• 한국재료학회지
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• 제27권2호
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• pp.69-75
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• 2017

To establish low-temperature process conditions, process-property correlation has been investigated for Ga-doped ZnO (GZO) thin films deposited by pulsed DC magnetron sputtering. Thickness of GZO films and deposition temperature were varied from 50 to 500 nm and from room temperature to $250^{\circ}C$, respectively. Electrical properties of the GZO films initially improved with increase of temperature to $150^{\circ}C$, but deteriorated subsequently with further increase of the temperature. At lower temperatures, the electrical properties improved with increasing thickness; however, at higher temperatures, increasing thickness resulted in deteriorated electrical properties. Such changes in electrical properties were correlated to the microstructural evolution, which is dependent on the deposition temperature and the film thickness. While the GZO films had c-axis preferred orientation due to preferred nucleation, structural disordering with increasing deposition temperature and film thickness promoted grain growth with a-axis orientation. Consequently, it was possible to obtain a good electrical property at relatively low deposition temperature with small thickness.

• 한국재료학회지
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• 제4권5호
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• pp.535-540
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• 1994

Thin film magnet was fabricated by radio frequency magnetron sputtering using $Nd_13/(Fe.Co)_{70}B_{17}$ alloy target and magnetic properties were investigated according to sputtering conditions from the metallurgical point of view. we could obtain the best preferred orientation of $Nd_2Fe_{14}B$ phase at substrate temperatures between $450^{\circ}C$ and $460^{\circ}C$ with the input power 150W, and thin films had the anisotropic magnetic properties. But, as the thickness of thin film increased, the c-axis orientation gradually tended to be disordered and magnetic properties also become isotropic. Just like Nd-Fe-B meltspun ribbon, the microstructure of thin film magnet was consisted of very find cell shaped $Nd_2Fe_{14}B$ phase and the second phase along grain boundary. While, domain structure showed maze patterns whose magnetic easy axis was was perpendicular to film plane of thin film. It was concluded from these results that the perpendicualr anisotropy in magnetization was attributed to the perpendicular alignment of very find $Nd_2Fe_{14}B$ grains in thin film.

• 전기화학회지
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• 제5권2호
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• pp.57-61
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• 2002

본 연구에서는 염화암모늄을 함유한 전해질에서 CoP 자성합금 박막을 전기도금 방식으로 제조하고 염화암모늄의 첨가량이 다른 용액에서의 CV 등 전기화학적인 분석을 통해 핵생성과 결정화(electrocrystallization)에 미치는 영향을 고찰하여 자기적 성질과의 상호관계를 밝히고자 하였다. 용액 중에 첨가된 염화암모늄은 첨가량이 많을수록 분극도를 감소시키고, charge transfer에 의해 electrocrystallization과정을 속도론적으로 제어함으로써 결정립의 크기가 커지고 orientation factor가 증가된다. 이러한 구조적, 결정학적 변화가 CoP 도금층의 자기적 성질을 변화시킴을 관찰하였다.

• 열처리공학회지
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• 제24권5호
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• pp.251-261
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• 2011

The changes in microstructure and texture during annealing were examined in a series of 0.015% C-1.5% Mn cold-rolled sheet steels with 0~0.5% Mo. Orientation distribution function data were calculated from the (110), (200), (211) pole figures determined on the rolled plane of cold-rolled and annealed steel sheets. Regardless of Mo content and annealing conditions, martensite volume fraction was less than 1.0%, not affecting the texture evolution. Textural change at the cooling stage after heating at $820^{\circ}C$ for 67 sec was not observed. Increasing the Mo content and annealing temperature markedly strengthened the intensities of ${\gamma}$-fiber texture, resulting in the increase in $r_m$ value. The desirable texture evolution for deep drawability in the 0.5% Mo steel may be mainly caused by the grain refining effect of Mo carbide in the hot-rolled steel sheet.

• Journal of Welding and Joining
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• 제20권5호
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• pp.93-98
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• 2002

The effect of bonding misfit on single crystallization of transient liquid phase (TLP) bonded joints of single crystal superalloy CMSX-2 was investigated using MBF-80 insert metal. The bonding misfit was defined by (100) twist angle (rotating angle) at bonded interface. TLP bonding of specimens was carried out at 1523K for 1.8ks in vacuum. The post-bond heat treatment consisted of the solution and sequential two step aging treatment was conducted in the Ar atmosphere. The crystallographic orientation analysis across the TLP bonded joints was conducted three dimensionally using the electron back scattering pattern (EBSP) method. EBSP analyses f3r the bonded and post bonded heat treated specimens were conducted. All bonded joints had misorientation centering around the bonded interface for as-bonded and post-bond heat treated specimens with rotating angle. The average misorientation angle between both solid phases in bonded interlayer was almost identical to the rotating angle at bonded interface. HRTEM observation revealed that the atom arrangement of both solid phases in bonded interlayer was quite different across the bonded interface. It followed that grain boundary was formed in bonded interface. It was confirmed that epitaxial growth of the solid phase occurred from the base metal substrates during TLP bonding and single crystallization could not be achieved in joints with rotating angle.

