• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
• /
• pp.324-325
• /
• 2008

In this Study, We fabricated a plasma discharge cluster with external electrodes which can be applied to flexible backlight in a polymer substrate and investigated the discharge characteristics. The Sealing process was progressed in vacuum chamber, which enable to fabricate plasma discharge cluster. The results of discharge characteristics show that the static memory margin of plasma discharge cluster was increased, as Ne/Xe(5%) gas pressure was increased. also, When gas pressure was 100torr at 600um of electrode gap, we have obtained high luminance of a plasma discharge cluster.

• 한국전기전자재료학회논문지
• /
• 제28권12호
• /
• pp.813-820
• /
• 2015

We have studied commercialization and process optimization of protective film on transparent conductive coated substrate, nano silver on flexible PET (poly ethylene terephthalate), by means of roll-to-roll micro-gravure coater. Nanosilver on flexible PET substrate is potential materials to replace ITO (indium tin oxide). Protective film is most important to maintain unique silver pattern on top of transparent PET. PSA pressure sensitive adhesives) was developed solely for nano silver on PET and protective film was successfully laminated. We have optimized all process conditions such as coating thickness, line speed and aging time & temperature via experimental design. Transparent conductive film and its protective film developed in this research are commercially available at this moment.

• 산업경영시스템학회지
• /
• 제22권50호
• /
• pp.209-219
• /
• 1999

This paper presents an efficient operational technique of material feeding process, trainning for multi-operations, machine conditions, and role of foreman and material-supplying man, for constructing the flexible assembly cells in the domestic electronic industries. And an practical method for computing the number of economical cells is also presented by the cost-effective model that compares the additional assembly machine requirement with the four reductive effects including WIP/finished goods inventory, the troubles in the assembly line, the opportunity loss for small order quantity, and amounts of production management due to the introduction of cell line. An case study is introduced in for a domestic electronic assembly line at the end.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
• /
• pp.29-29
• /
• 2008

Realization of electronics with performance equal to established technologies that use rigid semiconductor wafers, but in lightweight, foldable and stretchable formats would enable many new application possibilities. Examples include wearable systems for personal health monitoring, 'smart' surgical gloves with integrated electronics and electronic eye type imagers that incorporate focal plane arrays on hemispherical substrates. Circuits that use organic or certain classes of inorganic electronic materials on plastic or steel foil substrates can provide some degree of mechanical flexibility, but they cannot be folded or stretched. Also, with few exceptions such systems offer only modest electrical performance. In this talk, I will present a new approach to high performance, flexible and stretchable integrated circuits. These systems combine single-crystal silicon nanoribbons with thin plastic or elastomeric substrates using both "top-down" and "transfer-printing" technologies. The strategies represent promising routes to high performance, flexible and stretchable optoelectronic devices that can incorporate established, high performance inorganic electronic materials.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
• /
• pp.276-279
• /
• 2004

CdS thin films on polymer substrates such as polycarbonate(PC) and polyethylene terephthalat(PET) have many merits such as light weight, small volume and can make the obtained devices folded, easily carried. In present work, CdS thin films on glass, PC, and PET substrates have been prepared by chemical bath deposition. The structural and optical propertied of the films depending on substrate types have been investigated.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2013년도 춘계학술대회 논문집
• /
• pp.871-872
• /
• 2013

• E2M - 전기 전자와 첨단 소재
• /
• 제31권3호
• /
• pp.20-34
• /
• 2018

• E2M - 전기 전자와 첨단 소재
• /
• 제16권10호
• /
• pp.15-22
• /
• 2003

• E2M - 전기 전자와 첨단 소재
• /
• 제19권9호
• /
• pp.20-26
• /
• 2006

• 터널과지하공간
• /
• 제13권3호
• /
• pp.225-234
• /
• 2003

구조물의 해체 대상이 철근 콘크리트에서부터 강구조물에 이르기까지 다양화되고 있다. 이러한 강 구조물의 해체는 최근 국내에서도 증가추세이다. 강 구조물을 해체하는데 이용되는 가소성 성형 폭약의 경우 그 대부분이 외국에서 수입되는 실정이다. 따라서 본 연구에서는 가소성 성형폭약의 국산 개발을 위해 최적 설계 변수설정을 위한 연구를 수행하였는데 그 주요 결과는 다음과 같다. 라이너 재질로는 알루미늄이나 납보다는 구리가 우수하고 그 굽힘각도는 45$^{\circ}$, 60$^{\circ}$, 120$^{\circ}$보다 90$^{\circ}$일 때 가장 좋은 결과를 얻을 수 있었다. 이외에도 폭약량에 따른 라이너의 두께, 최적이격거리등을 검토하였으며 폭약 및 라이너는 가소화시켜 해체 대상 강 구조물의 형태에 따라 결합력을 증대시키는 것이 효과적이다.