• 제목/요약/키워드: glass structure

검색결과 1,641건 처리시간 0.027초

Proton Conductivity of Niobium Phosphate Glass Thin Films

  • Kim, Dae Ho;Park, Sung Bum;Park, Yong-il
    • 한국재료학회지
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    • 제28권5호
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    • pp.308-314
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    • 2018
  • Among the fuel cell electrolyte candidates in the intermediate temperature range, glass materials show stable physical properties and are also expected to have higher ion conductivity than crystalline materials. In particular, phosphate glass has a high mobility of protons since such a structure maintains a hydrogen bond network that leads to high proton conductivity. Recently, defects like volatilization of phosphorus and destruction of the bonding structure have remarkably improved with introduction of cations, such as Zr4+ and Nb5+, into phosphate. In particular, niobium has proton conductivity on the surface because of higher surface acidity. It can also retain phosphorus content during heat treatment and improve chemical stability by bonding with phosphorus. In this study, we fabricate niobium phosphate glass thin films through sol-gel processing, and we report the chemical stability and electrical properties. The existence of the hydroxyl group in the phosphate is confirmed and found to be preserved at the intermediate temperature region of $150-450^{\circ}C$.

스마트폰 곡면유리 성형시스템의 가압장치 설계 및 곡면유리 성형특성실험 (Design of a Force Applying System for a Smart-phone Curved Glass Molding System and Its Characteristic Test)

  • 김현민;홍태경;정동연;이연형;박재현;김갑순
    • 제어로봇시스템학회논문지
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    • 제20권5호
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    • pp.570-577
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    • 2014
  • This paper describes the design of a force applying system for a smart phone curved glass molding system and its characteristic test. The force applying system is composed of a motor and gear, a rectilinear movement structure, a force sensor, an LVDT (Linear Variable Differential Transformer) sensor, an up and down moving block, and so on. The system precisely controls the applying force and time to the plane glass because the glass can be easily destroyed under applied force, and can be bent imperfectly. As a result of the characteristic test, the curved glass can be manufactured using this system, and the holding time under 0N force, the applying force to the plane glass, the time for applying from 0N to maximum force, and the holding time under maximum force at the manufacture feasible temperature $620^{\circ}C$ were found.

레이저 습식 후면 식각공정을 이용한 미세 유리 구조물 제작 (Fabrication of Glass Microstructure Using Laser-Induced Backside Wet Etching)

  • 김보성;박민수
    • 대한기계학회논문집A
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    • 제38권9호
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    • pp.967-972
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    • 2014
  • 우수한 광투과성 및 경도를 지닌 유리는 바이오, 전자, 광학 등의 분야에서 널리 활용되고 있다. 하지만, 유리는 경도가 높고 깨지기 쉬워 일반적으로 특수가공법을 이용하여 가공이 이루어진다. 그 중 레이저는 공구가 불필요하며 가공 속도가 빠르다는 장점을 지니고 있지만 유리의 높은 광투과성 때문에 가공에 적용하기에는 많은 제약이 따른다. 이에 저출력의 나노초 펄스 레이저로 유리 가공을 하기 위하여 간접가공법인 레이저 습식 후면 식각공정을 활용하고자 한다. 기존의 연구들에서는 흡수율이 뛰어난 고가의 단파장 레이저 장비를 주로 사용하였으나 본 연구에서는 범용적인 근적외선 레이저 장비를 활용하여 유리 구조물 제작의 가능성을 실험하였다. 특히 깊은 구조물 제작시 발생하는 문제점을 확인하고 이를 해결하기 위해 초음파 부가 공정을 통한 미세 구조물 제작을 수행하였다.

P2O5-SnO2계 유리에서 P2O5를 B2O3로 치환첨가 시 구조와 물성에 미치는 영향 (Effects of Substituting B2O3 for P2O5 on the Structure and Properties of P2O5-SnO2 Glass Systems)

  • 최병현;지미정;안용태;고영수;이영훈
    • 한국세라믹학회지
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    • 제45권8호
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    • pp.459-463
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    • 2008
  • $P_2O_5-SnO_2$ system $0.5SnO_2-xP_2O_5-(0.5-x)B_2O_3$(x=0.1, 0.2, 0.3, 0.4, 0.5) glasses have been prepared for Pb-free low temperature glass frit. A investigation about the effect of $B_2O_3$ substitution on properties of $P_2O_5$ glasses, including glass structure properties, thermal properties, and mechanical properties was presented. Substance that is responsible for in moisture absorption existing circumstances supposes by phosphate, and excess moisture tolerance that state funeral's structure is improved breaking does not affect in state funeral bond that only most single bond remains, and can know that does not suffer big impact in boric oxide anomaly present state. This phenomenon estimates that connect with structure change. It is thought according to link this result the phosphoric acid happened structural change. $B_2O_3$ displacement quantity 0.3 mole put out $BO_4$ structures, but above 0.3 mole it changed with the case $BO_3$ structure which it displaces.

