• Title/Summary/Keyword: flexible packaging film

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Full Color Top Emission AMOLED Displays on Flexible Metal Foil

  • Hack, Michael;Hewitt, Richard;Urbanik, Ken;Chwang, Anna;Brown, Julie J.;Lu, Jeng Ping;Shih, Chinwen;Ho, Jackson;Street, Bob;Ramos, Teresa;Rutherford, Nicole;Tognoni, Keith;Anderson, Bob;Huffman, Dave
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.305-308
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    • 2006
  • Advanced mobile communication devices require a bright, high information content display in a small, light-weight, low power consumption package. For portable applications flexible (or conformable) and rugged displays will be the future. In this paper we outline our progress towards developing such a low power consumption active-matrix flexible OLED $(FOLED^{TM})$ display. We demonstrate full color 100 ppi QVGA active matrix OLED displays on flexible stainless steel substrates. Our work in this area is focused on integrating three critical enabling technologies. The first technology component is based on UDC's high efficiency long-lived phosphorescent OLED $(PHOLED^{TM})$ device technology, which has now been commercially demonstrated as meeting the low power consumption performance requirements for mobile display applications. Secondly, is the development of flexible active-matrix backplanes, and for this our team are employing PARC's Excimer Laser Annealed (ELA) poly-Si TFTs formed on metal foil substrates as this approach represents an attractive alternative to fabricating poly-Si TFTs on plastic for the realization of first generation flexible active matrix OLED displays. Unlike most plastics, metal foil substrates can withstand a large thermal load and do not require a moisture and oxygen permeation barrier. Thirdly, the key to reliable operation is to ensure that the organic materials are fully encapsulated in a package designed for repetitive flexing, and in this device we employ a multilayer thin film Barix encapsulation technology in collaboration with Vitex systems. Drive electronics and mechanical packaging are provided by L3 Displays.

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Mechanical and Electrical Failure of ITO Film with Different Shape during Twisting Deformation (비틀림 변형 중 ITO 필름의 시편 형태에 따른 기계적 전기적 파괴 연구)

  • Kwon, Y.Y.;Kim, Byoung-Joon
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.4
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    • pp.53-57
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    • 2017
  • The most representative transparent electrode in the modern society is ITO (Indium Tin Oxide). ITO is widely used in general for touch panels and displays due to its high electrical and optical properties. However, in general, mechanical deformation causes deterioration and destruction of device properties because ITO is basically vulnerable to mechanical deformation. Therefore, the in-depth understanding on the stability of ITO film during various mechanical deformations is necessary. In this study, the reliability and mechanical properties ITO sample having different length, width, and area were investigated. The electrical stability was estimated according to electrical resistance change. The stability was dropped as the sample length, and width increased and the sample area decreased. The electrical stability of ITO film was correlated with twisting strain including tensile, compressive and shear stress.

Ultra-thin aluminum thin films deposited by DC magnetron sputtering for the applications in flexible transparent electrodes (DC 마그네트론 스퍼터링법으로 증착된 초박형 Al 박막의 투명전극 적용성 연구)

  • Kim, Daekyun;Choi, Dooho
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.2
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    • pp.19-23
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    • 2018
  • In this study, the feasibility of Al-based transparent electrodes for optoelectronic devices was investigated. Al thin films having thickness in the range of 3-12 nm were deposited on glass substrates, and sheet resistance was measured for films thicker than 7 nm and the values continue to decrease with increasing film thickness. The grain size in the films was found to increase with increasing grain size. 85% visible light transmittance was measured at the thickness of 3 nm, and decreased to 50% and 60% when the film thickness reaches 4 nm and 5 nm, respectively. The results of this study can be used in the applications of oxide/metal/oxide type transparent electrodes.

