• Journal of Welding and Joining
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• 제31권3호
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• pp.84-88
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• 2013

These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

• 한국경영과학회:학술대회논문집
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• 대한산업공학회/한국경영과학회 1996년도 춘계공동학술대회논문집; 공군사관학교, 청주; 26-27 Apr. 1996
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• pp.141-146
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• 1996

Hand posture and force, which define aspects of the way an object is grasped, are features of robotics manipulation. A means for specifying these grasping "flavors" has been developed that uses an instrumented glove equipped with joint and force sensors. The new grasp specification system is being used at the Pennsylvania State University (Penn State) in a Virtual Reality based Point-and-Direct(VR-PAD) robotics implementation. In the Computer Integrated Manufacturing (CIM) Laboratory at Penn State, hand posture and force data were collected for manipulating bricks and other items that require varying amounts of force at multiple pressure points. The feasibility of measuring desired grasp characteristics was demonstrated for a modified Cyberglove impregnated with FSR (Force Sensitive Resistor) pressure sensors in the fingertips. A joint/force model relating the parameters of finger articulation and pressure to various lifting tasks was validated for the instrumented "wired" glove. Operators using such a modified glove may ultimately be able to configure robot grasping tasks in environments involving hazardous waste remediation, flexible manufacturing, space operations and other flexible robotics applications. In each case, the VR-PAD approach improved the computational and delay problems of real-time multiple-degree-of-freedom force feedback telemanipulation.ck telemanipulation.

• 대한인간공학회지
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• 제15권2호
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• pp.165-176
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• 1996

Hand posture and force, which define aspects of the way an object is grasped, are features of robotic manipulation. A means for specifying these grasping "flavors" has been developed that uses an instrumented glove equipped with joint and force sensors. The new grasp specification system is being used at the Pennsylvania State University (Penn State) in a Virtual Reality based Point-and-Direct (VR-PAD) robotics implementation. In the Computer Integrated Manufacturing (CIM) Laboratory at Penn State, hand posture and force data were collected for manipulating bricks and other items that require varying amounts of force at multiple pressure points. The feasibility of measuring desired grasp characteristics was demonstrated for a modified Cyberglove impregnated with FSR (Force Sensitive Resistor) pressure sensors in the fingertips. A joint/force model relating the parameters of finger articulation and pressure to various lifting tasks was validated for the instrumented "wired" glove. Operators using such a modified glove may ultimately be able to configure robot grasping tasks in environments involving hazardous waste remediation, flexible manufactruing, space operations and other flexible robotics applications. In each case, the VR-PAD approach improved the computational and delay problems of real-time multiple- degree-of-freedom force feedback telemanipulation.

• 마이크로전자및패키징학회지
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• 제22권3호
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• pp.39-44
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• 2015

이방성 전도접착제를 이용하여 Cu/Au 칩 범프를 Cu 기판 배선에 플립칩 실장한 접속부에 대해 CNT-Ag 복합패드가 접속저항에 미치는 영향을 연구하였다. CNT-Ag 복합패드가 내재된 플립칩 접속부가 CNT-Ag 복합패드가 없는 접속부에 비해 더 낮은 접속저항을 나타내었다. 각기 25 MPa, 50 MPa 및 100 MPa의 본딩압력에서 CNT-Ag 복합패드가 내재된 접속부는 $164m{\Omega}$, $141m{\Omega}$ 및 $132m{\Omega}$의 평균 접속저항을 나타내었으며, CNT-Ag 복합패드를 형성하지 않은 접속부는 $200m{\Omega}$, $150m{\Omega}$ 및 $140m{\Omega}$의 평균 접속저항을 나타내었다.

• 한국의류학회지
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• 제47권2호
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• pp.311-322
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• 2023

In this study, the properties of various material combinations were evaluated and an ideal material for fabricating protection pads for women's army combat uniforms was determined. Eight specimens were used for the evaluation: two types of materials, namely thermoplastic polyurethane for 3D printing, T and ethylene-vinyl acetate, E; two infill densities, namely 10%, 10 and 30%, 30; two types of pad designs, i.e., without holes, A and with holes, B; 2×2×2=8 and control E. The tensile strength, flexural strength, impact absorption, and weight of these specimens were evaluated. Results revealed that E was the most flexible material; however, its tensile strength and impact absorption were very low. Protection pads made from T (T-10A, T-10B, T-30A, and T-30B) had excellent tensile strength and impact absorption; however, they had low performance in ease of movement. Alternatively, protection pad with holes and an infill density of 30% produced using a combination of T and E had a high initial tensile modulus and exhibited excellent impact absorption. Moreover, it was flexible and light, which satisfies the standards and conditions required by protection pads. However, if T-E-10A and T-E-30B exhibited low impact absorption, as required, they can be regarded as appropriate materials for protection pads.

• ETRI Journal
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• 제37권2호
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• pp.387-394
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• 2015

A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than $150^{\circ}C$. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than $150^{\circ}C$. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip-chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a $20{\mu}m$ pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at $130^{\circ}C$.