Control of Glass Infiltration at the Al2O3/Glass/Al2O3 Interface

  • Jo, Tae-Jin;Yeo, Dong-Hun;Shin, Hyo-Soon;Hong, Youn-Woo;Cho, Yong-Soo
    • Transactions on Electrical and Electronic Materials
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    • 제12권1호
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    • pp.32-34
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    • 2011
  • A zero-shrinkage sintering process in which the shrinkage of the x-y axis is controlled to be zero is in great demand due to the high integration trend in ceramic modules. Among the zero-shrinkage sintering processes available, the glass infiltration method proposed in the preliminary study with an $Al_2O_3/Glass/Al_2O_3$ structure is one promising method. However, problems exist in regard to the glass infiltration method, including partially incomplete joining between $Al_2O_3$ and glass layers due to the precipitate of Ti-Pb rich phase during the sintering process. Therefore, we wish to solve the de-lamination problems and suggest a mechanism for delamination and the solutions in the zero-shrinkage low temperature co-fired ceramic (LTCC) layers. The de-lamination problems diminished using the Pb-BSi-O glass without $TiO_2$ in Pb-B-Ti-Si-O glass and produced a very dense zero-shrinkage LTCC.

Adhesion Improvement for Copper Process in TFT-LCD

  • Tu, Kuo-Yuan;Tsai, Wen-Chin;Lai, Che-Yung;Gan, Feng-Yuan;Liau, Wei-Lung
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.1640-1644
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    • 2006
  • The first issue that should be overcome in copper process is its poor adhesive strength between pure copper film and glass substrate. In this study, defining the adhesive strength of pure copper film on various substrates and clarifying the key deposition parameters are presented for the investigation of copper process. First, using different kinds of surface plasma treatments were studied and the results showed that the adhesive strength was not improved even though the roughness of glass substrate surface was increased. Second, adding an adhesive layer between glass substrate and pure copper film was used to enhance the adhesion. Based on the data in the present paper, adopting copper alloy film as an adhesive layer can have capability preventing peeling problem in copper process. Besides, Cu/Cu alloy structure could be etched with the same etchant with better taper angle than the one with single layer of Cu. Unlike Cu/Mo structure, there is no residual problem for Cu/Cu alloy structure during etching process. Finally, this structure was examined in electrical test without significant difference in comparison with the conventional metal process.

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PDP용 수직형 구조의 근접 노광장치 개발 (Development of Proximity Exposure System with Vertical Structure for Plasama Display Panel)

  • 박정규;정수화;이항부
    • 대한기계학회논문집A
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    • 제24권9호
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    • pp.2371-2380
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    • 2000
  • In this paper, we developed the proximity exposure system with the vertical structure of glass and mask stage to minimize the mask's warp caused by the pull of gravity. This system, which canirradiate the ultra violet through 1440 H 850 $\textrm{mm}^2$ and 1330X 1015 $\textrm{mm}^2$ exposure area, has the followingcharacteristics. The glass stage can be inclined by 80 degrees at vertical structure to load substrate withsafety on it. When the glass stage is the vertical state, the gap control, alignment control and exposureof ultra violet are executed. So, it enhances the pattern uniformity by minimizing the mask's warp. Theglass stage can also control the gap between the mask and the substrate by the coarse and fine motioncontrol. The mask stage can adjust the posture of photomask to the position of substrate by imageprecessing method. The galss stage for the gap control and the mask stage for the alignment aredesigned independently for each function.

Metal Ion Dissolution in Nitric Acid with Lead-Borosilicate Glass for Barrier Ribs in PDP

  • Kim, Jae-Myung;Lee, Chong-Mu;Kim, Hyung-Sun
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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    • pp.1252-1254
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    • 2005
  • Recently, PDP barrier ribs require the formation of complex structure so that they are usually formed by etching method. For producing the fine ribs structure, during the etching process the metal ions of matrix (glass) of barrier materials should be understood on the etching mechanism with etching condition. We analyzed the quantity of Pb, Si, and B ions from the etch solution as a function of etching time.

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유리섬유보강 박판패널에 의한 철근콘크리트 구조물의 보수.보강공법 (Repair and Strengthening of R/C Structure Using Glass Fiber Reinforced Plastic Thin Panels)

  • 천의균;진형장;박석암;김행준
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2000년도 봄 학술발표회 논문집
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    • pp.866-873
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    • 2000
  • Reinforced concrete structure can be strengthened by glass fiber reinforced plastic thin panels. The GFRP-Thin Panels are manufactured by pressing form and their application technique are similar to steel plates. The use of FGRP-Thin Panels presents several advantages. The advantages of this structural system are the case of application, the elimination of joint and corrosion at the epoxy-panel interface. This paper introduces the method of manufacturing about GFRP-Thin Panels, mechanical properties and the application of reinforced concrete structures.

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전기 기기용 봉지 및 함침 에폭시 복합 재료의 내열성 및 절연파괴 특성 개선에 관한 연구 (A study on the improvement of thermostability and dielectric breakdown strength for packaging and impregnating epoxy composite materials for electrical machines and apparatus)

  • 김명호;김재환
    • E2M - 전기 전자와 첨단 소재
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    • 제7권6호
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    • pp.527-533
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    • 1994
  • In this study, it was studied on dielectric breakdown strength and thennostability properties due to the structure variation of matrix resin and treatment of coupling agent of epoxy insulating materials. The interpenetrating network structure was formed by simultaneous heating curing the epoxy resin with single network structure and the methacrylic acid resin. Also inner structure was observed and the glass transition temperature was measured on these three type specimens. Dielectric breakdown properties were investigated by applying DC, AC and impulse voltage. As a result, the glass transition temperature and the dielectric breakdown strength of specimen with interpenetrating network structure was more higher than another two type specimens.

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