• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.10a
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• pp.355-359
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• 2001

In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel grinding ceramic materials. Normal component of grinding resistance of $AI_2O_3$ was less then that of $Si_3N_4$ and $ZrO_2$. It is because the resistance for grain shedding is less then that for layer formation. For the case of $Si_3N_4$ and $ZrO_2$, as the grain mesh number of wheel increases, the surface roughness decreases. For the case of $AI_2O_3$, the surface roughness does not decreases. For the case of $Si_3N_4$ and $ZrO_2$, grinding is carried out by abrasive wear processes. For the case of $AI_2O_3$, grinding is carried out by grain shedding process.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.2
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• pp.162-169
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• 1998

Lacking for the skilled grinding operator possessed of the experiential knowledges in machine shop, there is the just requirement which includes the establishment of the optimal grinding conditions. Accordingly, we attemt to develope the selection system of optimal grinding conditions such as workpiece velocity, depth of cut and wheel velocity and to add the trouble shooting system by means of the neural network. Those systems are robust to the each machine error and environmental unstable state. In addition. we produce the loaming process that is progressed with additional data modified by skilled operators, and excluding is advanced to similarity of input data.

• Journal of the Korean Ceramic Society
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• v.49 no.1
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• pp.90-94
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• 2012

This study has been focused on properties of mirror surface grinding technology by ELID(Electrolytic In-process Dressing) for metal matrix ceramic composites using in high precision mirror for optics. The experimental studies have been carried out to get mirror surface by grinding for composites, Al-SiC, Al-graphite and Mg-SiC. Grinding process is carried out with varying abrasive mesh type, depth of cut and feed rate using diamond wheel. The machining result of the surface roughness and condition of ground surface, have been analyzed by use of surface roughness tester and SEM measurement system. ELID grinding technology could be applied successfully for the mirror-surface manufacturing processes in spite of ductility of metal matrix material. As the results of experiments, surface roughness of Al-SiC(45 wt%) has been the most superior in these experimental work-pieces as 0.021 ${\mu}m$ Ra.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.2 no.2
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• pp.5-13
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• 2003

In this study, experiments of high speed grinding had been earned out in a STD11 specimen for evaluating the grindability with designed CBN grinding wheels Ground surfaces were analyzed and evaluated by means of surface Integrities and wheel damages. The surface roughness and 3 dimensional profile had been used for analyzing the micro-surface integrity. The residual stress of the ground surface had been measured by the x-ray diffraction method. Also, the surface state of the ground specimens and the grinding wheels were evaluated by a metallurgical microscope and SEM system after high speed grinding in order to choose the suitable machining conditions.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.5
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• pp.58-64
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some finding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipment with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6 nm in Ra.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.946-949
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• 2001

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some grinding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametral silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpiece are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipped with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6nm in Ra.

• International journal of advanced smart convergence
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• v.4 no.2
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• pp.84-93
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• 2015

This study is for the development of Cover Glass Grinding Processing System. This system is developed for manufacturing a mass product system grinding cover glasses with highly precise mechanism, and we improved resulted quality. In the development process, we developed a complete process technology through mechanical design, image processing technology, spindle control, mark identification algorithm etc. With this cover glass grinding development, we could developed process technology, image processing technology, organization mechanisms and control algorithms.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.6
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• pp.44-51
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• 1997

Crinding of stainless steel, aluminium alloy, copper alloy, and titanium alloy are difficult to obtain high quality finish, because they have the mechanical properties such as low hardness, high toughness. The low hardness and the high toughness result in the loading of wheel and the poor surface finish. In order to perform the grinding operations for these sorts of materials easily, the discontinuous grinding wheel wiht multi-porous grooves has been newly developed. The multi-porous grooves inthe discontinuous grinding wheel were formed during grinding wheel manufacturing process. In this paper, discontinuous grinding wheels having intermittent ratio 0.66, 0.81 and number of grooves 18,32 have been manufactured and grinding surface characteristics of these grinding wheels for SUS304 have been analyzed. Discontinuous grinding temperature according to intermittent ratiohas been also estimated by simulation. The discontinuous grinding wheels increase the grinding performance considerably. It is desirable to use the discontinuous grinding wheel in grinding the materials with high efficiency and accuracy.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.4 s.97
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• pp.148-154
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• 1999

This study was carried out to verify grinding performance of dental diamond bur and investigate the possibility of AE application in dentistry field. Workpieces were made of acryl and bovine respectively for the experiments in this study. Grinding test was conducted to get the data of grinding resistance and specific grinding energy of four different types of diamond bur by using tool dynamometer. AE signal was acquired to verify grinding process in the AE measuring system. Tool wear was observed to find parameters about grinding characteristics of diamond bur by means of SEM picture. It was found that the wear of dental diamond bur could be detected with polishing of grinding material, removal of adhesive parts, wear of particles neighboring cutting nose, loss of material and elevation of temperature. The wear of B, C, D type diamond bur is due to wear and fracture of grain size. Abnormal state can be found through the behavior of AE signal in the grinding working. As a result, it is expected that forecast of abnormal state is possible using AE equipments under real time process.

• 제어로봇시스템학회:학술대회논문집
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• 1993.10b
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• pp.302-306
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• 1993

In this study, a new model for flexible disk grinding process will be proposed. A grinding mechanism with a grinding disk attached to the rubber platen has been introduced. Since the spinning axis is fixed and only the disk is deflected with respect to this axis, earlier model is not adequate to represent this proces. A new dynamic process model includes an assumption that the disk is deflected locally around the middle of its radial span between the spinning axis and the disk tip instead of several continuous deflection points along the radial span of the disk. Detailed kinematic analysis is proposed as for the removed portion during the process. Cutting force comonent and depth of cut profile trend is compared with the measured result.