• Bulletin of the Korean Chemical Society
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• v.31 no.2
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• pp.344-350
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• 2010

The improved photocatalytic performance of a carbon/$TiO_2$ composite was studied for the Bisphenol A (BPA) decomposition. Titanium tetraisopropoxide (TTIP) and a rice husk from Korea were heterogeneously mixed as the titanium and carbon sources, respectively, for 3 h at room temperature, and then thermally treated at $600^{\circ}C$ for 1 h in $H_2$ gas. The transmission electron microscopy (TEM) images revealed that the bulk carbon partially covered the $TiO_2$ particles, and the amount that was covered increased with the addition of the rice husk. The acquired carbon/$TiO_2$ composite exhibited an anatase structure and a novel peak at $2{\theta}=32^{\circ}$, which was assigned to bulk carbon. The specific surface area was significantly enhanced to 123~164 $m^2/g$ in the carbon/$TiO_2$ composite, compared to $32.43m^2/g$ for the pure $TiO_2$. The X-ray photoelectron spectroscopy (XPS) results showed that the Ti-O bond was weaker in the carbon/$TiO_2$ composite than in the pure $TiO_2$, resulting in an easier electron transition from the Ti valence band to the conduction band. The carbon/$TiO_2$ composite absorbed over the whole UV-visible range, whereas the absorption band in the pure$TiO_2$ was only observed in the UV range. These results agreed well with an electrostatic force microscopy (EFM) study that showed that the electrons were rapidly transferred to the surface of the carbon/$TiO_2$ composite compared to the pure $TiO_2$. The photocatalytic performance of the BPA removal was optimized at a Ti:C ratio of 9.5:0.5, and this photocatalytic composite completely decomposed 10.0 ppm BPA after 210 min, whereas the pure $TiO_2$ achieved no more than 50% decomposition under any conditions.

• Bulletin of the Korean Chemical Society
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• v.29 no.8
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• pp.1491-1494
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• 2008

A novel platinum aminoalkoxide complex, Pt$(dmamp)_2$ has been prepared by the reaction of cis-$(py)_2PtI_2$ with two equivalents of Na(dmamp) (dmamp = 1-dimethylamino-2-methyl-2-propanolate). Single-crystal X-ray crystallographic analysis shows that the Pt(dmamp)2 complex keeps a square planar geometry with each two nitrogen atoms and two oxygen atoms having trans configuration. Platinum films have been deposited on TaN/ Ta/Si substrates by metal organic chemical vapor deposition (MOCVD) using Pt$(dmamp)_2$. As-deposited platinum thin films did not contain any appreciable amounts of impurities except a little carbon. As the deposition temperature was increased, the films resistivity and deposition rate increased. The electrical resistivity (13.6 $\mu\Omega$cm) of Pt film deposited at 400 ${^{\circ}C}$ is a little higher than the bulk value (10.5 $\mu\Omega$cm) at 293 K. The chemical composition, crystalline structure, and morphology of the deposited films were investigated by X-ray photoelectron spectroscopy, X-ray diffraction, and atomic force microscopy.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.375.2-375.2
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• 2016

그래핀(Graphene)은 원자 한 층 두께의 얇은 특성에 기인하여 우수한 투과도(~97.3%)를 나타내며, 높은 전자 이동도($200,000cm^2V^{-1}s^{-1}$)로 인하여 전기 전도도가 우수한 2차원 전자소재이다. 또한 유연하고 우수한 기계적 물성을 가지고 있어 실제로 다양한 소자에서 활용되고 있다. 그래핀을 이용하여 다양한 소자로 응용하기 위한 과정 중 하나인 포토리소그래피 공정(Photolithography process)은 원하는 패턴을 만들기 위해 제작하고자 하는 기판 위에 포토레지스트(Photoresist)를 코팅하는 과정을 거치게 된다. 하지만 이러한 과정은 소자 제작에 있어서 포토레지스트 잔여물을 남기게 된다. 그래핀 위에 남은 포토레지스트 잔여물은 그래핀의 우수한 전기적 특성을 저하시켜 소자특성에 불이익을 주게 된다. 본 연구에서는 수소 플라즈마를 이용하여 그래핀 위에 남은 중합체(Polymer) 잔여물을 제거한다. 사용한 그래핀은 화학 기상 증착법(Chemical vapor deposition)을 이용하여 성장시켰으며, PMMA(Poly(methyl methacrylate))를 이용하여 이산화규소(silicon dioxide) 기판에 전사하였다. 그래핀의 손상 없이 중합체 잔여물을 제거하기 위해 플라즈마 처리시간을 15초부터 1분까지 늘려가며 연구를 진행하였으며, 플라즈마 처리 시간에 따른 중합체 잔여물의 제거 정도와 그래핀의 보존 여부를 확인하기 위해 라만 분광법(Raman spectroscopy)과 원자간력현미경(Atomic force microscopy)을 사용하였다. 본 연구 결과를 통해 간단한 플라즈마 처리로 보다 나은 특성의 그래핀 소자를 얻게 됨으로써, 향상된 특성을 가진 그래핀 소자로 산업적 응용 가능성을 높일 수 있을 것이라 생각된다.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.281.1-281.1
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• 2016

