• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.5
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• pp.559-563
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• 2011

Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1673-1678
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• 2007

The use of flip-chip type electronic package offers numerous advantages such as reduced thickness, improved environmental compatibility, and downed cost. Despite numerous benefits, flip-chip type packages bare several reliability problems. The most critical issue among them is their electrical performance deterioration upon consecutive thermal cycles attributed to gradual delamination growth through chip and adhesive film interface induced by CTE mismatch driven shear and peel stresses. The electronic package in use is heated continuously by itself. When the crack at a weak site of the electronic package occurs, thermal deformationon the chip side is changed. Therefore, we can measure these micro deformations by using Moire interferometry and find out the crack length.

• Progress in Superconductivity and Cryogenics
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• v.7 no.1
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• pp.17-20
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• 2005

We has designed, fabricated, and measured a Single flux quantum (SFQ) toggle flip-flop (TFF). The TFF is widely used in superconductive digital electronics circuits. Many digital devices, such as frequency counter, counting ADC and program counter be used TFF Specially, a program counter may be constructed based on TFF We have designed the newly TFF and obtained high bias margins on test. In this work, we used two circuit simulation tools, WRspice and Julia, as circuit optimization tools. We used XIC for a layout tool. Newly designed TFF had minimum bias margins of +/- $37\%$ and maximum bias margins of +/-$37\%$(enhanced from +/- $37\%$). The designed circuits were fabricated by using Nb technology The test results showed that the re-optimized TFF operated correctly on 100kHz and had a very wide bias margins of +/- $53\%$.

• Archives of Plastic Surgery
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• v.46 no.2
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• pp.176-180
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• 2019

Post-traumatic soft tissue defects sometimes require sequential flap coverage to achieve complete healing. In the era of propeller flaps, which were developed to reduce donor site morbidity, Feng et al. introduced the concept of the free-style puzzle flap, in which a previously harvested flap becomes its own donor site by recycling the perforator. However, when a perforator cannot be found with a Doppler device, we suggest performing a new type of flap, the flip-flap puzzle flap, which combines two concepts: the free-style puzzle flap and the flip-flap flap described by Voche et al. in the 1990s. We present the cases of three patients who achieved complete healing through this procedure.

• Journal of Korea Entertainment Industry Association
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• v.13 no.4
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• pp.241-253
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• 2019

The purpose of this study was to examine the phenomena that occurred when the students were practicing flip-learning lessons and to present the good points and the unsatisfactory points to improve the students' learning pleasure. Therefore, it is aimed to provide the basic data and the advantages and disadvantages which are needed to apply the flip learning method which is newly emerging recently to the university instruction. The method of this study was a questionnaire survey to understand the perception of flip learning. Based on the results of this study, the following conclusions are presented. First, the experience of flip learning instruction was first encountered by 50% of college students. Second, the students showed a very low tendency in practicing the flip learning instruction(video watching) the instructor intended. Third, college students have a habit of learning that they are not ready for pre-study of the subject. Fourth, the perception of flip learning lesson through the provision of video was highly positive. Fifthly, flip learning lessons have the advantage of being able to learn regardless of the time and place that they have, but they are not actively involved if they are not actually reflected in the test or grades. In conclusion, it was found that college students became accustomed to the incentive-style lessons due to the application of various learning techniques from elementary school age, making it difficult to participate in voluntary learning.

• Journal of Korean society of Dental Hygiene
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• v.20 no.2
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• pp.155-166
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• 2020

Objectives: The purpose of this study is to prove, through the design and operation of a teaching learning model for clinical dental hygiene and practice III, the effectiveness of the flipped learning PARTNER model. Methods: A professional council was formed, composed of three professors of dental hygiene and one professor of education; each member was an expert with a Ph.D. From December 2018 to February 2019. Results: Learning preferences for the clinical learning hygiene curriculum based on flip learning showed that it had higher accessibility than traditional teaching methods. Subjects' motivation to learn was improved through flip learning, their critical thinking ability was improved through active discussion and flip team discussion, and their self-directed learning ability was also improved. Participation increased through flipped learning, and subjects' skill abilities showed their highest score by improving their performance through the whole lecture. A high satisfaction of 4.54 out of 5 points was achieved. Conclusions: It was confirmed that the development and operation of a flipped learning-based clinical hygiene curriculum can provide an effective and satisfactory learning process.

• Biomolecules & Therapeutics
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• v.23 no.1
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• pp.31-38
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• 2015

Histone acetylation plays a critical role in the regulation of transcription by altering the structure of chromatin, and it may influence the resistance of some tumor cells to tumor necrosis factor (TNF)-related apoptosis-inducing ligand (TRAIL) by regulating the gene expression of components of the TRAIL signaling pathway. In this study, we investigated the effects and molecular mechanisms of trichostatin A (TSA), a histone deacetylase inhibitor, in sensitizing TRAIL-induced apoptosis in Caki human renal carcinoma cells. Our results indicate that nontoxic concentrations of TSA substantially enhance TRAIL-induced apoptosis compared with treatment with either agent alone. Cotreatment with TSA and TRAIL effectively induced cleavage of Bid and loss of mitochondrial membrane potential (MMP), which was associated with the activation of caspases (-3, -8, and -9) and degradation of poly (ADP-ribose) polymerase (PARP), contributing toward the sensitization to TRAIL. Combined treatment with TSA and TRAIL significantly reduced the levels of the cellular Fas-associated death domain (FADD)-like interleukin-$1{\beta}$-converting enzyme (FLICE) inhibitory protein (c-FLIP), whereas those of death receptor (DR) 4, DR5, and FADD remained unchanged. The synergistic effect of TAS and TRAIL was perfectly attenuated in c-$FLIP_L$-overexpressing Caki cells. Taken together, the present study demonstrates that down-regulation of c-FLIP contributes to TSA-facilitated TRAIL-induced apoptosis, amplifying the death receptor, as well as mitochondria-mediated apoptotic signaling pathways.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.49-56
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• 2012

Recently, by the trends of electronic package to be smaller, thinner and more integrative, fine bump is required. but It can result in the electrical short by reduced cross-section of UBM and diameter of bump. Especially, the formation of IMCs and KV can have a significant affects about electrical and mechanical properties. In this paper, we analyzed the thermal deformation of flip-chip bump by using FEM. Through Thermal Cycling Test (TCT) of flip-chip package, We analyzed the properties of the thermal deformation. and We confirmed that the thermal deformation of the bump can have a significant impact on the driving system. So we selected IMCs thickness and bump diameter as variable which is expected to have implications for characteristics of thermal deformation. and we performed analysis of temperature, thermal stress and thermal deformation. Then we investigated the cause of the IMC's effects.

• Journal of Welding and Joining
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• v.33 no.5
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• pp.41-46
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• 2015

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

• Journal of Korean Society of Coastal and Ocean Engineers
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• v.34 no.4
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• pp.119-127
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• 2022

To investigate varying wave impact pressure exerting at the crest wall of rubble mound seawall, depending on breaking wave properties, regular waves with different wave periods were generated. Wave velocity fields and void fraction were measured using bubble image velocimetry and simple combined wave gauge system (Na and Son, 2021). For the waves with shorter wave period, maximum horizontal velocity was less reduced compared to incident wave speed while breaking-induced air entrainment was occurred intensely, leading to a significant reduction of wave impact pressure at the crest wall. For the waves with longer wave periods, less air wave entrained and the wave structure followed a flip-through mode (Cooker and Peregrine, 1991), resulting in an abrupt increase of the impact pressure.