• Bulletin of the Korean Chemical Society
• /
• v.27 no.1
• /
• pp.87-92
• /
• 2006

Fas-associated death domain protein (FADD) recruits and activates procaspase-8 through interactions between the death effector domains of these two proteins. Cellular FLICE-inhibitory protein (c-FLIP) was identified as a molecule with sequence homology to caspase-8. It has been postulated that c-FLIP prevents formation of the competent death-inducing signaling complex in a ligand-dependent manner, through its interaction with FADD and/or caspase-8. However, the interaction of FADD and $c-FLIP_s$ (short form) in apoptosis signaling has been controversially discussed. We show the purification and the characterization of human full-length FADD and $c-FLIP_s$ expressed in Escherichia coli. The purified FADD and $c-FLIP_s$ are shown as homogeneity, respectively, in SDS-PAGE analysis and light-scattering measurements. The folding properties of the $\alpha$-helical structure of FADD and the super-secondary structure of $c-FLIP_s$ proteins were characterized by circular dichroism spectroscopy. Furthermore, we report here a series of biochemical and biophysical data for FADD-$c-FLIP_s$ binding in vitro. The binding of both FADD and $c-FLIP_s$ proteins was detected by BIAcore biosensor, fluorescence measurement, and size-exclusion column (SEC).

• Journal of the Korean Society of Fisheries and Ocean Technology
• /
• v.52 no.4
• /
• pp.308-317
• /
• 2016

The tail flip of the decapod shrimp is a main feature in escaping behavior from the mesh of the codend in the trawl. The characteristics of tail flip in target prawn was observed and analyzed in a water tunnel in respect of flow condition and mesh penetration by a high speed video camera (500 fps). The tail bending angle or bending time in static water was significantly different than in flow water (0.7 m/s) and resultantly the angular velocity in static water was significantly higher than in flow water when carapace was fixed condition. When escaping through vertical traverse net panel in water flow the relative moving angle and relative passing angle to flow direction during tail flip, it significantly decreases the number of shrimps escaping than the case of blocking shrimp. The bending angles of tail flip between net blocking and passing through mesh were not significantly different while the bending time of shrimp passing through mesh was significantly longer than when shrimp blocking on the net. Accordingly the angular velocity of passing through mesh was significantly slower than blocking on the net although the angular velocity of the tail flip was not significantly related with carapace length. The main feature of tail flip for mesh penetration was considered as smaller diagonal direction as moving and passing angle in relation to net panel as right angle to flow direction rather than the angular velocity of tail flip.

• BMB Reports
• /
• v.47 no.9
• /
• pp.488-493
• /
• 2014

Adaptor protein FADD forms the death inducing signaling complex (DISC) by recruiting the initiating caspases-8 and -10 through homotypic death effector domain (DED) interactions. Cellular FLICE-inhibitory protein (c-FLIP) is an inhibitor of death ligand-induced apoptosis downstream of death receptors, and FADD competes with procaspase-8/10 for recruitment for DISC. However, the mechanism of action of FADD and c-FLIP proteins remain poorly understood at the molecular level. In this study, we provide evidence indicating that the death effector domain (DED) of FADD interacts directly with the death effector domain of human c-FLIP. In addition, we use homology modeling to develop a molecular docking model of FADD and c-FLIP proteins. We also find that four structure-based mutants (E80A, L84A, K169A and Y171A) of c-FLIP DEDs disturb the interaction with FADD DED, and that these mutations lower the stability of the c-FLIP DED.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.15 no.4
• /
• pp.16-22
• /
• 2016

This study is a structural analysis of 3" Cryogenic Safety Breakaway Coupling using a manufactured product from KLAW Company. Breakaway coupling is very important in the pipe system, especially when transporting fuel or gas in the pipeline. For the analysis of the patent infringement target, Dover and KLAW Company's technologies (US 08127785, EP 0764809) were analyzed. Finally, the flip-flap valve overlap was measured after combining the breakaway coupling through 3D modeling, and the valve overlap had a 0.7mm measurement value from the height gauge. The safety breakaway coupling consisted of a total of 62 pieces (body: 42, valve module: 21).

