• Proceedings of the IEEK Conference
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• 2003.11b
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• pp.15-18
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• 2003

Flash memory becomes more important for its fast access speed, low-power, shock resistance and nonvolatile storage. But its native restrictions that have limited 1ifetime, inability of update in place, different size unit of read/write and erase operations need to managed by FTL(Flash Translation Layer). FTL has to control the wear-leveling, address mapping, bad block management of flash memory. In this paper, we focuses on the fast access to address mapping table and proposed the way of faster valid page search in the flash memory using the VPLT(Valid Page Lookup Table). This method is expected to decrease the frequency of access of flash memory that have an significant effect on performance of read and block-transfer operations. For the validations, we implemented the FTL based on Windows CE platform and obtained an improved result.

• Journal of Internet of Things and Convergence
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• v.9 no.1
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• pp.71-76
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• 2023

Recently, in order to store and manage big data, research and development of a high-performance storage system capable of stably accessing large data have been actively conducted. In particular, storage systems in data centers and enterprise environments use large amounts of SSD (solid state disk) to manage large amounts of data. In general, SSD uses FTL(flash transfer layer) to hide the characteristics of NAND flash memory, which is a medium, and to efficiently manage data. However, FTL's algorithm has a limitation in using DRAM more to manage the location information of NAND where data is stored as the capacity of SSD increases. Therefore, this paper introduces FTL policies that apply virtual memory to reduce DRAM resources used in FTL. The virtual memory-based FTL policy proposed in this paper manages the map data by using LRU (least recently used) policy to load the mapping information of the recently used data into the DRAM space and store the previously used information in NAND. Finally, through experiments, performance and resource usage consumed during data write processing of virtual memory-based FTL and general FTL are measured and analyzed.

• Transactions of the Korean Society of Mechanical Engineers
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• v.10 no.3
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• pp.349-356
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• 1986

For the extension of application in flash method measuring the thermophysical properties of materials, the heat diffusion equation with the heat transfer loss from front, rear, and circumferential surfaces of two layer cylinderical sample is mathematically analyzed by means of Green's function for axially symmetric pulse heating on the front of samples. The solutions are applied to determine the unknown thermal diffusivity of the two materials and analyzed the measurement error due to heat loss and finite pulse time effects.

• Korean Journal of Materials Research
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• v.29 no.11
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• pp.657-663
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• 2019

In this work, we study physical and mechanical properties of oxide films formed on AZ91D magnesium alloy by plasma anodization at different temperatures. It is found that the higher the electrolyte temperature, the lower is the breakdown voltage of oxide layer. This is probably because films formed at higher temperatures are thinner and denser. Moreover, electrolyte temperature plays an important role in the physical properties of the films. As the electrolyte temperature increases from 20 to $50^{\circ}C$, the hardness of the oxide layer increases. Friction test against steel balls indicates that wear scars become narrower for films formed at higher temperatures because the films are harder, as indicated by the Vickers hardness. The thinner and denser nature of the oxide film formed at $50^{\circ}C$ is also advantageous for heat transfer when film is used as a heat sink. Laser flash test results show very fast heat transfer for AZ91D with plasma anodized oxide layer formed at higher temperatures.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.282.1-282.1
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• 2016

The remarkable physical properties of two-dimensional (2D) semiconducting materials such as molybdenum disulfide ($MoS_2$) and tungsten disulfide ($WS_2$) etc. have attracted considerable attentions for future high-performance electronic and optoelectronic devices. The ongoing studies of $MoS_2$ based nonvolatile memories have been demonstrated by worldwide researchers. The opening hysteresis in transfer characteristics have been revealed by different charge confining layer, for instance, few-layer graphene, $MoS_2$, metallic nanocrystal, hafnium oxide, and guanine. However, limited works built their nonvolatile memories using entirely of assembled 2D crystals. This is important in aspect view of large-scale manufacture and vertical integration for future memory device engineering. We report $WS_2$ based nonvolatile memories utilizing functional van der Waals heterostructure in which multi-layered graphene is encapsulated between $SiO_2$ and hexagonal boron nitride (hBN). We experimentally observed that, large memory window (20 V) allows to reveal high on-/off-state ratio (>$10^3$). Moreover, the devices manifest perfect retention of 13% charge loss after 10 years due to large graphene/hBN barrier height. Interestingly, the performance of our memories is drastically better than ever published work related to $MoS_2$ and black phosphorus flash memory technology.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.306.2-306.2
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• 2014