Transition metal dichalcogenides (TMDCs) are promising layered structure materials for next-generation nano electronic devices. Many investigation on the FET device using TMDCs channel material have been performed with some integrated approach. To use TMDCs for channel material of top-gate thin film transistor(TFT), the study on high-k dielectrics on TMDCs is necessary. However, uniform growth of atomic-layer-deposited high-k dielectric film on TMDCs is difficult, owing to the lack of dangling bonds and functional groups on TMDC's basal plane. We demonstrate the effect of remote oxygen plasma pretreatment of large area synthesized few-layer MoSe2 on the growth behavior of Al2O3, which were formed by atomic layer deposition (ALD) using tri-methylaluminum (TMA) metal precursors with water oxidant. We investigated uniformity of Al2O3 by Atomic force microscopy (AFM) and Scanning electron microscopy (SEM). Raman features of MoSe2 with remote plasma pretreatment time were obtained to confirm physical plasma damage. In addition, X-ray photoelectron spectroscopy (XPS) was measured to investigate the reaction between MoSe2 and oxygen atom after the remote O2 plasma pretreatment. Finally, we have uniform Al2O3 thin film on the MoSe2 by remote O2 plasma pretreatment before ALD. This study can provide interfacial engineering process to decrease the leakage current and to improve mobility of top-gate TFT much higher.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.766-768
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• 2004

Rubbed films of a series of poly(p-phenylene 3,6-bis(4-(n-alkyloxy)phenyloxy)pyromellitimide)s (Cn-PMDA-PDA PIs), which are well-defined brush PIs composed of two aromatic-aliphatic bristles per repeat unit of a fully rodlike backbone, were investigated in detail using atomic force microscopy (AFM), optical retardation analysis and linearly polarized infrared (IR) spectroscopy in order to elucidate their surface morphology and molecular orientation. The liquid crystal (LC) alignment behavior and the anchoring energy of LC molecules on the rubbed films were also determined.

• Bulletin of the Korean Chemical Society
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• v.23 no.2
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• pp.225-228
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• 2002

Amorphous $Ga_2O_3$ films have been grown on Si(100) substrates by metal organic chemical vapor deposition (MOCVD) using gallium isopropoxide, $Ga(O^iPr)_3$, as single precursor. Deposition was carried out in the substrate temperature range 400-800 $^{\circ}C$. X-ray photoelectron spectroscopy (XPS) analysis revealed deposition of stoichiometric $Ga_2O_3$ thin films at 500-600 $^{\circ}C$. XPS depth profiling by $Ar^+$ ion sputtering indicated that carbon contamination exists mostly in the surface region with less than 3.5% content in the film. Microscopic images of the films by scanning electron microscopy (SEM) and atomic force microscopy (AFM) showed formation of grains of approximately 20-40 nm in size on the film surfaces. The root-mean-square surface roughness from an AFM image was ${\sim}10{\AA}$. The interfacial layer of the $Ga_2O_3$/Si was measured to be ${\sim}35{\AA}$ thick by cross-sectional transmission electron microscopy (TEM). From the analysis of gaseous products of the CVD reaction by gas chromatography-mass spectrometry (GC-MS), an effort was made to explain the CVD mechanism.

• Laser Solutions
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• v.16 no.4
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• pp.1-6
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• 2013

Femtosecond laser patterning of ITO on a touch screen panel with a shaped fs laser beam was investigated. A quasi flat-top beam was formed using a variable mask and a planoconvex lens. The spatial profile of the original Gaussian beam and the shaped beam were monitored by a CCD beam profiler. The laser patterned ITO film was examined using an optical microscope, Scanning Electron Microscope (SEM) with Energy Dispersive X-ray Spectroscopy (EDS), and Atomic Force Microscope (AFM). It turned out that the quality of the ITO pattern fabricated by a shaped beam is superior to that of the pattern without beam shaping in terms of debris generation, height of the craters, and homogeneity of the bottom. Optimum processing window was determined at the laser irradiance exhibiting 100% removal of Sn. The removal rate of In was measured to be 83%.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.129.1-129.1
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• 2016

