• 한국공작기계학회논문집
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• 제17권1호
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• pp.120-125
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• 2008

A flip-chip bonding system using DPSS(Diode Pumped Solid State) Nd:YAG laser(wavelength : 1064nm) which shows a good quality in fine pitch bonding is developed. This laser bonder can transfer beam energy to the solder directly and melt it without any physical contact by scanning a bare chip. By using a laser source to heat up the solder balls directly, it can reduce heat loss and any defects such as bridge with adjacent solder, overheating problems, and chip breakage. Comparing to conventional flip-chip bonders, the bonding time can be shortened drastically. This laser precision micro bonder can be applied to flip-chip bonding with many advantage in comparison with conventional ones.

• 마이크로전자및패키징학회지
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• 제18권3호
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• pp.67-74
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• 2011

Keys to high wiring density semiconductor packages include flip-chip bonding and build-up substrate technologies. The current issues are the establishment of a fine pitch flip-chip bonding technology and a low coefficient of thermal expansion (CTE) substrate technology. In particular, electromigration and thermomigration in fine pitch flipchip joints have been recognized as a major reliability issue. In this paper, electromigration and thermomigration in Cu/Sn-3Ag-0.5Cu (SAC305)/Cu flip-chip joints and electromigration in Cu/In/Cu flip chip joints are investigated. In the electromigration test, a large electromigration void nucleation at the cathode, large growth of intermetallic compounds (IMCs) at the anode, a unique solder bump deformation towards the cathode, and the significantly prolonged electromigration lifetime with the underfill were observed in both types of joints. In addition, the effects of crystallographic orientation of Sn on electromigration were observed in the Cu/SAC305/Cu joints. In the thermomigration test, Cu dissolution was accelerated on the hot side, and formation of IMCs was enhanced on the cold side at a thermal gradient of about $60^{\circ}C$/cm, which was lower than previously reported. The rate of Cu atom migration was found comparable to that of electromigration under current conditions.

• 전자공학회논문지
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• 제54권6호
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• pp.25-29
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• 2017

본 논문에서는 듀로이드와 FR4를 기판으로 하는 재배선층 위에 정전 구동 방식의 RF MEMS 스위치와 승압 DC-DC 컨버터를 결합하는 연구를 진행하였다. 상용 PCB(Printed Circuit Board) 공정으로 듀로이드와 GCPW 전송 선로 조합의 재배선층과 FR4와 CPW 전송 선로 조합의 재배선층을 제작하였다. 상용 PCB 공정 특성에 의하여 전송 선로의 특성 임피던스는 56옴, 59옴 이었으며 이에 대하여 비교 분석하였다. 듀로이드 기판은 유전상수가 작고 두께가 얇으며 GCPW를 적용하였기 때문에 상대적으로 유전상수가 크고 두께가 두꺼우며 CPW 전송 선로를 적용한 FR4 기판보다 6GHz 대역에서 삽입 손실은 약 2.08dB, 반사 손실은 약 3.91dB, 신호 분리도는 약 3.33dB 우수한 것을 확인하였다.