• Journal of the Korean Chemical Society
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• v.40 no.1
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• pp.81-86
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• 1996

The physical properties of epoxy molding compound (EMC) according to the change of softening point of epoxy resin have been investigated in order to study the relationship between the properties of o-cresol novolac epoxy resin, which is main component of EMC for semiconductor encapsulation, and EMC. The softening points of used epoxy resin are 65.1 $^{\circ}C$, 72.2 $^{\circ}C$, and 83.0 $^{\circ}C$, respectively. The flexural strength and flexural modulus as mechanical properties were measured, and thermal expansion coefficient, thermal conductivity and glass transition temperature (Tg) as thermal properties, and spiral flow as moldability have been investigated to see the change of physical properties of EMC. The flexural modulus, thermal expansion coefficients in the glass state (${\alpha}_1$), and thermal conductivity of EMC were found to be keep constant value irrespective of the change of softening point, but Tg increased with softening point of epoxy resin, and the spiral flow decreased with that. It can be considered that these phenomena are due to the increase of crosslinking density of EMC according to the increase of softening point. The transition points were found out in the thermal expansion coefficient data in the rubbery state (${\alpha}_2$) and the flexural strength data. These can show the decrease of filler dispersion according to increase of epoxy resin viscosity.

• Elastomers and Composites
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• v.46 no.3
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• pp.218-222
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• 2011

The effect of cycled temperature change on the mechanical properties of wood flour(50 wt.% and 70 wt.%) polypropylene WPC(Wood Plastic Composites) was investigated in this study. Flexural modulus and flexural strength of the WPC showed a decrease due to the degradation of interfacial adhesion between polymer matrix and wood flour by the freeze-thaw test regardless of the cycled number. At the higher loading level of wood flour, the reduction of the flexural modulus was remarkable. After the cycled heat-freeze test, it was found that the flexural modulus and flexural strength of the WPC were lower at the high temperature ($60^{\circ}C$) and higher at the low temperature ($-20^{\circ}C$). At the low temperature ($-20^{\circ}C$) which is below glass transition temperature of polypropylene ($-10^{\circ}C$), WPC is in a glassy state which brings about the high stiffness and strength. At the high temperature ($60^{\circ}C$), the flexural modulus and flexural strength of the WPC with 50 wt.% wood flour were lower because of the increase of polymer ductility.

• Journal of the Korean Electrochemical Society
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• v.24 no.3
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• pp.52-64
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• 2021

The effect of Fe and BO₃ doping on structure, thermal, and electrical properties of Li_1+xFe_xTi_2-x(PO₄)_3-y(BO₃)_y (x = 0.2, 0.5)-based glass and glass ceramics was investigated. In addition, their crystallization behavior during sintering and ionic conductivity were also investigated in terms of sintering temperature. FT-IR and XPS results indicated that Fe²⁺ and Fe³⁺ ions in Li_1+xFe_xTi_2-x(PO₄)_3-y(BO₃)_y glass worked as a network modifier (FeO₆ octahedra) and also as a network former (FeO₄ tetrahedra). In the case of the glass with low substitution of BO₃, boron formed (PB)O₄ network structure, while boron preferred BO₃ triangles or B₃O₃ boroxol rings with increasing the BO₃ content owing to boic oxide anomaly, which can result in an increased non-bridging oxygen. The glass transition temperature (GTT) and crystallization temperature (CT) was lowered as the BO₃ substitution was increased, while Fe²⁺ lowered the GTT and raised the CT. The ionic conductivity of Li_1+xFe_xTi_2-x(PO₄)_3-y(BO₃)_y glass ceramics were 8.85×10^-4 and 1.38×10^-4S/cm for x = 0.2 and 0.5, respectively. The oxidation state of doped Fe and boric oxide anomaly were due to the enhanced lithium ion conductivity of glass ceramics.

• Journal of the Korean Vacuum Society
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• v.19 no.6
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• pp.475-482
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• 2010

Polycrystalline NiO thin films were deposited on glass substrate by RF magnetron sputtering using only Ar as a plasma sputter gas. based on the analysis of x-ray diffraction (XRD), NiO films had a polycrystalline cubic (NaCl type) structure. NiO thin films grown below and above $200^{\circ}C$ showed preferred orientation of (111) and (220) respectively. It showed colossal change in electrical resistivity as much a ${\sim}10^7$ order form an insulating state of $105\;{\Omega}cm$ below $200^{\circ}C$ to a conducting state of $10^{-2}{\sim}10^{-1}\;{\Omega}cm$ above $300^{\circ}C$ such a Mott metal-insulator transition (MIT) in polycrystalline.

• Journal of Korea Foundry Society
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• v.23 no.5
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• pp.276-285
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• 2003

In the undercooled melt of $Pd_{40}Cu_{30}Ni_{10}P_{20}$ alloy, the solidification behavior including nucleation and growth of crystals at the micrometer level has been observed in-situ by use of a confocal scanning laser microscope combined with an infrared image furnace. The $Pd_{40}Cu_{30}Ni_{10}P_{20}$ alloy specimens were cooled from the liquid state to glass transition temperature. 575 K, at various cooling late under a helium gas flow. According to the cooling rate, the morphologies of the solidification front are changed among various types, irregular jog like front, columnar dendritic front, cellular grain, star like shape jog and fine grain, etc. The velocities of the solid-liquid interface are measured to be $10^{-5}{\sim}10^{-8}$ m/s which are at least two orders higher than the theoretical crystal growth rates. Combining the morphologies observed in terms of cooling rates and their solidification behaviors, we conclude that phase separation takes place in the undercooled molten $Pd_{40}Cu_{30}Ni_{10}P_{20}$ alloy. The continuous cooling transformation (CCT) diagram was constructed from solidification onset time at various linear cooling conditions with different rate. The CCT diagram suggests that the critical cooling rate for glassy solidification is about 1.5 K/s, which is in agreement with the previous calorimetric findings.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.11
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• pp.106-112
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• 1992

