• Tribology and Lubricants
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• v.32 no.2
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• pp.44-49
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• 2016

Diamond mechanical polishing (DMP) is a crucial process in a sapphire wafering process to improve flatness and achieve the target thickness by using free abrasives. In a DMP process, material removal rate (MRR) is a key factor to reduce process time and cost. Controlling mechanical parameters, such as velocity and pressure, can increase the MRR in a DMP process. However, there are limitations of using high velocities and pressures for achieving a high MRR owing to their side effects. In this paper, we present the lapping characteristics and improvement of MRR by using a fixed abrasive plate through an experimental study. The change in MRR as a function of velocity and pressure follows Preston's equation. The surface roughness of a wafer decreases as the plate velocity and pressure increases. We observe a sharp decrease in MRR over the lapping time at a high velocity and pressure in the velocity and pressure test. An analysis of surface roughness (Rq and Rpk) indicates that wear of abrasives decreases the MRR sharply. In order to investigate the effect of abrasive wear on the MRR, we utilize a cutting fluid and a rough wafer. The cutting fluid delays the wear of abrasives resulting in improvement of MRR drop. The rough wafer maintains the MRR at a stable rate by self-dressing.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.2
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• pp.38-45
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• 2005

Chemical mechanical polishing(CMP) has been widely accepted for the planarization of multi-layer structures in semiconductor fabrication. But a variety of defects such as abrasive contamination, scratch, dishing, erosion and corrosion are occurred during CMP. Especially, dishing and erosion defects increase the metal resistance because they decrease the interconnect section area, and ultimately reduce the lift time of the semiconductor. Due to this reason dishing and erosion must be prohibited. The pattern density and size in chip have a significant influence on dishing and erosion occurred by over-polishing. The fixed abrasive pad(FAP) was applied and tested to reduce dishing and erosion in this paper. The abrasive concentration decrease of FAP results in advanced pattern selectivity which can lead the uniform removal in chip and declining over-polishing. Consequently, reduced dishing and erosion was observed in CMP of tungsten pattern wafer with proposed FAP and chemicals.

• Journal of the Korean Society of Safety
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• v.16 no.3
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• pp.35-40
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• 2001

An internal finishing process applying Magnetic Abrasive Finishing (MAF) was proposed to produce smooth inner surfaces of tubes at a high rate. Since this process uses the tube rotation system, it has been considered applicable only to tubes which are rotatable at high speeds. Here development of the stainless tube(STS 304) rotation system to extend the scope of the application of the internal finishing process applying MAF was made. By the stainless tube(STS 304) rotation system, the abrasive magnetically attracted by the poles is rotated along the inner surface of the tube by magnetic force together with fixed poles, finishing the inner surface of the tube. The main results obtained are as follows : 1) The magnet abrasive finishing minimized influence due to external force because non-contact finishing, 2) The profile of surface roughness decreased very good in 11.4m/min range because abrasive size and speed, 3) The profile of surface roughness by flux density decreased in finishing speed 28m/min, 4) The profile of surface roughness by fled rate decreased in 0.16mm/rev and 0.18mm/rev.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1873-1876
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• 2003

Magneto-rheological polishing is a new technology used in precision polishing. It utilizes magneto-rheological fluid. nonmagnetic polishing abrasive, aqueous carrier fluids in magnetic field to remove material from a part surface. Silicon micro channel as work piece is fixed in the slurry which is made of MR fluid and CeO$_2$(10 vol%) abrasive particles. And permanent magnet rotate in the slurry to transfers magnetic force to abrasive particles by increasing yield strength of MR fluid. so, the obtained bottom surface roughness of micro channel by experiment reduced to Ra 0.010 $\mu\textrm{m}$ Rmax 0.103 $\mu\textrm{m}$ and finwall surface roughness of micro channel reduced to Ra 0.018 $\mu\textrm{m}$ Rmax 0.468 $\mu\textrm{m}$. At optimum conditions of variables, the workpiece as silicon micro channel have about 24 times smaller surface roughness than before polishing.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.9
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• pp.25-30
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• 2001

