• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 춘계학술대회 논문집
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• pp.660-665
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of grinding wheel in the in-feed machining method. In this study, grinding experiments by the rotary surface grinding machine with straight type wheels ware conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding n/c equipment with an ELID wit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2 - 6 nm in Ra.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1911-1915
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• 2003

Today optical communication industry is developed; demand of optical communication part is increased. ZrO$_2$ ceramic ferrule is very significant part which determines transmission efficiency and quality of information in the optical communication part by connector of optical fibers. Being different from metal grinding, material removal through brittle fracture plays an important role in ZrO$_2$ ceramic grinding. Most of ZrO$_2$ ceramic ferrule processes are grinding which request high processing precision. Particularly, concentricity and cylindricity of inner and outer diameter are very important. The co-axle grinding process of ZrO$_2$ ceramic ferrule is to make its concentricity all of uniform before centerless grinding. Surface integrity of ZrO$_2$ ceramic ferrule is affected by grinding conditions, and equipment. In this study, surface integrity of workpiece according to such as a change of grinding wheel speed, feed rate, regulating wheel speed and grinding force is investigate to improve the concentricity and roundness of ZrO$_2$ ceramic ferrule from many experiments. Thus, if possible be finding highly efficient and quality grinding conditions.

• 한국정밀공학회지
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• 제30권12호
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• pp.1245-1251
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• 2013

This study has focused on development of ELID monitoring system and its application to ELID grinding of structural ceramics. ELID monitoring system was consisted of grinding equipment, ELID power supply, grinding wheel, electrode and monitoring program. It can give a real time data to check spindle grinding resistance, wheel revolution, dressing current and voltage in ELID grinding process. The performance of developed system was evaluated by applying to grinding of structural ceramics, silicon carbide and alumina. As the results of experiments, monitored data for spindle resistance and ELID dressing current was useful to check steady-state ELID grinding process. From the comparison of spindle resistance between ELID grinding and conventional grinding process according to change of depth of cut, it could be confirmed that the spindle resistance in ELID grinding was lower than conventional grinding process.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.980-986
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive, the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, Ist, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the effect of the wheel path density and relative velocity on the characteristic of ground wafer in in-feed grinding with cup-wheel. It seems that the variation of the parameters in radial direction of wafer results in the non-uniform surface quality over the wafer. So, in this paper, the geometric analysis on grinding process is carried out, and then, the effect of the parameters on wafer surface quality is evaluated

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.98-101
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

• 한국세라믹학회지
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• 제56권2호
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• pp.153-159
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• 2019

In this study, fly ash of a fluidized bed boiler produced in a power plant was stabilized by hydration and carbonation reaction. Then, each raw material was pulverized by two kinds of grinding equipment (Planetary mills and pot mills); the degree of grinding and the agglomeration behavior were observed. It was found that there were changes of specific surface area and particle size distribution according to grinding time. The surface of the raw material was observed using an optical microscope. As a result, agglomerates of about 75 ㎛ or more due to electrostatic phenomenon were formed as the grinding time became longer; it was confirmed that the crushing efficiency slightly increased with use of antistatic agent.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.188-190
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• 2005

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1289-1293
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• 2005

We will improve tools performance without the change of a tools' physical shape, if we process mirror like finishing on the surface of cutting tools. Because cutting tools' shapes are very complex, the general method of polishing can't be polished. So we will apply new method of polishing which is magnetic fluid grinding technique. Magnetic fluid grinding technique can polish complex shape's workpiece by pressing the surface of workpiece with magnetic and abrasive grains in magnetic field. Therefore we developed the polishing equipment to improve the performance of cutting tools and experimented on various polishing conditions to determine the polishing conditions of cutting tools.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.1092-1098
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• 2004

Today the demand of the optical communication components has been increased. Zirconia Ferrule has become the one of the most important elements because it determines transmission efficiency and quality of information in the optical communication system. Grinding is the major process in the ferrule manufacturing process which require high processing precision. In this reseach, specially designed spindle, chucking system, loading & unloading system and cooling system, as a supporting experimental equipment for development of an Intelligent Coaxial Grinding System (ICGS) for Zirconia Ferrule processing, is developed. We are also analized the adaptability of ICGS in practical use, through the way of evaluation for the performance of the each systems above.

• 한국건설관리학회:학술대회논문집
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• 한국건설관리학회 2007년도 정기학술발표대회 논문집
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• pp.983-986
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• 2007

콘크리트 표면절삭 작업은 콘크리트 표면의 평탄성 및 부착성을 필요로 하는 공사에서 빈번히 사용되고 있으나 작업형태가 노동집약적이며, 유해한 작업환경을 보유하고 있다. 또한 장비를 다루는 기능공의 숙련도에 따라 생산성 및 절삭품질의 편차가 큰 경향이 있다. 그러므로 주변 환경오염 방지와 장비 조종자가 위험에 노출되지 않도록 하기 위한 원격조종 콘크리트 표면절삭 장비 개발이 요구된다. 그러나 원격 조종 시스템에서 조종자가 절삭면의 품질을 측정하기 난해하고 품질에 대한 객관적인 판단을 내리기가 어려우므로, 본 연구에서는 머신비젼시스템(Machine Vision System)을 적용하여 네트워크 카메라로 촬영한 절삭면의 이미지를 디지털 영상처리(Image Processing)과정을 거쳐 그 결과를 그래픽 MMI(Man-Machine Interface) 프로그램에 표현함으로써 품질관리 시스템을 구축하였다. 머신비전 알고리즘은 콘크리트 절삭면의 디지털 영상처리 알고리즘을 의미하며 본 논문에서 제안된 알고리즘을 적용하여 콘크리트 절삭면의 객관적인 품질관리 기준을 제시하고자 한다.