• Korean Journal of Materials Research
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• v.27 no.3
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• pp.172-178
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• 2017

The aim of this study is to consider the effect hydrogen on dezincification behavior of Cu-Zn alloys. The investigations include microstructural observations with scanning electron microscope and chemical composition analysis with energy dispersive spectrometer. The dezincification layer was found to occur in high pressure hydrogen atmosphere, not in air atmosphere. In addition, the layers penetrated into the inner side along the grain boundaries in the case of hydrogen condition. The shape of the dezincification layers was porous because of Zn dissolution from the ${\alpha}$ or ${\beta}$ phase. In the case of stress corrosion cracks formed in the Cu-Zn microstructure, the dezincification phenomenon with porous voids was also accompanied by grain boundary cracking.

• Journal of the Korean Vacuum Society
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• v.9 no.3
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• pp.267-272
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• 2000

Electroplating Cu was deposited on Si(100) wafer after seed Cu was deposited by sputtering first. TaN was deposited as a diffusion barrier before depositing the seed Cu. Electroplating Cu thin films show highly (111)-oriented microstructure for both before and after annealing at $450^{\circ}C$ for 30min and no copper silicide was detected in the same samples, which indicates that TaN barrier layer blocks well the Cu diffusion into silicon substrate. After annealing the electroplating Cu film up to $450^{\circ}C$, the Cu film became columnar from non-columnar, its grain size became larger about two times, and also defects density of stacking faults, twins and dislocations decreased greatly. Thus the heat treatment will improve significantly electromigration property caused by the grain boundary in the Cu thin films.

• Solar Energy
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• v.17 no.4
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• pp.3-11
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• 1997

Because grain boundaries in polycrystalline silicon act as potential barriers and recombination centers for the photo-generated charge carriers, these defects degrade conversion effiency of solar cell. To reduce these effects of grain boundaries, we investigated various influencing factors such as thermal treatment, various grid pattern, selective wet etching for grain boundaries, buried contact metallization along grain boundaries, grid on metallic thin film. Pretreatment above $900^{\circ}C$ in $N_2$ atmosphere, gettering by $POCl_3$ and Al treatment for back surface field contributed to obtain a high quality poly-Si. To prevent carrier losses at the grain boundaries, we carried out surface treatment using Schimmel etchant. This etchant delineated grain boundaries of $10{\mu}m$ depth as well as surface texturing effect. A metal AI diffusion into grain boundaries on rear side reduced back surface recombination effects at grain boundaries. A combination of fine grid with finger spacing of 0.4mm and buried electrode along grain boundaries improved short circuit current density of solar cell. A ultra-thin Chromium layer of 20nm with transmittance of 80% reduced series resistance. This paper focused on the grain boundary effect for terrestrial applications of solar cells with low cost, large area, and high efficiency.

• Journal of the Korean Ceramic Society
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• v.28 no.3
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• pp.215-224
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• 1991

The synthesis of SrTiO3 powders having high purity and homogeneous submicron particle size was attempted by the oxalate method. The microstructure and dielectric properties of SrTiO3 based boundary layer capacitor (BLC) were investigated. Strontium titanyl oxalate[SrTiO(C2O4)2.4H2O] was prepared from the mixing solution of (Sr, Ti) using oxalic acid(H2C2O4) as a precipitating agent at 8$0^{\circ}C$. The crystalline SrTiO3 powder was obtained by thermal decomposition of the precipitate above $600^{\circ}C$. The crystalline SrTiO3 powder containing Nb2O5 as a dopant, TiO2 and SiO2 as additives was sintered at 1360~144$0^{\circ}C$ in the reducing atmosphere to get semiconductive SrTiO3. Insulating material containing PbO-Bi2O3-B2O3 frit was printed on the sintered semiconductive SrTiO3 and fired at 120$0^{\circ}C$ for 2h to get the grain boundary diffusion.

• Transactions of the Korean Society of Mechanical Engineers
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• v.13 no.2
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• pp.236-242
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• 1989

In order to investigate the effects of hot corrosion on the creep rupture properties and creep life of 304 stainless steel being used as tube materials of heavy oil fired boiler, the creep rupture tests were carried out at temperature 630.deg.C, 690.deg.C and 750.deg.C in static air for the specimens with or without coating of double layer corrosives according to the new hot corrosion test method simulating the situation commonly observed on superheater tubes of the actual boiler. The double layer corrosives are 85% V$_{2}$O$_{5}$ + 10% Na$_{2}$So$_{4}$ + 5% Fe$_{2}$O$_{3}$ as the inner layer corrosive being once melted at 900.deg. C and crushed to powder, and 10% V$_{2}$O$_{5}$ + 85% Na$_{2}$SO$_{4}$ +5% Fe$_{2}$O$_{3}$ as the outer layer corrosive. As results, in the specimen coated with the double layer corrosives, the rupture strength was extremely lowered and showed a large difference each other. The rupture ductility also lowered remarkably as a result of the brittle fracture mode due to hot corrosion. These results indicate that hot corrosion could essentially alter the creep fracture mechanism. From the metallographic observation, it was clarified that the rupture life of 304 stainless steel subjected to hot corrosion was chiefly determined by the behavior of the aggressive intergranular penetration of sulfides.des.

