• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.56 no.7
• /
• pp.1294-1297
• /
• 2007

In this paper, fabrication techniques for nanoscale metallic nanobeam specimens have been proposed, and mechanical properties of the fabricated gold nanobeams have been evaluated by nanoindentation techniques and nanobeam bending test. Elastic modulus and hardness of gold nanobeams were measured to be $109.6\;{\pm}\;10\;GPa\;and\;1.73\;{\pm}\;0.3\;GPa$, respectively, from the nanoindentation test, while elastic modulus was $241\;{\pm}\;7\;GPa$ from the nanobeam bending test.

• Proceedings of the KSME Conference
• /
• 2008.11a
• /
• pp.45-48
• /
• 2008

The mechanical behavior of small-sized materials has been investigated for many industrial applications, including MEMS and semiconductors. It is challenging to obtain accurate mechanical properties measurements for thin films due to several technical difficulties, including measurement of strain, specimen alignment, and fabrication. In this work, we used the micro-tensile testing unit with the real-time DIC (Digital Image Correlation) strain measurement system. This system has advantages of real time strain monitoring up to 50 nm resolution during the micro-tensile test, and ability to measure the young's modulus and Poisson's ratio at the same time. The mechanical properties of SCS (Single Crystal Silicon) are measured by uniaxial tension test from freestanding SCS which are $2.5{\mu}m$ thick, $200-500{\mu}m$ wide specimens on the (100) plane. Young's modulus, Poisson's ratio and tensile strength in the <110> direction are measured by micro-tensile testing system.

• Journal of the Korean Society for Nondestructive Testing
• /
• v.30 no.5
• /
• pp.471-478
• /
• 2010

Thin films play an important role in many technological applications including microelectronic devices, magnetic storage media, MEMS and surface coatings. It is well known that a thin film's material properties can be very different from the corresponding bulk properties and thus there has been a strong need for the development of a reliable test method to measure the mechanical properties of a thin film. We have developed an alternative and convenient test method to overcome the limitations of previous membrane deflection experiment and uniaxial tensile test by adopting a white light interferometer having sub-nanometer out-of-plane displacement resolution. The freestanding aluminium specimens are tested to verity the effectiveness of the test method developed and get the tensile properties. The specimens are 0.5 rum wide, $1{\mu}m$ thick and fabricated through MEMS processes including sputtering. 1 to 5 specimens are fabricated on Si dies. The membrane deflection experiments are carried out by using a homemade tester consisted of a motor-driven loading tip, a load cell, and 6 DOF alignment stages. The test system is compact enough to set it up beneath a commercial white light interferometric microscope. The white light fringes are utilized to align a specimen with the tester. The Young's modulus and yield point stress of the aluminium film are 62 GPa and 247 MPa, respectively.