• Steel and Composite Structures
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• v.44 no.5
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• pp.741-752
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• 2022

Earlier works have shown that excessive shear stiffness at the steel-concrete interface causes a non-uniform distribution of shear force in composite structures. When the shear studs are wrapped at the fixed end with flexible materials with a low elastic modulus, the shear stiffness at the interface is reduced. The objective of this study was to investigate the effect of silicone rubber-sleeve mounted on shear studs on the shear stiffness of steel-concrete composite structures. Eighteen push-out tests were conducted to investigate the mechanical behavior of silicone rubber-sleeved shear stud groups (SRS-SSG). The dimension and arrangement of silicon rubber-sleeves (SRS) were taken into consideration. Test results showed that the shear strength of SRS-SSG was higher than that of a shear stud group (SSG), without SRS. For SRS-SSG with SRS heights of 50 mm, 100 mm, 150 mm, the shear strengths were improved by 13%, 20% and 9%, respectively, compared to the SSG alone. The shear strengths of SRS-SSG with the SRS thickness of 2 mm and 4 mm were almost the same. The shear stiffness of the SRS-SSG specimens with SRS heights of 50 mm, 100 mm and 150 mm were 77%, 67% and 66% of the SSG specimens, respectively. Test results of specimens SSG-1 and predicted values based on the three design specifications were compared. The nominal single stud shear strength of SSG-1 specimens was closest to that calculated by the Chinese Code for Design of Steel Structures (GB50017-2017). An equation is proposed to consider the effects of SRS for GB50017-2017, and the predicted values based on the proposed equation agree well with the tested results of SRS-SSG.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.1-10
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• 2018

Recently, there has been rapid development in the field of flexible electronic devices, such as organic light emitting diodes (OLEDs), organic solar cells and flexible sensors. Encapsulation process is added to protect the flexible electronic devices from exposure to oxygen and moisture in the air. Using numerical simulation, we investigated the effects of the encapsulation layer on mechanical stability of the silicon chip, especially the fracture performance of center crack in multi-layer package for various loading condition. The multi-layer package is categorized in two type - a wide chip model in which the chip has a large width and encapsulation layer covers only the chip, and a narrow chip model in which the chip covers both the substrate and the chip with smaller width than the substrate. In the wide chip model where the external load acts directly on the chip, the encapsulation layer with high stiffness enhanced the crack resistance of the film chip as the thickness of the encapsulation layer increased regardless of loading conditions. In contrast, the encapsulation layer with high stiffness reduced the crack resistance of the film chip in the narrow chip model for the case of external tensile strain loading. This is because the external load is transferred to the chip through the encapsulation layer and the small load acts on the chip for the weak encapsulation layer in the narrow chip model. When the bending moment acts on the narrow model, thin encapsulation layer and thick encapsulation layer show the opposite results since the neutral axis is moving toward the chip with a crack and load acting on chip decreases consequently as the thickness of encapsulation layer increases. The present study is expected to provide practical design guidance to enhance the durability and fracture performance of the silicon chip in the multilayer package with encapsulation layer.

• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.1469-1473
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• 2004

We suggest how to program off-line robot path along shoes' outsole shape in the footwear buffing process by a 5-axis microscribe system like robot arms. This microscribe system developed consists a 5-axis robot link with a turn table, signal processing circuit, PC and an application software program. It makes a robot path on the shoe's upper through the movement of a microscribe with many joints. To do this, first it reads 5-encoder's pulse values while a robot arm points a shoes' outsole shape from the initial status. This system developed calculates the encoder pulse values for the robot arm's rotation and transmits the angle pulse values to the PC through a circuit. Then, Denavit-Hartenberg's(D-H) direct kinematics is used to make the global coordinate from robot joint one. The determinant is obtained with kinematics equation and D-H variable representation. To drive the kinematics equation, we have to set up the standard coordinates first. The many links and the more complicated structure cause the difficult kinematics problem to solve in the geometrical way. Thus, we can solve the robot's kinematics problems efficiently and systematically by Denavit-Hartenberg's representation. Finally, with the coordinate values calculated above, it can draw a buffing gauge-line on the upper. Also, it can program off-line robot path on the shoes' upper. We are subjected to obtaining shoes' outline points, which are 2 outlines coupled with the points and the normal vector based on the points. These data is supposed to be transformed into .dxf file to be used for data of automatic buffing robot. This system developed is simulated by using spline curves coupled with each point from dxf file in Autocad. As a result of applying this system to the buffing robot in the flexible footwear manufacturing system, it can be used effectively to program the path of a real buffing robot.

