• Korean Journal of Materials Research
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• v.24 no.2
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• pp.105-110
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• 2014

The aim of this work was to investigate the effects of electrodeposition conditions on the microstructural characteristics of copper thin films. The microstructure of electroplated Cu films was found to be highly dependent on electrodeposition conditions such as system current and current density, as well as the bath solution itself. The current density significantly changed the preferred orientation of electroplated Cu films in a DC system, while the solution itself had very significant effects on microstructural characteristics in a pulse-reverse pulse current system. In the DC system, polarization at high current above 30 mA, changed the preferred orientation of Cu films from (220) to (111). However, Cu films showed (220) preferred orientation for all ranges of current density in the pulse-reverse pulse current system. The grain size decreased with increasing current density in the DC system while it remained relatively constant in the pulse-reverse pulse current system. The sheet resistance increased with increasing current density in the DC system due to the decreased grain size.

• Journal of Ocean Engineering and Technology
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• v.31 no.3
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• pp.241-247
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• 2017

Plywood, which is created by bonding an odd number of thin veneers perpendicular to the grain orientation of an adjacent layer, was developed to supplement the weak points such as contraction and expansion of conventional wood materials. With structural merits such as strength, durability, and good absorption against impact loads, plywood has been adopted as a structural material in the insulation system of a membrane type liquefied natural gas (LNG) carrier. In the present study, as an attempt to resolve recent failure problems with plywood in an LNG insulation system, conventional PF (phenolic-formaldehyde) resin plywood and its alternative MUF (melamine-urea-formaldehyde) resin bonded plywood were investigated by performing material bending tests at ambient ($20^{\circ}C$) and cryogenic ($-163^{\circ}C$) temperatures to understand the resin and grain effects on the mechanical behavior of the plywood. In addition, the failure characteristics of the plywood were investigated with regard to the grain orientation and testing temperature.

• Korean Journal of Materials Research
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• v.26 no.12
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• pp.688-695
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• 2016

Recrystallization behavior has been investigated for commercial purity AA1050 (99.5wt%Al) and high purity 3N Al (99.9wt% Al). Samples were cold rolled with 90% of thickness reduction and were annealed isothermally at 290, 315, and 350o C for various times until complete recrystallization was achieved. Hardness measurement and Electron Backscatter Diffraction(EBSD) analyses, combined with Grain Orientation Spread(GOS), were employed to investigate the recrystallization behavior. EBSD analysis combined with GOS were distinctly revealed to be a more useful method to determine the recrystallization fraction and to characterize the recrystallization kinetics. As the annealing temperature increased, recrystallization in AA1050 accelerated more than that process did in Al 3N. Both AA1050 and Al 3N showed the same temperature dependence of the n value of the Johnson-Mehl-Avrami-Kolmogorov equation(JMAK equation), i.e., n values increased as annealing temperature increased. Activation energy of recrystallization in AA1050 is about 176 kJ/mol, which is comparable with the activation energy of grain boundary migration in cold-rolled AA1050. This value is somewhat higher than the activation energy of recrystallization in Al 3N.

• Journal of the Korean Society for Nondestructive Testing
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• v.28 no.3
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• pp.245-253
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• 2008

A precise description of the material is a key point to obtain reliable results when using wave propagation codes. In the case of multipass welds, the material is very difficult to describe due to its anisotropic and heterogeneous properties. Two main advances are presented in the following. The first advance is a model which describes the anisotropy resulting from the metal solidification and thus the model reproduces an anisotropy that is correlated with the grain orientation. The model is called MINA for modelling anisotropy from Notebook of Arc welding. With this kind of material model1ing a good description of the behaviour of the wave propagation is obtained, such as beam deviation or even beam division. But another advance is also necessary to have a good amplitude prediction: a good quantification of the attenuation, particularly due to grain scattering, is also required as far as attenuation exhibits a strong anisotropic behaviour too. Measurement of attenuation is difficult to achieve in anisotropic materials. An experimental approach has been based both on the decomposition of experimental beams into plane waves angular spectra and on the propagation modelling through the anisotropic material via transmission coefficients computed in generally triclinic case. Various examples of results are showed and also some prospects to continue refining numerical simulation of wave propagation.

• Journal of the Korean Ceramic Society
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• v.36 no.9
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• pp.937-945
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• 1999

In an effort to protect a RBSC(reaction -bonded SiC) tube SiC films from methyltrichlorosilane(MTS) by low pressure chemical vapor deposition were deposited in hydrogen atmosphere on the RBSC(reaction-bonded SiC) substrates over a range of input gas ratio(${\alpha}=P_{H2}/P_{MTS}=Q_{H2}/Q_{MTS}$=1 to 10) and deposition temperatures(T=1050~1300$^{\circ}C$). At the temper-ature of 1250$^{\circ}C$ the growth rate of SiC films increased and then decreased with decreasing the input gas ratio. The microstructure of SiC films was changed from granular type structure exhibiting (111) preferred orientation in the high input gas ratios to faceted columnar grain structure showing (220) in the low input gas ratios. The similar microstructure change was obtained by increasing the deposition temperature. These results were closely related to a change of deposition mechanism. Double layer structure having granular type and faceted ciolumnar grain structure from the manipulation of mechanism. Double layer structure having granular type and faceted columnar grain structure from the manipulation of the input gas ratio without changing the deposition temperatue was successfully fabricated through in -site process.

