• Title/Summary/Keyword: gap joint

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A Study on the Development of High Deposition Automatic Vertical Welding of Erection Stage in Shipbuilding (조선 탑재용접용 대입열 수직자동용접법의 개발에 관한 연구)

  • Park, Ju-Yong;Choe, Woo-Hyeon
    • Journal of Welding and Joining
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    • v.26 no.5
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    • pp.66-73
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    • 2008
  • Welding work in pre-erection or erection stage of shipbuilding construction to be carried out in flat and vertical upward position mostly and Electrogas welding(EGW) is actively applied especially for vertical butt joint of thicker steel plate recently. In this study considered how to develope and improve mechanical properties of weld metal and HAZ in high heat input welding processes such as EGW and Electroslag welding(ESW) with its welding equipment in order to extend the application range to the longitudinal members and hatch coaming parts of container ship. Some components of welding system and parameters were modified to get the faster travel speed and reduce weld heat input, and also by adding additional filler rods or tubes increase the amount of deposited weld metal. With the test get some good date can apply to actual fabrication work and recommend items to manufacture welding materials make better. Above all things it's a fruition that to prepare the possibility of application of ESW to shipbuilding construction which fill up the gap of stoppage days of more than 20 years.

Resource Allocation in Multi-User MIMO-OFDM Systems with Double-objective Optimization

  • Chen, Yuqing;Li, Xiaoyan;Sun, Xixia;Su, Pan
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.12 no.5
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    • pp.2063-2081
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    • 2018
  • A resource allocation algorithm is proposed in this paper to simultaneously minimize the total system power consumption and maximize the system throughput for the downlink of multi-user multiple input multiple output-orthogonal frequency division multiplexing (MIMO-OFDM) systems. With the Lagrange dual decomposition method, we transform the original problem to its convex dual problem and prove that the duality gap between the two problems is zero, which means the optimal solution of the original problem can be obtained by solving its dual problem. Then, we use convex optimization method to solve the dual problem and utilize bisection method to obtain the optimal dual variable. The numerical results show that the proposed algorithm is superior to traditional single-objective optimization method in both the system throughput and the system energy consumption.

Applicability Study of 2-pass Laser Welding on Galvanized Steel Sheets (아연도금강판 겹치기 용접부에 대한 2패스 레이저용접 적용성 연구)

  • Ahn, Young-Nam;Kang, Minjung;Kim, Cheolhee
    • Journal of Welding and Joining
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    • v.34 no.4
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    • pp.55-61
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    • 2016
  • During laser overlap welding of galvanized steel sheets, explosion of weld pool by the high pressure zinc vapor induces weld defects like porosity and blowhole. In this study, laser 2-pass welding was implemented to prevent the weld defects. Through the 1st pass welding, zinc layers on the faying surfaces were removed when proper heat input was applied. Excessive heat input could result in explosion even during the 1st pass welding and insufficient heat input could not remove enough region of zinc layer for the 2nd pass welding. Coating weights of $45g/m^2$ and $60g/m^2$ were considered and for both cases sound welds without weld defects could be achieved. In spite of 2-pass welding, softening of weld and heat affected zone was not observed and Zn coating was not diluted into the weld metal.

Growth features and nucleation mechanism of Ga1-x-yInxAlyN material system on GaN substrate

  • Simonyan, Arpine K.;Gambaryan, Karen M.;Aroutiounian, Vladimir M.
    • Advances in nano research
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    • v.5 no.4
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    • pp.303-311
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    • 2017
  • The continuum elasticity model is applied to investigate quantitatively the growth features and nucleation mechanism of quantum dots, nanopits, and joint QDs-nanopits structures in GaInAlN quasyternary systems. We have shown that for GaInAlN material system at the critical strain of ${\varepsilon}^*=0.039$ the sign of critical energy and volume is changed. We assume that at ${\varepsilon}={\varepsilon}^*$ the mechanism of the nucleation is changed from the growth of quantum dots to the nucleation of nanopits. Obviously, at small misfit (${\varepsilon}$ < ${\varepsilon}^*$), the bulk nucleation mechanism dominates. However, at ${\varepsilon}$ > ${\varepsilon}^*$, when the energy barrier becomes negative as well as a larger misfit provides a low-barrier path for the formation of dislocations, the nucleation of pits becomes energetically preferable. The free energy of mixing for $Ga_{1-x-y}In_xAl_yN$ quasiternary system was calculated and studied and its 3D sketch was plotted.