In this paper, we analyze the structure characteristics of $As_{40}Se_{50-x}S_{x}Ge_{10}$ system bulk and thin films. As the results of XRD patterns, it identified amorphous state. In order to find the glass transition temperature($T_g$), crystallization($T_c$) and melting point ($T_m$)of bulk sample, it ascertained that TS1gT is 238$^{\circ}C$ in $As_{40}Se_{15}S_{35}Ge_{10}$, and 231$^{\circ}C$ in $As_{40}Se_{25}S_{25}Ge_{10}$ & $As_{40}Se_{50}Ge_{10}$ following the thernal analysis by DSC, DTA, & TGA method. Also it was confirmed the phase seperation of continuous phase and dispertion phase by the optical texture of polarizing microscope and $T_g$ near 20$0^{\circ}C$ in thin film. Therefore, it was found that it occurs the phase seperation of Ge-rich dontinuous phase and Se-rich dispersion phase following the EDS analysis of thin film and the surface SEM photograph.

• KIEE International Transactions on Electrophysics and Applications
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• v.3C no.2
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• pp.59-65
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• 2003

Electrical properties such as permittivity and tan$\delta$ of unaged (control) and aged (72 h at 18$0^{\circ}C$) mica/epoxy composites of 130 ${\mu}{\textrm}{m}$ thickness were measured and their surface conditions were characterized using scanning electron microscopy (SEM), Fourier transform infrared (FTIR), electron spectroscopy for chemical analysis (ESCA), differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). Both permittivity and tan6 of control specimens were higher than those of short-time aged specimens. FTIR results show a new peak at 1710 $cm^{-1}$ / for short-time aged specimens, originating from carbonyl group formed by the oxidation reaction during the aging process. ESCA results show that the binding energy at 532.9 eV representing the singlet state of oxygen ( $O_{1s}$) decreases by 13.7%, whereas that at 534.6 eV increases by 13.7%. Glass transition temperatures of control and short-time aged specimens are observed to be 95.4$^{\circ}C$ and 113.4$^{\circ}C$, which increase with the increase of aging time. TGA results indicate that the control specimens contain a smaller amount of volatile components than the short-time aged specimens.s.

• Elastomers and Composites
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• v.34 no.5
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• pp.399-406
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• 1999

Polyurethane (PU) prepolymers were synthesized from polytetramethylene ether glycol (PTMG), 4,4'-diphenylmethane diisocyanate (MDI), toluene 2,4-diisocyanate (TDI) and isophoron diisocyanate (IPDI). After chain extention using dimethyol propionic acid (DMPA), aqueous polyurethane anionomers were prepared from triethyl amine (TEA) as a neutralizer. The effect of the content of chain extender and the degree of neutralization on the state of emulsification, adhesive strength, viscosity, glass transition temperature and physical properties of emulsion cast film were investigated using UTM, Viscometer and DSC.

• Fibers and Polymers
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• v.5 no.3
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• pp.239-244
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• 2004

Solution-cast films of polymethylmethacrylate (PMMA) and polyurethane (PU) containing polymeric styryl dye up to 5 % by weight were prepared to investigate their acid-sensitivity and mechanical and thermal properties. Original red samples due to styryl dye turned out yellow very rapidly as they were exposed to acid vapor of hydrochloric acid or p-toluenesulfonic acid. According to UV/VIS spectroscopic measurements, characteristic peak intensities near 430 nm and 520 nm increased or decreased relatively with exposed amounts of acid, respectively. Both PMMA and PU samples showed uniform color distribution due to a good miscibility between polymer and dye which can be evidenced by measurements of glass transition temperature. No significant difference in acid-sensitivity was found between PU and PMMA except relative absorbance. However, dependence of their mechanical properties on dye content was somewhat different with PU or PMMA. In case of PMMA, modulus and breaking stress increased up to about 50 % with increasing dye content, whereas those of PU samples showed only slight increase. It was ascribed to whether the matrix polymer was in the glassy or rubbery state.

• Macromolecular Research
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• v.14 no.4
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• pp.416-423
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• 2006

The dynamic mechanical thermal properties of poly(hexamethylene terephthalate) (PHT), poly(1,4-cyclohexylenedimethylene terephthalate) (PCT) and their P(HT-co-CT) random copolymers in the amorphous state were examined as a function of temperature and frequency. All the samples exhibited two main relaxation processes in the plot of tan ${\delta}$ versus temperature: the primary ${\alpha}$-relaxation associated with the glass transition and the secondary ${\beta}$-relaxation attributed to the local segmental motions of mostly cyclohexylene rings for PCT and to cooperative motions of methylene, carboxyl, and phenylene groups for PHT. Both ${\alpha}$- and ${\beta}$-relaxation temperatures increased with increasing CT content. The activation energy of the ${\alpha}$-relaxation increased with increasing CT content, whereas that of the ${\beta}$-relaxation decreased. The sub-glassy secondary ${\beta}$-relaxation processes of PCT and PHT were investigated in terms of the cooperativity of main-chain segmental motions.