전자기기의 휴대성과 이동성이 강조되고 있는 현대사회에서 비휘발성 메모리는 메모리 산업에 있어 매우 매력적인 동시에 커다란 잠재성을 지닌다. 이미 공정의 한계에 부딪힌 Flash 메모리를 대신하여 10nm 이하의 공정이 가능한 상변화 메모리(Phase-Change Memory, PRAM), 스핀 주입 자화 반전 메모리(Spin Transfer Torque-Magnetic RAM, STT-MRAM), 저항 변화 메모리(Resistive Random Access Memory, ReRAM)가 차세대 비휘발성 메모리 후보로서 거론되고 있으며, 그 중에서도 ReRAM은 빠른 속도와 낮은 소비 전력, CMOS 공정 호환성, 그리고 비교적 단순한 3차원 적층 구조의 특성으로 인해 활발히 연구되고 있다. 특히 최근에는 질화물 또는 질소를 도핑한 산화물을 저항변화 물질로 사용하는 ReRAM이 보고되고 있는데, 이들은 동작전압이 낮을 뿐만 아니라 저항 변화(Resistive Switching, RS) 과정에서 일어나는 계면 산화를 방지할 수 있으므로 ReRAM의 저항 변화 재료로서 각광받고 있다. 그러나 Cell 단위의 ReRAM 소자를 Crossbar Array 구조에 적용시켰을 때 주변 Cell과의 저항 상태 차이로 인해 전류가 낮은 저항 상태(LRS)의 Cell로 흘러 의도치 않은 동작을 야기한다. 이와 같이 누설 전류(Leakage Current)로 인한 상호간의 간섭이 일어나는 Cross-talk 현상이 존재하며, 공정의 간소화와 집적도를 유지하면서 이 문제를 해결하는 것은 실용화하기에 앞서 매우 중요한 문제이다. 따라서, 본 논문에서는 Read 동작 시 발생하는 Cell과 Cell 사이의 Cross-talk 문제를 해결하기 위해 자가 정류 특성(Self-Rectifying)을 가지는 실리콘 질화물/알루미늄 질화물 이중층(Si3N4/AlN Bi-layer)으로 구성된 ReRAM 소자 구조를 제안하였으며, Sputtering 방법을 이용하여 제안된 소자를 제작하였다. 전압-전류 특성 실험결과, 제안된 구조에 대한 에너지 밴드 다이어그램 시뮬레이션 결과와 동일하게 Positive Bias 영역에서 자가 정류 특성을 획득하였고, 결과적으로 Read 동작 시 발생하는 Cross-talk 현상을 차단할 수 있는 결과를 확보하였다.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.87-92
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• 2016

The importance of heat dissipation for the electric device modules along the thickness direction is increasing. Two types of two-layered materials, metal-metal bonding and dielectric-metal bonding, have been fabricated by roll bonding process and a thermal diffusivity of the specimens was measured along the thickness direction. The thermal diffusivity of specimens with metal-metal bonding measured by light flash analysis (LFA) showed a same value independent on the direction of heat flow. However, the thermal diffusivity of specimens with dielectric-metal bonding showed a big difference of 17.5% when the direction of heat flow changed oppositely in the LFA process. The measured thermal diffusivity of specimens when the heat flows from metal to dielectric direction showed smaller value of 17.5% compared to the value when the heat flow from dielectric to metal direction. The difference in thermal diffusivity of specimens with dielectric-metal bonding dependence on direction of heat flow is due to the electron-phonon resistance that occurred transfer process of electron energy to phonon energy near the interface.