Electrical Properties of PVP Gate Insulation Film on Polyethersulfone(PES) and Glass Substrates (Polyethersulfone(PES) 및 유리 기판위에 제작된 PVP 게이트 절연막의 전기적 특성)

  • Shin, Ik-Sup;Gong, Su-Cheol;Lim, Hun-Seoung;Park, Hyung-Ho;Chang, Ho-Jung
    • Journal of the Microelectronics and Packaging Society
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    • v.14 no.1
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    • pp.27-31
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    • 2007
  • The cpapcitors with MIM(metal-insulator-metal) structures using PVP gate insulation films were prepared for the application of flexible organic thin film transistors (OTFT). The co-polymer organic insulation films were synthesized by using PVP(poly-4-vinylphenol) as a solute and PGMEA(propylene glycol monomethyl ether acetate) as a solvent. The cross-linked PVP insulation films were also prepared by addition of poly(melamine-co-formaldehyde) as thermal hardener. The leakage current of the cross- linked PVP films was found to be about 1.3 nA on Al/PES(polyethersulfone) substrate, whereas, on ITO/ glass substrate was about 27.5 nA indicating improvement of the leakage current at Al/PES substrates. Also, the capacitances of all prepared samples on ITO/glass and Al/PES substrates w ere ranged from 1.0 to $1.2nF/cm^2$, showing very similar result with the calculated capacitance values.

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Anisotropic Conductive Film (ACF) Prepared from Epoxy/Rubber Resins and Its Fabrication and Reliability for LCD

  • Kim, Jin-Yeol;Kim, Eung-Ryul;Ihm, Dae-Woo
    • Journal of Information Display
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    • v.4 no.1
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    • pp.17-23
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    • 2003
  • A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.

Measurement of Flexural Modulus of Lamination Layers on Flexible Substrates (유연 기판 위 적층 필름의 굽힘 탄성계수 측정)

  • Lee, Tae-Ik;Kim, Cheolgyu;Kim, Min Sung;Kim, Taek-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.3
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    • pp.63-67
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    • 2016
  • In this paper, we present an indirect method of elastic modulus measurement for various lamination layers formed on polymer-based compliant substrates. Although the elastic modulus of every component is crucial for mechanically reliable microelectronic devices, it is difficult to accurately measure the film properties because the lamination layers are hardly detached from the substrate. In order to resolve the problem, 3-point bending test is conducted with a film-substrate specimen and area transformation rule is applied to the cross-sectional area of the film region. With known substrate modulus, a modulus ratio between the film and the substrate is calculated using bending stiffness of the multilayered specimen obtained from the 3-point bending test. This method is verified using electroplated copper specimens with two types of film-substrate structure; double-sided film and single sided film. Also, common dielectric layers, prepreg (PPG) and dry film solder resist (DF SR), are measured with the double-sided specimen type. The results of copper (110.3 GPa), PPG (22.3 GPa), DF SR (5.0 GPa) were measured with high precision.

Mechanical and Electrical Reliability of Silver Nanowire Film on Flexible Substrate (유연기판 위에 제작된 Silver Nanowire 필름의 기계 및 전기적 신뢰성 연구)

  • Lee, Yo Seb;Lee, Won Jae;Park, Jin Yeong;Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.4
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    • pp.93-99
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    • 2016
  • In this paper, we investigated the mechanical and electrical reliability of silver nanowire (AgNW) films. In particular, the durability and reliability of AgNW films were studied when the AgNW film was subjected to the bending deformation under current flow. The electrical durability of AgNW was evaluated by observing changes in heat generation and current density occurring in AgNW through voltage and current tests. The AgNW film showed a constant resistance change up to a bending radius of 2 mm and 200,000 cycles in the bending fatigue tests. The over-coating layer has an effect of improving the durability of the AgNW film. In the case of AgNW with the over-coating layer, heat was uniformly dissipated on the surface of AgNW film, whereas in the case of AgNW film without the over-coating layer, heat was generated locally. In the bending test under the current flow, the current density of the AgNW film was continuously decreased up to 52.4%. During bending, the AgNW was deformed due to mechanical deformation such as tensile, bending and sliding of the AgNW, consequently contact resistance of the AgNW was increased, leading to a electrical breakdown of AgNW by Joule heating. It was found that the application of the over-coating layer can improve the electrical and mechanical reliability of the AgNW film.

