• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1025-1029
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• 2003

We studied the cross-sectional profiles of deformed thermoplastics in hot embossing process and compared with melt flow index for various embossing conditions such as embossing temperature, embossing pressure and initial thickness of the thermoplastics. The fastest embossing times for complete penetration of the cavities were obtained at temperature greater than $60^{\circ}C$ above glass transition temperature (Tg). When the melt flow index of polymer is low, the penetration ratio does not become large even if the embossing pressure increases. The complete occupation of the cavities was easier obtained with high melt flow index polymer than low melt flow index polymer at the same process condition. We believe these results can be very useful for optimizing nanostructured hot embossing also known nanoimprinting process conditions.

• Textile Coloration and Finishing
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• v.3 no.3
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• pp.23-28
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• 1991

Poly(1, 4-cyclohexanedimethylene/ethylene terephthalate), PCET was prepared by condensing 1, 4-cyclohexanedimethanol(CHDM) and ethylene glycol with dimethylterephthalate(DMT), and some thermal properties of PCET were studied by DSC at a heating rate $20^{\circ}C$min. On increasing the CHDM content in PCET up to 20 mole%/DMT, the glass transition temperature(Tg) decreased a little and the crystallizability reduced sharply, and from 20 to 50 mole %/DMT the $T_g$ did not changed and the crystallization temperature was not detected. But on increasing the CHDM content above 70 mole %/DMT the TEX>$T_g$/ and the melting temperature increased.

• Elastomers and Composites
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• v.33 no.1
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• pp.10-16
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• 1998

In DGEBA/DDM system, the curing specimen are many curing factors which can affect on thermal and mechanical properties. This study was performed to prove the effect on curing specimen prepared by changing of the curing factors which are curing time and temperature of DGEBA/DDM system. As a result on thermal and mechanical properties, flexural strength, modulus and glass transition temperature (Tg) were increased with curing time and temperature were increased. It was found that the optimum curing condition of DGEBA/DDM system cure at $150^{\circ}C$ for 3hrs at equivalent ratio of 1/1.

• Fibers and Polymers
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• v.1 no.2
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• pp.83-91
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• 2000

Thermotropic liquid crystalline polymer made up of poly(p-hydroxybenzoate) (PHB)-poly(ethylene terephthalate)(PET) 8/2 copolyester, poly(ethylene 2,6-naphthalate) (PEN) and PET were mechanically blended to pursue the liquid crystalline phase of ternary blends. Complex viscosities of blends decreased with increasing temperature and PHB content. DSC thermal analysis indicated that glass transition temperature (Tg) and melting temperature (Tm) of blends increased with increasing PHB content. Both tensile strength and initial modulus increased with raising PHB content and take-up speed of monofilaments. In the WAXS diagram, only PEN crystal reflection at 2Θ=$15.5^{\circ}C$ appeared but PET crystal reflection was not shown in all compositions. The degree of transesterification and randomness of blends increased with blending time but sequential length of both PEN and PET segment decreased.

• Journal of the Korea Institute of Military Science and Technology
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• v.7 no.2 s.17
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• pp.109-117
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• 2004

We synthesized energetic prepolymer(2-nitrato ethyl oxirane, NEO) for plastic-bonded explosive and measured its thermodynamic parameters. 2-Nitrato ethyl oxirane(NEO) as a monomer was synthesized from 4-butene-ol, the first-step was preparation of 1-nitrate-3-butene and second-step was synthesized 2-nitrate-ethyl oxirane from 1nitrate-3-butene and then polymerized by cationic ring opening polymerization. The unreacted monomer concentration was measured by GC. The thermodynamic parameters were obtained from the ceiling temperature(Tc) values of 1 mole monomer at each reaction temperature. We varied feed rate of monomer, concentration of initiator and monomer to control molecular weight and polydispersity of perpolymer(NEO). Number average molecular weight(Mn), polydispersity(PD), and glass transition temperature(Tg), viscosity of prepolymer(NEO) were 2000, 1.07, $-55^{\circ}C$ and 300 poise respectively.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1436-1438
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• 2003

