
  • 범용으로 사용할 수 있는 low smoke type의 난연 polyolefin(halogen free)계 컴파운드의 최적 배합을 구현하기 위해 LDPE, EVA, EEA를 수지로 하고 상용화제로 MAH-graft-PE를 이용하였으며, 난연제로 수산화마그네슘, 수산화알루미늄과 적린을 사용하여 변량 시험을 하였다. 물성은 상온 인장강도, 신장율과 노화후 인장신장 잔율을 기본으로 smoke density 산소 지수 시험을 하였고, 난연성은 UL-94로 확인하였으며, 수산화마그네슘과 수산화알루미늄의 대표 배합을 SEM 촬영하여 분산구조를 확인하였다. HCI 함량 시험을 하여 halogen content를 확인하였다. 또한 halogen free로 난연성(UL-94, V-0)과 저연성을 만족하는 2종의 배합을 도출해 냄으로서 여러 가지 용도로서의 전용이 가능할 것으로 보인다.

Halogen Free 난연 케이블의 제특성 및 개발 (Properties and Development of Halogen Free Flame Retardant Cable)

  • 최원규;최웅;서세종;양호진;원준희
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1992년도 하계학술대회 논문집 B
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    • pp.768-770
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    • 1992
  • Conventional flame retardant cable using PVC or CR materials generate considerable amount of toxic and acidic gas (HCI etc.) together with excessive black smoke during a fire. The newly developed halogen free materials have dissolved the problem of halogen acid gases. This paer describes the development of this power cable insulation and sheath, using halogen free materals.

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Recent Pb-free Electronic Packaging Issues

  • Lee, Hyuck-Mo
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2001년도 The IMAPS-Korea Workshop 2001 Emerging Technology on packaging
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    • pp.63-92
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    • 2001
  • ·EC's/Japanese environmental regulation drive the Pb-free/Halogen-free application ·Most Japanese electronics companies are preparing the green products. ·All items concerning to Pb-free/halogen-free technology should be coparallely designed and developed. ·More works need to clear the unknowns on Pb-free materials ·Need of consensus on materials and standards ·EBM (Environmental Benign Manufacturing)

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Review on the Lead-Free Solder Technology

  • Lee, Hyuck-Mo
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2001년도 3rd Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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    • pp.21-50
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    • 2001
  • EC's/Japanese environmental regulation drive the Pb-free/Halogen-free application. Most Japanese electronics companies are preparing the green products. All items concerning to Pb-free/Halogen-ree technology should be coparallely designed and developed. More works need to clear the unknowns on Pb-free materials. Need of consensus on materials and standards. EBM (Environmental Benign Manufacturing)

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나노클레이 첨가에 따른 할로겐프리 난연컴파운드의 기계적 특성에 관한 연구 (A Study on Mechanical Properties Improvement of Halogen-free Flame Retardant Compounds by Nanoclay Addition)

  • 황찬연;양종석;성백용;김지연;박대희
    • 한국전기전자재료학회논문지
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    • 제28권2호
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    • pp.126-130
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    • 2015
  • In this study, some materials are organized and experimented with variables to obtain the optimum mix proportion for the mechanical property of halogen free flame resistance compound with varying addition of nano clay. Tensile strength, density and stiffness are tested in the room temperature. In this study, unlike existing layered structure, nano clay with tabular structure is used and sufficient stiffness, strength, thermal stability and gas block capability can be achieved with small amount of addition. Tensile strength and elongation test show high rupture strength only in specimens with compatibilizing agents while density test shows average measurement in all the specimens except T-9. It was confirmed that the measurement value according to the additives in compatibilizing agent or in nano clay of hardness test represents similarly.

Pb-free Status and Strategy of Semiconductor Business in Samsung Electronics

  • Jeong Se-Young
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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    • pp.79-92
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    • 2004
  • RoHS compliant products are now being mass-produced. Eco-product(Pb-free+RoHS compliant+Halogen-free) will be possible from 2005. Pb-free flip chip will be qualified by 2004. 4Q. Lead Finish: SnBi-Under mass production Pd PPF-Under small production Matte Sn-will be internally qualified by 2004. 4Q Development of Pb-free Solder Ball: Stable Supply, Cost Down.