• Korean Journal of Metals and Materials
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• v.50 no.9
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• pp.659-667
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• 2012

Alloy 617 is a Ni-base superalloy and a candidate material for the intermediate heat exchanger (IHX) of a very high temperature gas reactor (VHTR) which is one of the next generation nuclear reactors under development. The high operating temperature of VHTR enables various applications such as mass production of hydrogen with high energy efficiency. Alloy 617 has good creep resistance and phase stability at high temperatures in an air environment. However, it was reported that the mechanical properties decreased at a high temperature in an impure helium environment. In this study, high-temperature corrosion tests were carried out at $850^{\circ}C-950^{\circ}C$ in a helium environment containing the impurity gases $H_2$, CO, and $CH_4$, in order to examine the corrosion behavior of Alloy 617. Until 250 h, Alloy 617 specimens showed a parabolic oxidation behavior at all temperatures. The activation energy for oxidation in helium environment was 154 kJ/mol. The SEM and EDS results elucidated a Cr-rich surface oxide layer, Al-rich internal oxides and depletion of grain boundary carbides. The thickness and depths of degraded layers also showed a parabolic relationship with time. A normal grain growth was observed in the Cr-rich surface oxide layer. When corrosion tests were conducted in a pure helium environment, the oxidation was suppressed drastically. It was elucidated that minor impurity gases in the helium would have detrimental effects on the high-temperature corrosion behavior of Alloy 617 for the VHTR application.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1387-1389
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• 2001

In this paper, the microstructure and the dielectric properties of the $Sr_{1-x}Ca_xTiO_3$($0{\leq}x{\leq}0.2$)-based grain boundary layer ceramics were investigated. The 2nd phase formed by thermal diffusing from the surface lead to a very high apparent dielectric constant, ${\varepsilon}_r$ > 50000, and tan$\delta$ < 0.05, $\Delta$C < ${\pm}$ 10%.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1384-1386
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• 2001

In this paper, the structural and electrical properties of the $Sr_{1-x}Ca_xTiO_3$($0{\leq}x{\leq}0.2$)-based grain boundary layer ceramics were investigated by X-ray, SEM and V-I system. Increasing content of Ca, the average gram size and the lattice constant were decreased. The relative density of all specimens was > 96%. The 2nd phase formed by thermal diffusing from the surface lead to a very excellent electrical properties, that is, ${\varepsilon}_r$ > 50000, tan${\delta}$ < 0.05, $\Delta$C < ${\pm}$ 10%.

• Laser Solutions
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• v.2 no.1
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• pp.16-21
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• 1999

The surface of Alloy 600 was alloyed using a continuous wave $CO_2$ laser beam in order to improve its corrosion resistance. Laser surface alloying (LSA) was done by melting the surface electroplated with Cr of the alloy. The Cr concentration of the alloyed surface was 28-30 at.%, which is similar to that of Alloy 690. Alloying elements in the alloyed layer was observed to be distributed very homogeneously all over the alloyed region. According to the electrochemical and modified Huey tests, the corrosion resistance, in particular the grain boundary corrosion resistance, of the LSA specimens was significantly improved, compared with that of the as-received(AR) specimen. This improved corrosion resistance of the alloyed specimen might be attributed to the high Cr content which could make possible formation of more stable and dense passive film onto its surface.

• Journal of the Korean institute of surface engineering
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• v.24 no.4
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• pp.187-195
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• 1991

Adhesion strength of electroless-plated Ni, Ni-P and Cu deposites on alumina substrate has been studied. Grain boundary spaces produced on the substrate surface by etching treatment provided anchoring sites for enhancing the adhesion strength. Adhesion strengths of Ni-P and Ni deposit were higher than that of Cu deposit, because of higher initial nucleation rates than the latter. The electroless-plated Ni-P and Ni underlayer improved the adhesion strength of the Cu deposit. In could be attributed to the enhanced adhesion between the substrate and those underlayers as well as the satisfactory adhesion between Cu deposits and those underlayers. Heat treatment was also conducted in order to enhance the adhesion strength of Cu layer. The strength was enhanced by about 19% when the treatment was conducted at $150^{\circ}C$ for 2 hours. The enhancement was attributed to relief of internal stress and release of hydrogen.