• 한국주조공학회지
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• 제14권1호
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• pp.28-34
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• 1994

Metallurgical-grade polycrystalline silicon was directionally solidified at growth rates of $0.2{\sim}1.0mm/min$ by using split type, reusable graphite molds which were coated with $Si_3N_4$ powder. The resultant grain sizes of the silicon ingots and the shapes of the solid/liquid(S/L) interfaces were investigated. X-ray diffraction was used to determine the preferred orientation in each of the silicon ingots. The impurity content of the silicon was analyzed and the resistivities of the ingots were measured. During the growth of an ingot, the shape of the S/L interface was concave to the silicon melt, and the resistivity decreased. The presence of Al which can be acting as a carrier, is thought to be the main factor causing such a decrease in resistivity. When a growth rate of 0.2㎜/min was used, the preferred orientation was found to be (111).

• 한국재료학회지
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• 제9권6호
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• pp.589-594
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• 1999

The effect of $\beta$-heat treatment on th microstructure, mechanical properties and texture in the nuclear fuel cladding of Zircaloy-4 tubes was chosen at 1000, 1100 and 120$0^{\circ}C$, and the tubes were heat-treated by a high frequency vacuum induction furnace. Morphology of the second phase particles and $\alpha$-grain of as-received tubes were markedly changed by heat treatment. The average sizes of second phase particles of as-received and $\beta$-heat treated tubes were 0.1$\mu\textrm{m}$ and 0.076$\mu\textrm{m}$, respectively. However, the average sizes of second phase particles were not much changed in the $\beta$-heated temperatures. With increasing heat treatment temperatures, the 0.2% yield strength and the hoop strength were decreased because of changes in preferred orientation as will as $\alpha$-plate width. Heat treated Zircaloy-4 tubes exhibited texture changes but the preferred orientation of grains still remained.

• 한국세라믹학회지
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• 제38권10호
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• pp.942-947
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• 2001

MEMS 소자에의 응용을 위한 PZT(52/48) 박막을 diol을 용매로한 솔젤법에 의해 제조하였으며 미세구조에 따른 전기적 특성 및 압전 특성 관계를 고찰하였다. 0.5 mol 의 sol을 제작하여 1회 코팅시 $0.2{\mu}m$ 두께를 갖는 균열 없는 박막을 얻을 수 있었으며 $0.2{\mu}m$에서 $3.8{\mu}m$의 두께의 막을 증착하였다. 미세구조사진으로부터 층간 porous한 영역이 관찰되지 않음과 제2상의 성장이 없는 치밀한 columnar입자 성장을 확인 할 수 있었으며 균열없는 치밀화된 입자의 성장으로부터 우수한 이력곡선을 얻을 수 있었다. XRD분석으로부터 우선 배향성을 알아본 결과 (111)우선 배향성이 $1{\mu}m$ 영역까지 우세하다가 $1{\mu}m$이상의 두께에서 점차 random하게 바뀌는 것을 확인할 수 있었으며, 유전 특성 및 압전특성의 경향도 이와 유사하게 $1{\mu}m$ 영역까지 증가하다가 그 이상의 두께에서는 수렴하여 각각 1400, 300 pC/N 정도의 우수한 값을 가졌다.

• 한국세라믹학회지
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• 제39권12호
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• pp.1128-1132
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• 2002

MFS-FET(Metal-Ferroelectric-Semiconductor Field Effect Transistor) 구조의 비휘발성 기억소자용 $ReMnO_3$(Re:Y, Ho, Er) 박막을 금속 유기 화학 기상 증착법(MOCVD)으로 증착하였다. $ReMnO_3$ 박막을 Si(100) 기판 위에 700${\circ}C$-2시간 증착 시켜 결정화를 위해 대기 중에서 900${\circ}C$-1시간 열처리 시 육방정계(hexagonal) 단일상의 $ReMnO_3$ 박막을 형성하였다. 육방정계 단일상 구조에서 $ReMnO_3$ 박막의 강유전 특성은 c-축 배향성에 의존하였으며, c-축 배향성이 우수한 $YMnO_3$ 박막의 잔류 분극(Pr) 값은 105 nC/$cm^2$로 가장 우수하였다. 또한 누설 전류 밀도(leakage current density) 값은 미세구조의 결정립 크기에 의존하였으며, 결정립 크기가 100∼150 nm인 $YMnO_3$ 박막의 누설 전류 밀도 값은 인가전압 0.5 V에서 $10^{-8}$ A/$cm^2$을 나타내었다.

• The Korean Journal of Ceramics
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• 제6권2호
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• pp.110-115
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• 2000

$SrBi_2Ta_2O_9$ thin films were deposited at room temperature on the usual (111) oriented Pt bottom electrodes using r.f. magnetron sputtering, and then post-annealed at 650-$800^{\circ}C$ for 30min in oxygen flow. Low temperature processing which shows the preferred oriented SBT thin films was obtained by controlling the sputtering pressure and/or Sr content in target. The orientation and grain growth behavior of SBT thin films were dependent on Sr contents in films. With increasing the excess Bi content up to 50% in SBT thin films, it was possible to lower the onset temperature of grain growth. The c-axis preferred oriented SBT thin films were well-grown under the condition of low post-annealing($650^{\circ}C$) by lowering post-annealing pressure. After $10^{11}$ switching cycles, no polarization degradation was observed in both preferred oriented SBT capacitors.