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LIGHT EMITTING DIODE로 광조사한 상아질 접착제의 상아질 전단접착강도와 중합률에 관한 연구 (Dentin bond strength of bonding agents cured with Light Emitting Diode)

  • 김선영;이인복;조병훈;손호현;김미자;석창인;엄정문
    • Restorative Dentistry and Endodontics
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    • 제29권6호
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    • pp.504-514
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    • 2004
  • LED 광중합기(Elipar FreeLight, 3M-ESPE)와 할로겐 광중합기(VIP Bisco)로 광조사한 수종의 상아질 접착제에 대해서 상아질 전단접착강도를 비교하였다 또한 이번 연구의 광학적 근거를 얻기 위해 두 광중합기의 파장에 따른 광강도와 스펙트럼을 비교하였다. 이번 연구에서 사용된 상아질 접착제는 Scotchbond Multipurpose (3M ESPE), Single Bond (3M ESPE). One-Step (Bisco), Clearfil SE Bond (Kuraray), Adper Prompt (3M ESPE) 이다. VIP는 487 nm에서 최대정점을 가지는 넓은 스펙트럼의 분포를 보이는 반면에, Elipar FreeLight는 465 nm에서의 최대정점을 중심으로 좁은 스펙트럼의 분포를 보였다. Clearfil SE bond를 제외하고 할로겐과 LED로 광조사 한 각 상아질 접착제에서 상아질 전단접착강도값의 유의성 있는 차이는 보이지 않았다 (P > 0.05). 이러한 결과는 camphoroquinone의 흡수스펙트럼과 LED의 좁은 영역의 스펙트럼사이에 강한 연관성으로 설명할 수 있다.

다양한 광원에 의한 광중합형 수복물질의 미세경도에 관한 연구 (THE EFFECTS OF VARIOUS CURING LIGHT SOURCES ON THE MICROHARDNESS OF LIGHT-ACTIVATED RESTORATIVE MATERIALS)

  • 최남기;양규호;김선미;최충호
    • 대한소아치과학회지
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    • 제32권4호
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    • pp.634-643
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    • 2005
  • 이번 연구의 목적은 청색광을 방출하는 다이오드(LED) 광중합기(FreeLight2, L.E.Demetron I, Ultra-Lume 5)가 3가지의 레진재료들 (Z250, Point 4, Dyract AP)의 미세경도에 미치는 영향을 평가하고 그들의 최적 중합시간을 찾는 것이다. 표본들은 각각의 복합체에 대하여 아크릴릭 몰드$(2.0mm{\times}3mm)$를 사용하여 만들었다 모든 표본들은 평평한 유리판위에 Mylar strip을 위치시킨 후 제작되었다. 몰드에 복합체가 위치된 후 또다른 Mylar strip으로 덮고 유리판으로 가볍게 압력을 가하였다 광조사 시간은 Elipar TriLight은 40초, Elipar FreeLight 2, L.E.Demetron I, Ultra-Lume 5는 각각 5, 10, 20, 40초씩으로 하였으며 평균 경도값은 각각의 그룹에서 상층과 하층을 사용하여 계산했다. 결과의 통계적 유의성을 위해 ANOVA와 Sheffe's test를 사용하였다. FreeLight 2. Ultra-Lume 5, and L.E. Demetron I는 대조군인 할로겐 광중합 40초에 비교하여 Point 4를 20초에 중합시킬 수 있었다. FreeLight 2 and L.E.Demetron I는 대조군인 20초의 할로겐 광중합에 비교하여 Z250을 10초에 중합시킬 수 있었다. FreeLight 2와 L.E.Demetron I는 대조군인 40초의 할로겐 광중합에 비교하여 Dyract AP를 10초에 중합시킬 수 있었다. 이번 연구에서 사용된 LED 광중합기는 통상적으로 이용되는 할로겐 광중합기와 비교시 절반이하의 조사시간으로도 적절한 미세 경도를 얻을 수 있었다.