Carbon strain sensor using Nd: YAG laser Direct Writing (Nd:YAG Laser 직접 각인을 이용한 Carbon 스트레인 센서)

  • Joo, Donghyun;Yoon, Sangwoo;Kim, Joohan;Park, Woo-Tae
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.1
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    • pp.35-40
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    • 2018
  • Nd:YAG laser was used to carbonize polyimide films to produce carbon films. This is a simple manufacturing process to fabricate low cost sensors. By applying this method, we studied characteristics of flexible and low-cost piezoresistive. Previously, many studies focused on carbonization of polyimide using $CO_2$ laser with wavelength of $10.6{\mu}m$. In this paper, carbonization (carbonization process) was performed on polyimide films using an Nd:YAG laser with a wavelength of $1.064{\mu}m$. In order to increase the resolution, we optimized the laser conditions of the power density ($W/cm^2$) and the beam scan rate. In previous studies using $CO_2$ laser, the minimum line width was $140{\sim}220{\mu}m$ but in this study, carbon line width was reduced to $35{\sim}40{\mu}m$. The initial sheet resistance of the carbon sensor was $100{\sim}300{\Omega}/{\square}$. The resistance decreased by 30% under stretched with a curvature radius of 21 R. The calculated gauge factor was 56.6. This work offers a simple, highly flexible, and low-cost process to fabricate piezoresistive sensors.

Interfacial fracture Energy between Electroless Plated Ni film and Polyimide for Flexible PCB Applications (Flexible PCB용 무전해 도금 Ni 박막/Polyimide 계면파괴에너지 평가)

  • Min, Kyoung-Jin;Park, Sung-Cheol;Lee, Jee-Jeong;Lee, Kyu-Hwan;Lee, Gun-Hwan;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.14 no.1
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    • pp.39-47
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    • 2007
  • It is investigated how KOH and Rthylenediamine(EDA) treatment conditions on Polyimide film surface affect the interfacial fracture energy between electroless plated Ni and Polyimide film by $180^{\circ}$ peel test. Estimated values of interfacial fracture energy were 24.5 g/mm and 33.3 g/mm for the KOH treatment times under 1 and 5 minutes, respectively, while, those were 31.6 g/mm and 22.3 g/mm for EDA treatment times under 1 and 5 minutes, respectively. Interfacial bonding between electroless plated Ni and Polyimide seems to be dominated by chemical bonding effect rather than mechanical interlocking effect. It is found that chemical treatment produces carboxyl and mine functional groups which are closely related the interfacial bonding mechanism. Finally, it is speculated that interfacial fracture energy seems to be controlled by O=C-O bonding near cohesive failure region.

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A Model for Detection and Refinement of Fixed Bending Regions for Improving the Degree of Thickness Uniformity in Rolled Film Manufacturing (롤 형상 필름 생산에서 두께평활도 개선을 위한 고정굴곡부 발현 모형 및 개선 모델)

  • Bae, Jae-Ho
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.38 no.3
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    • pp.21-28
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    • 2015
  • As film products are increasingly used in a wide range of areas, from producing traditional flexible packaging to high-tech electronic products, a higher level of quality is demanded. Most film products are made in the form of rolled finished goods, therefore, various quality issues related to their shape characteristics must be addressed. The thickness of the film products is one of the most common and important critical-to-quality attributes (CTQs). Particularly, the degree of thickness uniformity is more important than other thickness parameters, because it will be potential causes of many secondary thickness-related quality problems, such as wrinkles or faulty windings. To control the degree of thickness uniformity, the fixed bending region is oneof the most important CTQs to manage. Fixed bending regions are special points in the transverse direction of a rolled product with consistent minute variations of the thickness gap. This paper describes the measurement and analysis of thickness uniformity data, which were performed in a real manufacturing field of biaxial oriented polypropylene (BOPP) film. In previous researches, quality function deployment (QFD) or fault tree analysis were used to find the most critical process attributes out to controlthe CTQ of thickness uniformity. Whereas, this paper uses traditional control charts to find the most critical process attributes out in this problem. In addition, the selection of one of the major critical process attributes (CTPs) that is expected to affect the CTQ of thickness uniformity is also described. The selected critical-to-process attributes are the controlled temperatures along the transverse direction. A dramatic improvement in thickness uniformity was observed when the selected CTPs were controlled.