• Journal of KIISE
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• v.44 no.2
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• pp.213-222
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• 2017

The Internet of Things (IoT) technology is rapidly developing in recent years, and is applicable to various fields. A smart factory is one wherein all the components are organically connected to each other via a WSN, using an intelligent operating system and the IoT. A smart factory technology is used for flexible process automation and custom manufacturing, and hence needs adaptive network management for frequent network fluctuations. Moreover, ensuring the timeliness of the data collected through sensor nodes is crucial. In order to ensure network timeliness, the power consumption for information exchange increases. In this paper, we propose an IEEE 802.15.4e DSME-based distributed scheduling algorithm for mobility support, and we evaluate various performance metrics. The proposed algorithm adaptively assigns communication slots by analyzing the network traffic of each node, and improves the network reliability and timeliness. The experimental results indicate that the throughput of the DSME MAC protocol is better than the IEEE 802.15.4e TSCH and the legacy slotted CSMA/CA in large networks with more than 30 nodes. Also, the proposed algorithm improves the throughput by 15%, higher than other MACs including the original DSME. Experimentally, we confirm that the algorithm reduces power consumption by improving the availability of communication slots. The proposed algorithm improves the power consumption by 40%, higher than other MACs.

• Journal of Biomedical Engineering Research
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• v.22 no.5
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• pp.403-412
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• 2001

The Present study analyzed the pressure-flow characteristics of a Korean shunt valve. Changes in the characteristic currie depending on the design parameters were also investigated. The Korean shunt valve used in the present study was constant pressure type and our analyses were validated through experiments. We applied fluid-structure interaction to solve the flow dynamic Problem because the small diaphragm in the valve was made from flexible silicone elastomers. Considering the material nonlinearity of the hyper-elastic material. the Mooney-Rivlin approximation was employed. The results of the numerical analyses were close to the experimental results The major Pressure drop was observed to happen in the small diaphragm. The slope of the pressure-flow characteristic curve was computed to be 0.37mm$H_2O$.hr/cc, which was similar to the average value of commercial shunt valves. 0.40mm$H_2O$.hr/cc. Therefore. our valves analyzed in the Present study showed a Proper Pressure control characteristics of the constant pressure type shunt valves. The opening pressure could be controlled by adjusting the amount of predeflection of the valve diaphragm. In order to obtain opening pressures of 25mm$H_2O$ and 80mm$H_2O$, respectively, and the required predeflection was found to be 10.2$\mu$m and 35.3$\mu$m. The flow orifice size was found to be within 10$\mu$m during valve operation Therefore, Precision design and manufacturing techniques are necessary for successful operations of the shunt valve. The study indicated the amount of predeflection as well as the magnitude of corner rounding of the diaphragm edge are important design parameters to influence the slope of the pressure-flow characteristic curve.

• Journal of Labour Economics
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• v.40 no.1
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• pp.1-36
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• 2017

This study aimed to analyze influencing factors to increase the wage differential between large enterprise and subcontracted small-medium enterprises by using panel data composed of 19 manufacturing industries for 16 years from 1999 to 2014. According to the results of analysis, in large enterprises the elasticity of substitution between the labor inputs and the subcontracted product supplies from small-medium enterprises was significantly less than 1. So, the increase in wages of workers of large enterprises, whose degree of employment protection was relatively high, seemed to increase the share of wage cost in total cost and was resulted to decrease the cost share of subcontracted product supplies significantly. This was interpreted to be able to exert a negative influence upon the price of subcontracted product supplies and the wages of workers in subcontracted small-medium enterprises, and, therefore, to increase the wage differentials between large enterprises and subcontracted small-medium enterprises. Furthermore, it was also found that the increases in the labor union participation rate at large enterprises and the openness rate of the industry concerned were contributing to make such effects much stronger significantly. In order to mitigate the wage differentials and the polarizing trend in labor market, we can suggest to establish a certain kind of flexible wage system and to introduce co-bargaining practices with the workers of subcontracted small-medium enterprises within large enterprises, and also for the workers of small-medium enterprises, to prepare new social systems to upgrade their human resources and job skills drastically.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.1
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• pp.1-8
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• 2008

We propose how to program the off-line buffing robot path along shoes' outsole shape in the footwear buffing process by a 5-axis microscribe system like robot mechanism. The microscribe system we developed consists of a 5-axis robot link with a turn table, a signal processing unit, PC and an application software program. Itmakes a robot path on the shoes' upper in accordance with the movement of a microscribe with many joints. The developed system calculates the encoder pulse values for the microscribe arm's rotation and transmits the angle pulse values to the PC through a processing unit. Denavit-Hartenberg's(D-H) direct kinematics is used to make the global coordinate from microscribe joint one. Problems with the microscribe's kinematics can be solved efficiently and systematically by D-H representation. With the coordinate values calculated by D-H equation, our system can draw a buffing gauge-line on the upper sole. We obtain shoes' outline points, which are 2 outlines coupled with the points and the normal vector based on the points. By applying the system to the buffing robot in a flexible manufacturing system, it can be used effectively to program the path of a real buffing robot.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.5
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• pp.674-680
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• 2017