• Journal of the Korean Magnetics Society
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• v.7 no.4
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• pp.205-211
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• 1997

The magnetic properties change which was induced by addition of small amount of Ni into Cr underlayer in CoCrTa/ CrNi thin film deposited by electron beam evaporator was investigated. The additional Ni element was found to be beneficial for incease in the coercivity of the thin film deposited at the room temperature. The origin of coercivity increase was elucidated by crystal orientation and microstructure investigation using XRD and AFM respectively. It was found that the grain size were increased by Ni addition. The coercivity of the film with CrNi underlayer is lower than that of film with Cr underlayer when prepared with higher substrate temperature. This result may be originated with the increase in grain size. When film was deposited at 280 $^{\circ}C$ substrate temperature, Cr segregation in grain boundary is found to be the other factor for determining coercivity value.

• Korean Journal of Metals and Materials
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• v.49 no.1
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• pp.58-63
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• 2011

The grain size and growth direction of a directionally solidified turbine blade were evaluated by the initial nucleation condition at the start block of directional solidification. The initial nucleation condition was controlled by inserting a Ni foil on the directional solidification plate of the directional solidification furnace. Fine grains with good orientation were obtained in the faster cooling condition at the start block. The nucleus number was compared with the cooling rate of the start block by electron back scattered diffraction (EBSD). DSC (differential scanning calorimeter) analysis was performed to compare the melting point and undercooling for nucleation of the coarse nuclei and fine nuclei of the start block. The faster cooling condition at the start block showed more undercooling for nucleation and smaller size of nuclei which resulted in a fine grain with good orientation in the directional turbine blade.

• Korean Journal of Materials Research
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• v.16 no.6
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• pp.360-366
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• 2006

A series of ZnO thin films were grown by radio-frequency (RF) magnetron sputtering with various RF powers on $SiO_2/Si$(100) substrates at $500^{\circ}C$. Thicknesses of the investigated ZnO films were fixed to about 250nm by changing the growth time based on the changes of growth rates with RF powers. All the ZnO thin films were grown with <0001> preferred orientation. Average grain sizes of about 250nm-thick ZnO films evaluated by FE-SEM, AFM, and TEM were increased by decreasing the RF power. Structural properties addressed by FWHM values of XRD (0002) omega rocking curves and their intensities were better for the smaller grain sized ZnO films grown with high RF powers, which implies small values of tilt for smaller grain sized ZnO films. However, optical properties addressed by intensities of band edge emissions from room temperature and low temperature photoluminescence were better for the larger grain sized ZnO films with low RF power, which implies grain boundaries acted as nonradiation recombination centers.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.142-142
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• 2011

Epitaxial $CuCrO_2$ thin films have been grown on single crystal substrate of c-plane $Al_2O_3$, $SrTiO_3$, YSZ and Quarts by laser ablation of a $CuCrO_2$ target using 266nm radiation from a Nd:YAG laser. X-ray measurements indicate that the $CuCrO_2$ grows epitaxially on all substrate, with its orientation dependent on the kinds of substrates. Most of the layer were polycrystalline with (001), (015) and random as the dominant surface orientation on c-plane YSZ, $SrTiO_3$ and quarts substrate, respectively. (001) orientated $CuCrO_2$ grows on C-plane $Al_2O_3$ and YSZ substrate, (015) orientated $CuCrO_2$ films are found on c-plane $SrTiO_3$ substrate and random orientated $CuCrO_2$ films grows on quarts substrate. These data are compared with the in-plane orientation and the mismatch of the $CuCrO_2$ and each substrate lattices in an attempt to relate the preferred orientation to the plane of the sapphire on which it is grown. Further characterization show that the grain size of the films increases for a substrate temperature increase, whereas the electrical properties of $CuCrO_2$ thin films depend upon their crystalline orientation.

• Transactions of Materials Processing
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• v.27 no.6
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• pp.347-355
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• 2018

This study investigated the effects of the processing number of multi-axial diagonal forging (MADF) on the microstructural changes of OFC fabricated by MADF processes. The as-extruded OFC was cut to $25mm^3$ cube for the MADF processes. The MADF process consists of plane forging with a thickness reduction of 30% and diagonal forging with a diagonal forging angle of $135^{\circ}$. In order to analyze the microstructural evolutions according to the number of repetitions, 1, 2, 3 and 4 cycles of the MADF process were performed. OFC specimens were successfully deformed without surface cracking for up to 4 cycles of MADF. The grain size, average misorientation and average grain orientation spread (GOS) of MADF processed materials were analyzed using EBSD technique and their Vicker's hardness were also measured. The results showed that MADF process effectively refined the microstructure of OFC with initial average grain size of $84.2{\mu}m$. The average grain sizes of specimens MADF processed for 1, 2, 3, 4 cycles were refined to be $8.5{\mu}m$, $2.2{\mu}m$, $1.5{\mu}m$, $1.1{\mu}m$, respectively. The grain refinement seemed to be saturated when OFC was MADF processed over 2 cycles. In the case of specimens subjected to two or more cycles of MADF, the degree of decrease in average grain size was drastically reduced as the number of cycles increased due to softening phenomena such as dynamic recovery or dynamic recrystallization during processing. The degree of increase in average Vicker's hardness was also dramatically reduced as the number of cycles increased due to the same reason.