반도체, 디스플레이, PC 등 전자기기의 경우 소자 내 발생된 열로 인해 기기의 성능 및 효율, 수명 등이 감소하기 때문에 이러한 내부 열을 외부로 방출시켜줄 필요가 있다. 일반적으로 heat pipe나 냉각 팬(fan) 등의 외부장치에 의해 강제적으로 냉각해주는 기술이 있지만 휴대용 디바이스와 같이 작은 전자기기의 경우 소자 자체적으로 열전도 특성이 뛰어난 기판을 사용하여 열전도에 의해 열이 소자 밖으로 방출될 수 있도록 방열 설계를 해주어야 한다. 따라서 소자 전체를 지지해주고 열전도에 의해 방열 기능을 해주는 방열기판에 대한 관심이 증가하고 있다. 현재 가장 많이 사용되어지는 세라믹 방열기판으로는 알루미나가 있지만 보다 소자의 집적화와 고성능화로 인하여 열전도도가 높은 질화규소 기판의 요구가 증대되고 있다. 하지만 이러한 질화규소기판에 금속전극을 형성하는 기술은 종래의 알루미나 기판에 이용한 DPC(Direct Plated Copper), DBC(Direct Bonded Copper)기술을 적용할 수 없다. 그래서 현재는 메탈블레이징을 이용하여 전극을 형성하지만 공정비용 및 대형기판에 형성이 어려운 단점이 있다. 따라서, 본 연구에서는 질화규소 방열기판에 전기화학공정을 통하여 밀착력이 우수한 금속 전극 회로층 형성에 대한 연구를 진행하였다. 질화규소 방열기판에 무전해 Ni 도금을 통하여 금속층을 형성하는데 이 때 세라믹 기판과 금속층 사이의 낮은 밀착력을 향상시키기 위해 습식공정을 통하여 표면처리를 진행하였다. 또한 촉매층을 $Pd-TiO_2$ 층을 이용하여 무전해 도금공정을 이용하여 Ni, 전극층을 형성하였다. 질화규소 표면에 OH기 형성을 확인하기 위해 FT-IR(Fourier-transform infrared spectroscopy)분석을 실시하였으며 OH 그룹 형성 및 silane의 화학적 결합으로 인해 금속 전극층의 밀착력이 향상된 것을 cross hatch test 및 scratch test를 통해 확인하였고 계면 및 표면형상 특성 등을 분석하기 위해 TEM(Transmission electron microscopy), SEM(Scanning electron microscopy), AFM(Atomic-force microscopy)등의 장비를 이용하였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.17.2-17.2
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• 2011

Double-walled carbon nanotubes (DWCNTs) were grown with vertical alignment on a Si wafer by using catalytic thermal chemical vapor deposition. This study investigated the effect of pre-annealing time of catalyst on the types of CNTs grown on the substrate. The catalyst layer is usually evolved into discretely distributed nanoparticles during the annealing and initial growth of CNTs. The 0.5-nm-thick Fe served as a catalyst, underneath which Al was coated as a catalyst support as well as a diffusion barrier on the Si substrate. Both the catalyst and support layers were coated by using thermal evaporation. CNTs were synthesized for 10 min by flowing 60 sccm of Ar and 60 sccm of H2 as a carrier gas and 20 sccm of C2H2 as a feedstock at 95 torr and $750^{\circ}C$. In this study, the catalyst and support layers were subject to annealing for 0~420 sec. As-grown CNTs were characterized by using field emission scanning electron microscopy, high resolution transmission electron microscopy, Raman spectroscopy, and atomic force microscopy. The annealing for 90~300 sec caused the growth of DWCNTs as high as ~670 ${\mu}m$ for 10 min while below 90 sec and over 420 sec 300~830 ${\mu}m$-thick triple and multiwalled CNTs occurred, respectively. Several radial breathing mode (RBM) peaks in the Raman spectra were observed at the Raman shifts of 112~191 cm-1, implying the presence of DWCNTs, TWCNTs, MWCNTs with the tube diameters 3.4, 4.0, 6.5 nm, respectively. The maximum ratio of DWCNTs was observed to be ~85% at the annealing time of 180 sec. The Raman spectra of the as-grown DWCNTs showed low G/D peak intensity ratios, indicating their low defect concentrations. As increasing the annealing time, the catalyst layer seemed to be granulated, and then grown to particles with larger sizes but fewer numbers by Ostwald ripening.

• Korean Journal of Materials Research
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• v.24 no.12
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• pp.682-688
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• 2014

Physical and chemical changes in a polished wafer and in $2.5{\mu}m$ & $4{\mu}m$ epitaxially grown Si layer wafers (Epilayer wafer) after surface treatment were investigated. We characterized the influence of surface treatment on wafer properties such as surface roughness and the chemical composition and bonds. After each surface treatment, the physical change of the wafer surface was evaluated by atomic force microscopy to confirm the surface morphology and roughness. In addition, chemical changes in the wafer surface were studied by X-ray photoemission spectroscopy measurement. Changes in the chemical composition were confirmed before and after the surface treatment. By combined analysis of the physical and chemical changes, we found that diluted hydrofluoric acid treatment is more effective than buffered oxide etching for $SiO_2$ removal in both polished and Epi-Layer wafers; however, the etch rate and the surface roughness in the given treatment are different among the polished $2.5{\mu}m$ and $4{\mu}m$ Epi-layer wafers in spite of the identical bulk structural properties of these wafers. This study therefore suggests that independent surface treatment optimization is required for each wafer type, $2.5{\mu}m$ and $4{\mu}m$, due to the meaningful differences in the initial surface chemical and physical properties.