• Asian Pacific Journal of Cancer Prevention
• /
• v.16 no.6
• /
• pp.2251-2256
• /
• 2015

To study effects of cellular FLICE (FADD-like IL-$1{\beta}$-converting enzyme)-inhibitory protein (c-FLIP) inhibition by RNA interference (RNAi) on sensitivity of U2OS cells to tumor necrosis factor (TNF)-related apoptosis-inducing ligand (TRAIL)-induced apoptosis, plasmid pSUPER-c-FLIP-siRNA was constructed and then transfected into U2OS cells. A stable transfection cell clone U2OS/pSUPER-c-FLIP-siRNA was screened from the c-FLIP-siRNA transfected cells. RT-PCR and Western blotting were applied to measure the expression of c-FLIP at the levels of mRNA and protein. The results indicated that the expression of c-FLIP was significantly suppressed by the c-FLIP-siRNA in the cloned U2OS/pSUPER-c-FLIP-siRNA as compared with the control cells of U2OS/pSUPER. The cloned cell line of U2OS/pSUPER-c-FLIP-siRNA was further examined for TRAILinduced cell death and apoptosis in the presence of a pan-antagonist of inhibitor of apoptosis proteins (IAPs) AT406, with or without 4 hrs pretreatment with rocaglamide, an inhibitor of c-FLIP biosynthesis, for 24 hrs. Cell death effects and apoptosis were measured by the methods of MTT assay with 3-(4,5-dimethylthiazol-2-yl)-2,5-diphenyltetrazolium bromide and flow cytometry, respectively. The results indicated that TRAIL-induced cell death in U2OS/pSUPER-c-FLIP-siRNA was increased compared with control cells U2OS/pSUPER in the presence or absence of AT406. Flow cytometry indicated that TRAIL-induced cell death effects proceeded through cell apoptosis pathway. However, in the presence of rocaglamide, cell death or apoptotic effects of TRAIL were similar and profound in both cell lines, suggesting that the mechanism of action for both c-FLIP-siRNA and rocaglamide was identical. We conclude that the inhibition of c-FLIP by either c-FLIP-siRNA or rocaglamide can enhance the sensitivity of U2OS to TRAIL-induced apopotosis, suggesting that inhibition of c-FLIP is a good target for anti-cancer therapy.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.21 no.2
• /
• pp.225-231
• /
• 2012

Drop simulations of the board level in the flip chips with solder joints have been highlighted for years, recently. Also, through the study on the life prediction of thermal fatigue in the flip chips considering underfill, its importance has been issued greatly. In this paper, dynamic analysis using the implicit method in the Finite Element Analysis (FEA) is carried out to assess the factors effecting on flip chips considering underfill. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard is modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. Modal analysis is simulated to find out the relation between drop impact and vibration of the board system.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.16 no.5
• /
• pp.134-139
• /
• 2007

This paper presents a computer-based analysis on the thermal shock characteristics of Pb-free solder joints and UBM in flip chip assemblies. Among four types of popular UBM systems, TiW/Cu system with 95.5Sn-3.9Ag-0.6Cu solder joints was chosen for simulation. A simple 3D finite element model was first created only including silicon die, mixture between underfill and solder joints, and substrate. The displacements due to CTE mismatch between silicon die and substrate was then obtained through FE analysis. Finally, the obtained displacements were applied as mechanical loads to the whole 2D FE model and the characteristics of flip chip assemblies were analyzed. In addition, based on the hyperbolic sine law, the accumulated creep strain of Pb-free solder joints was calculated to predict the fatigue life of flip chip assemblies under thermal shock environments. The proposed method for fatigue life prediction will be evaluated through the cross check of the test results in the future work.

• Journal of Institute of Control, Robotics and Systems
• /
• v.15 no.9
• /
• pp.916-921
• /
• 2009

The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.

• Journal of the Microelectronics and Packaging Society
• /
• v.12 no.1 s.34
• /
• pp.9-16
• /
• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• 제어로봇시스템학회:학술대회논문집
• /
• 2002.10a
• /
• pp.109.1-109
• /
• 2002

This paper presents a macro/micro flip chip mounting head system for precise force control. In the proposed macro/ micro system, the macro actuator is conventional do servomotor with a ball screw mechanism and the micro actuator is a voice coil motor(VCM) that consists of four NdFeB magnets and a winded moving coil. For force control, a sensitive strain-gauge force sensor is mounted in the micro actuator. Through harmonic motion between macro and micro actuator, we would like to get precise contact force control when small sized flip chip is mounted on flexible substrate in high speed. In order to show the effectiveness of the proposed macro/micro flip chip mounting head system, we com...