In this paper thermal and mechanical properties of elastic epoxy for applying high voltage products were investigated. Glass transition temperature(Tg) of elastic epoxies can't find form room temperature to $200^{\circ}$ by DSC. It occurred weight reduce on $285^{\circ}$ and $451^{\circ}$ by thermo-gravimeter. The first temperature was effected on addictives and the other was epoxy's character. Max, tensile strain showed $28.3kgf/cm^2$ at 20% of mechanical stress in addictives 35phr. SEM micrograph of the fracture surface observed in void and tearing of elastic epoxy at addictives 35phr. The other side, SEM micrograph of rigid epoxy showed the trace which broke.

• Journal of Adhesion and Interface
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• v.8 no.4
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• pp.8-13
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• 2007

In this study, solvent-free waterborne polyurethanes (SWPU) were synthesized with teramethylxylene diisocyanate (TMXDI), poly(tetramethylene glycol) (PTMG) and polycarprolactone (PCL) and different mole ratio of dimethylol proponicacid (DMPA). The effect of ionic contents in the solvent-free waterborn polyurethane on thermal, mechanical properties and adhesion strength were studied. Glass transition temperature (Tg) were in range of $-70{\sim}-50^{\circ}C$ and increased as PCL contents increased in polyol. With more incorporation of PCL and DMPA contents in SWPU, tensile strength, adhesion strength and heat resistance of SWPU increased, while the elongation decreased.

• Journal of Adhesion and Interface
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• v.23 no.2
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• pp.33-38
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• 2022

In this study, we report on the synthesis and properties of eco-friendly waterborne polyurethane (WPU) according to bio-polyol contents. It was successfully synthesized by the different polyester polyol (DT-1040) and castor oil based polyol (COP) ratios. The glass transition temperature (Tg) of the synthesized bio polyol based waterborne polyurethane was around -70 ℃ and -30 ℃, and it was confirmed that the Tg range was widened as the COP content increased. In addition, as the COP content increased, the tensile strength decreased, and optimum adhesive strength showed when DT-1040:COP ratio was 7:3.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.34 no.1
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• pp.22-29
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• 2002

The coated paper was greatly affected by the basic physical properties of the binder as well as the amount of the coating formula. High glass transition temperature (Tg) of the styrene-butadiene (SB) latex, selected as the binder in our study, gave the high stiffness to the coated paper, but lowered the binding force and print gloss. The average particle size of the SB latex also greatly affected to the coated paper so that the smaller particle size improved the rheological property of the coating formula and increased the binding force and print gloss. Another property of the SBR latex, gel content, was important because when its value was small, the latex was easily deformed at the high temperature and increased air permeability to the coated paper. Therefore, the lower gel content consequently resulted in the higher blistering resistance, especially in the web paper. The larger portion of the SB latex in the coated formula improved the binding force and print gloss, but decreased the ink set-off and ink-trapping to the coated paper. The heavier coating improved optical properties such as opacity, paper gloss and paper smoothness, to the coated paper.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.1162-1164
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• 1993

The Thermally Stimulated Current(TSC) spectroscopy has been applied to study the influence of the structual cahange and interface on the electrical properties of epoxy composites. Three DGEBA-MeTHPA matrix model samples mixed different ratios and silica($SiO_2$) filled sample and silaln treating-filled sample has been studied. Above room temperature, the relaxation mode $\alpha$ peak associated with Tg has been located at $110^{\circ}C$. Below glass transition temperature(Tg), three relaxation modes are observed in all samples: a $\beta$ mode situated at $10^{\circ}C$, a $\gamma$ mode located at $-40^{\circ}C$ and a $\delta$ mode appeared in $-120^{\circ}C$. The analysis of its fine structure indicates that constitution of elementary processes is characterized by the activation energy and relaxation time. Also the dielectric relaxation properties have been investigated to compare the the change of the molecular structure and motion to the relaxation properties and conduction mechanism in TSC spectra.