Alloy Design and Powder Manufacturing of Al-Cu-Si alloy for Low-Temperature Aluminum Brazing (저온 알루미늄 브레이징용 Al-Cu-Si-Sn 합금 설계 및 분말 제조)

  • Heeyeon Kim;Chun Woong Park;Won Hee Lee;Young Do Kim
    • Journal of Powder Materials
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    • v.30 no.4
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    • pp.339-345
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    • 2023
  • This study investigates the melting point and brazing properties of the aluminum (Al)-copper (Cu)-silicon (Si)-tin (Sn) alloy fabricated for low-temperature brazing based on the alloy design. Specifically, the Al-20Cu-10Si-Sn alloy is examined and confirmed to possess a melting point of approximately 520℃. Analysis of the melting point of the alloy based on composition reveals that the melting temperature tends to decrease with increasing Cu and Si content, along with a corresponding decrease as the Sn content rises. This study verifies that the Al-20Cu-10Si-5Sn alloy exhibits high liquidity and favorable mechanical properties for brazing through the joint gap filling test and Vickers hardness measurements. Additionally, a powder fabricated using the Al-20Cu-10Si-5Sn alloy demonstrates a melting point of around 515℃ following melting point analysis. Consequently, it is deemed highly suitable for use as a low-temperature Al brazing material.

A study on measurement and compensation of automobile door gap using optical triangulation algorithm (광 삼각법 측정 알고리즘을 이용한 자동차 도어 간격 측정 및 보정에 관한 연구)

  • Kang, Dong-Sung;Lee, Jeong-woo;Ko, Kang-Ho;Kim, Tae-Min;Park, Kyu-Bag;Park, Jung Rae;Kim, Ji-Hun;Choi, Doo-Sun;Lim, Dong-Wook
    • Design & Manufacturing
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    • v.14 no.1
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    • pp.8-14
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    • 2020
  • In general, auto parts production assembly line is assembled and produced by automatic mounting by an automated robot. In such a production site, quality problems such as misalignment of parts (doors, trunks, roofs, etc.) to be assembled with the vehicle body or collision between assembly robots and components are often caused. In order to solve such a problem, the quality of parts is manually inspected by using mechanical jig devices outside the automated production line. Automotive inspection technology is the most commonly used field of vision, which includes surface inspection such as mounting hole spacing and defect detection, body panel dents and bends. It is used for guiding, providing location information to the robot controller to adjust the robot's path to improve process productivity and manufacturing flexibility. The most difficult weighing and measuring technology is to calibrate the surface analysis and position and characteristics between parts by storing images of the part to be measured that enters the camera's field of view mounted on the side or top of the part. The problem of the machine vision device applied to the automobile production line is that the lighting conditions inside the factory are severely changed due to various weather changes such as morning-evening, rainy days and sunny days through the exterior window of the assembly production plant. In addition, since the material of the vehicle body parts is a steel sheet, the reflection of light is very severe, which causes a problem in that the quality of the captured image is greatly changed even with a small light change. In this study, the distance between the car body and the door part and the door are acquired by the measuring device combining the laser slit light source and the LED pattern light source. The result is transferred to the joint robot for assembling parts at the optimum position between parts, and the assembly is done at the optimal position by changing the angle and step.

Behaviors of Early-Age Cracks on the JCP (무근 콘크리트포장 초기균열 거동 연구)

  • Park, Dae-Geun;Suh, Young-Chan;Ann, Sung-Sun;Kim, Hyung-Bae
    • International Journal of Highway Engineering
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    • v.6 no.2 s.20
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    • pp.47-59
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    • 2004
  • The temperature variation of concrete pavement at early-age significantly affects the initiation and propagation of its early-age cracks. This implies that the measurement and analysis of early age temperature trend are necessary to examine the causes of early age cracks in the concrete pavement. In this study, it is investigated how the early age temperature trend in concrete pavement affects the random crack initiation and behaviors of saw-cut joints using the actual construction site which is located at the KHC test road. During 72 hours after placing the concrete pavement, the ambient air temperature and temperatures at the top, middle, and bottom in concrete pavement were measured and the random crack initiation in concrete slabs and early age behaviors in the joints were surveyed. The investigation results indicate that the first random crack was initiated at one of the slabs placed in the early morning which have higher temperature changes during early 72 hours. The movement of slab was influenced by the early-age crack in the joint. It suggested that the different occurrence time of the cracks in the joint had an influence on the behavior of the cracks. Besides, the slab constructed In the morning had higher possibility of crack initiation than that in the afternoon. The rarely occurred cracks had bigger gap than other cracks.