• Journal of the Korean Society for Precision Engineering
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• v.22 no.6 s.171
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• pp.109-117
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• 2005

In case of fine machining processes, the cutting state monitoring by a skilled operator is impossible because the physical changes generated during fine machining are very weak. To realize the high efficient and precise fine machining, it is necessary to develop the sensor based monitoring system which is able to detect the fine changes of cutting state. In this paper, the fine acoustic emission monitoring system is developed to monitor the state of the fine machining process. The developed system consists of the AE sensor and the AE signal processing unit. And this has the high-sensitivity and bandwidth which can detect fine AE signal generated during fine machining process. In order to investigate the feasibility of the developed system, evaluation experiments were performed in the fine fixed-abrasive machining processes such as polishing and glass ferrule slicing. Experimental results show that the developed monitoring system possesses an excellent real-time monitoring capability at fine machining processes.

• Design & Manufacturing
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• v.1 no.1
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• pp.7-11
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• 2007

The fabrication of precision optical components by deterministic CNC grinding is an area of great current interest. Replacement of the traditional, craftsman driven, optical fabrication process is essential to reduce costs and increase process flexibility and reliability. Moreover, CNC grinding is well suited to the fabrication of complex shapes such as aspheres, making it possible to design optical systems with fewer components and reduced weight. Current technology is capable of producing surfaces with less than 2 microns peak to valley error, 50 nm rms surface roughness, and less than 1 micron subsurface damage. Bound abrasive tools, in which the abrasive particles are fixed in a second (matrix) material, play an important part in achieving this performance. In this paper, the factors affecting the ultra-fine surface roughness and profile accuracy of machined surfaces of aspheric parts has been analyzed experimentally and theoretically and on ultra-precision aspheric grinding system and precise adjusting mechanism have been designed and manufactured. In the paper we report the results of experiments and modeling performed to examine the effects of machinability, occurring during grinding of optical surfaces, on the tool surface profile. Profiles of machined surface were measured by using SEM. In order to optimize grinding conditions of aspheric lens processing, we performed experiments by design of experiments.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.42-45
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• 2002

General wheel mark in mono-crystalline silicon wafer finding is able to be expected because it depends on radius ratio and angular velocity ratio of wafer and wheel. The pattern is predominantly determined by the contour of abrasive grits resulting from a relative motion. Although such a wheel mark is made uniform pattern if the process parameters are fixed, sub-surface defect is expected to be distributed non-uniformly because of characteristic of mono-crystalline silicon wafer that has diamond cubic crystal. Consequently it is considered that this phenomenon affects the following process. This paper focused on kinematic analysis of wafer grinding process and simulation program was developed to verify the effect of process variables on wheel mark. And finally, we were able to predict sub-surface defect distribution that considered characteristic of mono-crystalline silicon wafer

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.537-542
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• 2004

Machinble Ceramics have some excellent properties as the material for the mechanical components. It is, however, very difficult to grind ceramics with high efficiency because of their high strength, hardness and brittleness. Lapping used diamond slurry and lapping by in-process electrolytic dressing is developed to solve this problem. On this paper, a comparative study of processing ability of lapping used diamond slurry and lapping by in-process electrolytic dressing.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.10 no.3
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• pp.38-42
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• 2001

In the machining of glass fiber reinforced plastics(GFRP), turning has been often used. But the most of past studies have been interested in the effect of fiber orientation on tool wear. In this study, the effects of fiber contents and cutting speeds on tool wear, cutting force and surface roughness are investigated experimentally. By proper selection of cutting tool, the variables are cutting speed, fiber contents and cutting length with fixed feed rate and depth of cut. The fiber contents have major effects on coated tool wear which observed as abrasive wear type.