• ETRI Journal
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• 제38권6호
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• pp.1163-1171
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• 2016

Integration technologies involving flexible substrates are receiving significant attention owing the appearance of new products regarding wearable and Internet of Things technologies. There has been a continuous demand from the industry for a reliable bonding method applicable to a low-temperature process and flexible substrates. Up to now, however, an anisotropic conductive film (ACF) has been predominantly used in applications involving flexible substrates; we therefore suggest low-temperature lead-free soldering and bonding processes as a possible alternative for flex-on-flex applications. Test vehicles were designed on polyimide flexible substrates (FPCBs) to measure the contact resistances. Solder bumping was carried out using a solder-on-pad process with Solder Bump Maker based on Sn58Bi for low-temperature applications. In addition, thermocompression bonding of FPCBs was successfully demonstrated within the temperature of $150^{\circ}C$ using a newly developed fluxing underfill material with fluxing and curing capabilities at low temperature. The same FPCBs were bonded using commercially available ACFs in order to compare the joint properties with those of a joint formed using solder and an underfill. Both of the interconnections formed with Sn58Bi and ACF were examined through a contact resistance measurement, an $85^{\circ}C$ and 85% reliability test, and an SEM cross-sectional analysis.

• 대한기계학회논문집A
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• 제34권3호
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• pp.299-305
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• 2010

가변성형 공정에서 동일한 크기의 성형펀치 배열로 구성된 가변금형을 이용하는 경우 펀치의 크기가 일정하여 성형 가능한 곡률 반경이 제한되기 때문에 비교적 유연성이 낮다. 이에 본 연구에서는 가변금형의 유연성을 높이기 위하여 분할가변금형에 대한 개념을 제안하였다. 임의의 성형면을 형성하기 위하여 두 가지 크기의 펀치로 구성된 펀치 블록을 착안하였다. 상대적으로 큰 곡률 반경을 갖는 성형영역에 대해서는 크기가 큰 펀치 블록을 적용하였으며, 작은 곡률 반경을 갖는 성형영역에 대해서는 작은 크기의 펀치로 구성된 펀치 블록을 적용하였다. 해석적 연구를 토대로 성형된 제품의 단면 형상을 비교하였으며 이로부터 서로 다른 크기의 펀치 블록을 조합하여 구성한 분할가변금형을 이용한 판재의 성형공정이 비교적 복잡한 곡률 반경 분포를 갖는 곡면 가공에 적합함을 확인하였다.

• 한국철도학회논문집
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• 제20권1호
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• pp.1-10
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• 2017

제동 스킬소음은 승객과 선로 주변의 주민에게 불편을 끼쳐 시급히 해결해야 할 문제의 하나이지만 해결책을 찾는 것은 쉽지 않다. 제동 스킬소음을 저감하기 위한 해결책은 크게 제동 마찰재의 소재를 개량하거나 제동패드의 구조를 개선하는 것으로 구분할 수 있다. 본 연구에서는 현재 KTX 차량에 사용되고 있는 제동패드를 기준으로 마찰재의 소재만을 바꾼 패드와, 동일한 마찰재 소재를 사용하지만 구조를 유연형으로 바꾼 제동패드를 제작하여 제동 다이나모미터에서 다양한 조건으로 마찰특성과 소음특성을 평가하고 영업차량이 역에 정차할 때 측정한 스킬소음과 비교 및 분석하였다. 제동 다이나모미터 시험이 실차 시험을 어느 정도 재현하는 것이 가능한다는 것을 발견하였고, 영업열차에서 최고 스킬소음이 발생한 4,500Hz 대역의 스킬소음은 다이나모미터 시험에서도 정확히 일치하고, 이 주파수는 제동디스크의 고유진동수와 일치하는 것을 규명하였다. 제동 스킬소음이 발생하는 주파수는 캘리퍼에 작용하는 압력, 시험온도, 그리고 제동 초속도에 따라 달라지지만 일정한 경향을 보여주지는 않았다. 개발된 제동패드의 평균 마찰계수는 0.35~0.45의 범위에 있고 마찰재 소재만을 바꾼 경우는 21.6dB(A), 구조를 변경한 경우는 17.3dB(A) 만큼 최대 소음을 줄일 수 있었다.

• ETRI Journal
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• 제35권1호
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• pp.1-6
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• 2013

In this paper, we present an implemented serial 40-Gb/s receiver optical subassembly (ROSA) module by employing a proposed TO-CAN package and flexible printed circuit board (FPCB). The TO-CAN package employs an L-shaped metal support to provide a straight line signal path between the TO-CAN package and the FPCB. In addition, the FPCB incorporates a signal line with an open stub to alleviate signal distortion owing to an impedance mismatch generated from the soldering pad attached to the main circuit board. The receiver sensitivity of the ROSA module measures below -9 dBm for 40 Gb/s at an extinction ratio of 7 dB and a bit error rate of $10^{-12}$.