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Study on the Extension of Reinforced Concrete Slabs (철근콘크리트 바닥판 평면확장 공법에 대한 연구)

  • Kim, Jin-Pyeng;Kim, Sang-Sik;Choi, Kwnag-Ho;Jeon, Byong-Gap;Lee, Jung-Yoon
    • Journal of the Korea Concrete Institute
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    • v.18 no.3 s.93
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    • pp.321-330
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    • 2006
  • In order to remodel old aged reinforced concrete buildings, it is often required to extend the residence area of the buildings by increasing the slab area. The slab area is usually extended by attaching a new slab to the existing slab with hinged joint or rigid joint. Transmission of the loads of the attached slabs to the existing slabs depends on the connecting methods, such as hinged or rigid connection. In this research, 8 specimens and 24 RC slabs connected by rigid joints were tested. The new slab was connected to the existing slab by three types of rigid joints using dowel bars and longitudinal tensile bars. Main parameters of the slabs were three types of the rigid joints, anchor length of steel bars(0, 50, 60, 100, and 120mm), development length of steel bars(100, 200, and 300mm), and the spacing of the steel bars(150, 200, 300, and 450mm). The test results indicated that the flexural strength of the RC test slabs having various types of rigid joints was approximately the same to that of the slab without any connections.

Cognitive Discrepancies of the Mutual Development Strategies of Western and Oriental Medicine in Korea - A Comparison between Western and Oriental Medical Practitioners and Health Professionals - (양.한방 상호보완 방안에 관한 인식도 연구 - 의사, 한의사 및 보건의료전문가간 비교를 중심으로 -)

  • Park, Jong-Ku;Kim, Chun-Bae;Cho, Kyung-Sook;Choi, Seo-Young;Lee, Jong-Chan;Lee, Sun-Dong;Chun, Sae-Il;Kim, Joong-Ho
    • Health Policy and Management
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    • v.10 no.4
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    • pp.57-74
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    • 2000
  • This study is conducted to compare how the Western.Oriental medical practitioners and health professionals perceive reciprocal development strategies respectively of Western.Oriental Medicine in Korea. A total of 3,273 persons were questioned by direct distribution, e-mail, and mail with a self-developed questionnaire. Of those questioned, 362 responded (the response rate of 11.1%), and of them n persons (Western medical practitioners 206, Oriental medical practitioners 90, and health professionals 64) were analyzed with SPSS for Windows. The results were as follows: The need for legislation on the mutual development system for Western.Oriental Medicine was recognized by 66.9% (218 persons) of respondents. Among them, largest group who agreed with this need was the health professionals. Western medical practitioners chose the "the difference of approach methods on the diseases between Western.Oriental Medicine" as their response, and Oriental medical practitioners & health professionals selected "the indifference or bias of Western medical practitioners"as the reasons for the inactivity in developing a mutual system of Western.Oriental Medicine. Therefore, Western medical practitioners and health professionals selected the category of "the reformation of educational system", while Oriental medical practitioners selected the category of "the activation of joint research on Western.Oriental medical care" as the most important condition for setting a precedent. Also, Western medical practitioners preferred "cooperative health care system for Western medical care supported by Oriental medical care", but Oriental medical practitioners and health professionals preferred “cooperative health care system of Western.Oriental medicine on equal terms" In conclusion, Western '||'&'||' Oriental medical practitioners have to make every effort to close the gap between differing views through mutual understanding and respect if joint research of Western.Oriental medical care is to become a reality. The government should continuously enforce the health policy on development of a legal and systematic infrastructure for mutual development strategy of Western.Oriental Medicine in Korea.strategy of Western.Oriental Medicine in Korea.

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Flip Chip Process for RF Packages Using Joint Structures of Cu and Sn Bumps (Cu 범프와 Sn 범프의 접속구조를 이용한 RF 패키지용 플립칩 공정)

  • Choi, J.Y.;Kim, M.Y.;Lim, S.K.;Oh, T.S.
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.3
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    • pp.67-73
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    • 2009
  • Compared to the chip-bonding process utilizing solder bumps, flip chip process using Cu pillar bumps can accomplish fine-pitch interconnection without compromising stand-off height. Cu pillar bump technology is one of the most promising chip-mounting process for RF packages where large gap between a chip and a substrate is required in order to suppress the parasitic capacitance. In this study, Cu pillar bumps and Sn bumps were electroplated on a chip and a substrate, respectively, and were flip-chip bonded together. Contact resistance and chip shear force of the Cu pillar bump joints were measured with variation of the electroplated Sn-bump height. With increasing the Sn-bump height from 5 ${\mu}m$ to 30 ${\mu}m$, the contact resistance was improved from 31.7 $m{\Omega}$ to 13.8 $m{\Omega}$ and the chip shear force increased from 3.8 N to 6.8 N. On the contrary, the aspect ratio of the Cu pillar bump joint decreased from 1.3 to 0.9. Based on the variation behaviors of the contact resistance, the chip shear force, and the aspect ratio, the optimum height of the electroplated Sn bump could be thought as 20 ${\mu}m$.

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