Touch Screen Panel (TSP) is a widely used personal handheld device and as a large display apparatus. This study examines micro bump fabrication technology for TSP test process. In the testing process, as TSP is changed, should make a new micro bump for probing and modify the testing program. In this paper we use a maskless lithography system to confirm the potential to fabricatemicro bump to reducecost and manufacturing time. The requiredmaskless lithography system does not use a mask so it can reduce the cost of fabrication and it flexible to cope with changes of micro bump probing. We conducted electro field simulation by pitches of micro bump and designed the lithography pattern image for the maskless lithography process. Then we conducted Photo Resist (PR) patterning process and electro-plating process that are involved in MEMS technology to fabricate micro bump.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.4-4
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• 2008

The progress in flat panel displays over the last two decades has been astonishing. In just 20 years, the LCD-TV grew up from a 2-inch curiosity, to an industry that will sell about 120 million flat panel TV's this year, with viewing area up to 4000 times larger. That success is based on continuous innovation, especially in manufacturing processes. For the next decade to bring another doubling of the business, progress will need to continue in four major areas: Human factors, ecological impact, visual quality, and of course continued drive towards affordability. This talk will detail the technology advances that can allow this industry to meet those challenges. Human factors. Today, we adapt our lifestyle to our technology. People organize their offices, and their homes, around displays. We pass around mobile phones to share images, rather than experiencing them as a group. Billions of newspapers continue to be sold daily. Advances in flexible displays can lead to large portable displays. "New era projection" includes the handheld Pico Projectors that are already on the market, and will ultimately appear integrated in mobile phones the same way cameras do today. "Eco" impact. Today TV's are one of the top energy consumers in a U.S. home, and the fastest growing. Watching a large flat panel TV can cost twice as much as running a large refrigerator. With today's concern about energy consumption, regulations are starting to emerge worldwide to limit TV electrical use. Fortunately, good solutions exist in using light management films to eliminate bulbs, saving power without increasing cost. Going forward, LED backlights will drive another step downward. OLED displays might be the ultimate solution. Visual quality. The color of an LCD-TV is still often considered inferior to a far less expensive CRT. And almost all displays suffer from representing a three-dimensional world on a two dimensional surface. The technology to improve color is available today, and will likely move from premium sets into the mainstream as costs come down. 3D is now arriving in movie theaters worldwide, and that will drive up the demand for similar realistic images in home theaters. And the technology is emerging today for 3D representation to move beyond specialized applications into everyday use, on screens large and small. Affordability. The world takes cost-down miracles for granted in consumer electronics. Each of these other advances will be balanced with a drive for affordability, especially as the market grows in emerging countries. The other three challenges must be met without increasing cost. Putting this all together, the next few years will emphasize "eco friendly" designs, and enhanced images such as 3D. By 2013 we will start to see serious penetration by emissive technologies (OLED, high efficiency plasma, or other), with the "ultimate display" likely not in the market for a decade. Lots of opportunities for innovation remain ahead of us.

• Journal of the Economic Geographical Society of Korea
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• v.7 no.2
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• pp.261-281
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• 2004

The location of auto industry in Jeon-buk is due to the strategies for secure a low-priced industrial site of the auto assembly companies, which attained to quantitative growth stage in the early part 1990's, and the regional balanced development policy by the location of leader enterprise of the government. As a consequence of the reversal development pattern that is located the auto parts firm after locating the auto assembly companies, the Jeon-buk auto industry has many structural vulnerability. First, because of the lack development of auto parts industries, the auto assembly companies located in Jeon-buk are dependent many auto parts at a external region. Second, most of auto parts firm belongs to the singular assembly company exclusively. And the majority of auto parts industries are the low value-added products that are necessary a simple labor power. Third, the agglomeration undeveloped of associated industries with automobile caused a low competitiveness of invitation a manufacturing company as against other provinces. For a regional economic development by the auto industry, it is necessary a flexible regional structure of production through an agglomeration of associated industries. The geographical proximity between an assembly company and a parts firms is an important locational factor with the induction of Just-in-Time production system and a modularization in the auto industry. And a modularization applies to more new factory than the existing factories. So that, Jeon-buk self-government has to create an amicable industrial environment, try to attract an auto parts enterprises and plan an agglomerated industrial complex that is able to supply a parts modulated to assembly company.