• 마이크로전자및패키징학회지
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• 제28권1호
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• pp.21-29
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• 2021

Recently, semiconductor chips and electronic components are increasingly being used in IT devices such as wearable watches, autonomous vehicles, and smart phones. As a result, there is a growing concern about device malfunctions that may occur due to electromagnetic interference being entangled with each other. In particular, electromagnetic wave emissions from wearable or flexible smart devices have detrimental effects on human health. Therefore, flexible and transparent electromagnetic interference (EMI) shielding materials and films with high optical transmittance and outstanding shielding effectiveness have been gaining more attention. The EMI shielding films for flexible and transparent electronic devices must exhibit high shielding effectiveness, high optical transmittance, high flexibility, ultrathin and excellent durability. Meanwhile, in order to prepare this EMI shielding films, many materials have been developed, and results regarding excellent EMI shielding performance of a new materials such as carbon nano tube (CNT), graphene, Ag nano wire and MXene have recently been reported. Thus, in this paper, we review the latest research results to EMI shielding films for flexible and transparent device using the new materials.

• 한국포장학회지
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• 제22권3호
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• pp.103-106
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• 2016

태국의 플라스틱 소비는 포장분야 49%, 직물 15%, 건설 11%, 전기전자가 10% 순으로 나타났다. 종사자는 106천명이며 공장생산 용량대비 실제 생산은 85%이고 식품포장용 플라스틱수지 수요는 월간 135천톤에 달한다. 업종별 제조사는 필름가공업체가 503개 공장으로 전체의 39%를 점하며 인젝션 몰딩 사가 231개로 18%, 블로우 몰딩 사가 216개사로 17% 순으로 나타났다. 주요 수지들의 생산은 PP는 총 1,950천톤을 생산하였으며, LDPE는 685천톤을 LLDPE는 1,150천톤을 생산하였고, HDPE는 1,920천톤을 생산한 것으로 나타났다. 플라스틱 수입은 16,668백만 바트였고 수출은 33,778백만 바트로 수출액이 2배 이상 높은 것으로 나타났다.

• 식품과학과 산업
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• 제50권2호
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• pp.12-26
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• 2017

Processing steps such as washing and cutting, involved in preparing fresh-cut produce causes tissue damage, leading to rapid quality deterioration. Major defects of fresh-cut produce are discoloration, softening, off-odor development, and microbial growth. Packaging of fresh-cut produce has been changed to reduce these quality problems. Flexible packaging film is widely used to pack fresh-cut produce. Vacuum packaging was the popular packaging method in the beginning of fresh-cut industry in Korea. Vacuum packaging creates high $CO_2$ and low $O_2$ levels to control browning of fresh-cut produce. However, these conditions induce some visual defects and off-odor development. Discoloration problem was also found when fresh-cut produce was packaged with conventional packaging film or plastic tray. Modified atmosphere (MA) packaging is effective for prolonging shelf-life of fresh-cut produce by decreasing $O_2$ and increasing $CO_2$ concentration in the package. Retail MA packaging using different oxygen transmission rate (OTR) film and micro-perforated film has started to be applied to fresh-cut produce in Korea. Proper MA package design that provides optimum range of $O_2$ and $CO_2$ partial pressures is one of the major challenges in the industry. An initial package flushing with $N_2$ or an low $O_2$/high $CO_2$ atmosphere is also used to more rapidly establish steady-state MA condition. Film OTR and $O_2$ flushing affects the fermentative volatile production, off-odor development, electrolyte leakage, discoloration, $CO_2$ injury, microbial population of fresh-cut produce. There is also a demand for convenient packaging to attract consumers. Rigid fresh-cut produce container for retail market has increased since the packaging provides excellent protection from physical damage during transport. Rigid tray used as actual serving vessel for the consumer is increasing in Korea. The tray with flexible lid to wrap or seal fresh-cut produce is more and more gaining popularity. Further practical technology to control quality change and microbial growth for each fresh-cut product has been studied since various fresh-cut items were required. The fresh-cut industry also focuses on searching for more convenient and environmentally friendly packaging.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 추계 기술심포지움 초록집
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• pp.53-53
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• 2004

• 한국식품과학회지
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• 제46권6호
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• pp.739-742
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• 2014

이 연구에서는 식품포장분야에 사용되는 유연포장재들의 두께에 따른 방충효과를 규명하여 각각의 포장재에서 일정 수준의 방충효과를 나타내기 위한 필름의 최적의 조건을 연구하고자 하였다. 식품용 유연포장재들 중에서도 가장 널리 이용되고 있는 PE, PP, PS, AF, PET를 채택하여 실험을 진행한 결과, 각 포장재들의 두께에 따른 화랑곡나방 유충에 의한 침투율은 전반적으로 필름의 종류에 관계없이 두께가 얇을수록 포장재 내부로 빠르게 침투하는 경향을 보였다. 특히 PP와 PS의 경우 다른 필름들과는 다르게 각각 $20{\mu}m$와 $30{\mu}m$에서 72시간 이내에 100% 침투되는 결과값을 보여 방충포장소재로서의 상대적인 취약함을 보였다. 결과적으로 필름의 종류에 상관없이 두께가 증가할 수록 화랑곡 나방 유충의 침투율이 낮아진다는 것을 보여 주었다. 따라서 식품 내 해충과 같은 동물성 이물의 혼입을 방지하기 위해서는 포장 소재의 종류에 따라 특정 두께 이상을 확보해야 한다고 판단된다.

• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.1-11
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• 2014

Flexible transparent conductive electrodes (TCEs) have recently attracted a great deal of attention owing to rapid advances in flexible electronic devices, such as flexible displays, flexible photovoltanics, and e-papers. As the performance and reliability of flexible electronics are critically affected by the quality of TCE films, it is imperative to develop TCE films with low resistivity and high transparency as well as high flexibility. Indium tin oxide (ITO) has been the most dominant transparent conducting material due to its high optical transparency and electrical conductivity. However, ITO is susceptible to cracking and delamination when it is bent or deformed. Therefore, various types of flexible TCEs, such as carbon nanotube, conducting polymers, graphene, metal mesh, Ag nanowires (NWs), and metal mesh have been extensively investigated. Among several options to replace ITO film, Ag NWs and metal mesh have been suggested as the promising candidate for flexible TCEs. In this paper, we focused on Ag NWs and metal mesh, and summarized the current development status of Ag NWs and metal mesh. The several critical issues such as high contact resistance and haze are discussed, and newly developed technologies to resolve these issues are also presented. In particular, the flexibility and durability of Ag NWs and metal mesh was compared with ITO electrode.

• 한국포장학회지
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• 제13권1호
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• pp.9-18
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• 2007

Nanocomposite has been considered as an emerging technology in developing a novel food packaging materials. Polymer nanocomposites exhibit markedly improved packaging properties due to their nanometer size dispersion. These improvements include increased barrier properties pertaining to gases such as oxygen, carbon dioxide, and water vapor, as well as to UV rays, and increased mechanical properties such as strength, stiffness, dimensional stability, and heat resistance. Additionally, biologically active ingredients can be added to impart the desired functional properties to the resulting packaging materials. New packaging materials created with this technology demonstrate an increased shelf life with maintaining high quality of the product. Nanotechnology offers big benefits for packaging. Nanocomposite technology paves the way for packaging innovation in the flexible and rigid packaging applications, offering enhanced properties such as greater barrier protection, increased shelf life and lighter-weight materials.

• 마이크로전자및패키징학회지
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• 제19권3호
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• pp.63-69
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• 2012

Adhesion and mechanical reliability of silicon/epoxy/polyimide interfaces are critical issues for flexible electronics. Bonds between these interfaces are mainly hydrogen bonds, so their adhesion is weaker than cohesive fracture toughness and vulnerable to moisture. In order to enhance adhesion and suppress moisture-assisted debonding, UV/Ozone treatment and innovative sol-gel derived hybrid layers were applied to silicon/epoxy/polyimide interfaces. The fracture energy and subcritical crack growth rate were measured by using a double cantilever beam (DCB) fracture mechanics test. Results showed that UV/Ozone treatment increased the adhesion, but was not effective for improving reliability against humidity. However, by applying sol-gel derived hybrid layers, adhesion increase as well as suppresion of moisture-assisted cracking were achieved.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.223-227
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• 2003

A new flexible electronic packaging technology and its medical applications are presented. Conventional silicon chips and electronic modules can be considered as "mechanically rigid box." which does not bend due to external forces. This mechanically rigid characteristic prohibits its applications to wearable systems or bio-implantable devices. Using current MEMS (Microelectromechanical Systems) technology. a surface micromachined flexible polysilicon sensor array and flexible electrode array fer neural interface were fabricated. A chemical thinning technique has been developed to realize flexible silicon chip. To combine these techniques will result in a realization of truly flexible sensing modules. which are suitable for many medical applications.

• 접착 및 계면
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• 제17권2호
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• pp.49-55
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• 2016

본 연구는 식품연포장 적층 라미네이트에 주로 사용되는 유성접착제를 대체하기 위해 아크릴 수성화방법을 활용하여 친환경적인 수성 점착제를 설계하였다. 방법으로는 음이온/비이온 그리고 인산에스테르 계면활성제들의 조합과 분자량조절제(chain transfer agent, CTA)의 양을 달리하고, 기능성단량체(functional monomer)의 종류를 달리하였다. 합성된 점착제의 가교 정도와 분자량의 영향을 각각 실험군 8종으로 점착제를 설계 합성하고 조사하였다. 그리고 별도로 분자량이 서로 다른 styrene/alpha-methyl styrene/acrylic acid (SAA) semipolymer 분산제(Mw = 13,000과 Mw = 8,600)를 기존의 계면활성제를 대신하여 사용해 감압점착제(Pressure Sensitive Adhesive, PSA)의 물성을 조사하였다. 합성된 10종의 감압점착제가 유연포장용 기본 물성 규격에 적합한지를 DSC, 입자크기, adhesion, 분자량의 물성 분석으로 평가하였다. 실험 결과 계면활성제는 음이온/비이온 조합으로, CTA는 0.2%로 기능성 단량체는 HEA, GMA를 사용한 점착제 2개의 실험군에서 유연포장에 적용 가능한 분자량과 유연성, 낮은 접착력, 작은 입자의 물성을 확인하였다.