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나노클레이 첨가에 따른 할로겐프리 난연컴파운드의 수직난연 특성 향상에 관한 연구 (A Study on Perpendicular Flame Retardant Characteristic Improvement of Halogen-free Flame Retardant Compounds by Nanoclay Addition)

  • 황찬연;양종석;성백용;김지연;박대희
    • 한국전기전자재료학회논문지
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    • 제28권1호
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    • pp.51-56
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    • 2015
  • The object of this study is to obtain the optimum mix proportion of halogen free compound with flame resistance and, for the purpose, thermal/electrical characteristics test are conducted using compatibilizing agents, flame resistance agents, hydroxide aluminum, sunscreen, antioxidant and silicon oil on the base resin of linear low density polyethylene (LLDPE), Ethylene vinyl acetate copolymer (EVA). Existing compound method accompanies many requirements to be satisfied including a lot of addition of flame resistance agents, prohibition of impact on mixing capability with base and property and etc. In this study, different from the existing method, the optimum mix proportion is determined and experimented by adding nano clay. Oxygen index test shows no difference between specimens while T-6, T-9 shows oxygen index of 29[%] and 26[%], respectively. This is concluded that hydroxide aluminum, which is a flame resistance agent, leads low oxygen index. From UL94-V vertical flame resistance test, the combustion behavior is determined as V-0, Fail based on UL94-V decision criteria. Viscometry shows low measurements in specimens with separate addition of compatibilizing agents or nano clay. Volume resistivity test shows low measurement mainly in specimens without compatibilizing agents. Therefore, with the flame resistance compound shows better performance for thermal/electrical property and the optimum mix proportion are achieved among many existing materials.

비할로겐 M-P 난연제 제조 및 복합재료 응용 연구 (A Study on the Preparation of Halogen Free M-P Flame Retardant and Its Application to Composite Material)

  • 이순홍
    • 한국안전학회지
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    • 제24권6호
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    • pp.63-71
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    • 2009
  • In order to improve flame retardancy, the halogen free organic melamine phosphate(M-P) flame retardant was synthesized from melamine and phosphoric acid by the reaction of precipitation. The ignition test was carried out preparing hybrid flame retardant compound($H_bFRC$) consisting of organic M-P and inorganic Mg$(OH)_2$ as a flame retardant in the polyolefin resins. The flame retardancy and mechanical properties of flame retardant aluminum composite panel($H_bFRC$-ACP) were performed to investigate the possibility of the composite material, which was contained M-P, as a inner core for $H_bFRC$-ACP. For this study, the results of ignition test indicate that a char formation and drip suppressing effect, and combustion time reduced as the content of M-P increased. The limited oxygen index(LOI) values were measured 17.4vol% and 31.5vol% for LDPE only and $H_bFRC$-3(M-P content: 15wt%), respectively. And it was verified that the $H_bFRC$-3 was needed more oxygen quantity with the increase of M-P content when it combustion. Also, the results from thermogravimetric analysis were observed endothermic peak at $350^{\circ}C$ and $550^{\circ}C$, it was confirmed predominant thermal stability though the wide temperature range by the mixture of M-P and Mg$(OH)_2$. The LDPE-ACP (using only LDPE as a inner core), $35.13kW/m^2$ of heat release rate(HRR) and 13.43MJ/m2 of total heat release(THR) were measured while the $H_bFRC$-ACP, $10.44kW/m^2$ of HRR and 1.84MJ/m2 of THR were measured by results of cone calorimeter test. In case of $H_bFRC$-ACP, the average gas emission amount of CO and $CO_2$ could be decreased down to 25% and 20%, respectively, in comparison with LDPE-ACP. The mechanical properties such as tensile strength, bending strength and adhesion strength of $H_bFRC$-ACP were revealed slightly high values $54N/mm^2$, $152N/mm^2$ and 120N/25mm, respectively, compared with LDPE-ACP. It was confirmed that flame retardancy was improved with the synergy effect because of char formation by M-P and hydrolysis by Mg$(OH)_2$. The result of this study suggest that $H_bFRC$ can be applied for an adequate halogen free flame retardant composite material as a inner core for ACP.