• 한국식품영양과학회지
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• 제15권1호
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• pp.39-44
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• 1986

Kacdugi fermented in the subatomospheric pressure(350mmHg) and polyethylene film package to improve the quality and to investigate the effect of fermentative control at $25^{\circ}C$. Brix degree, acidity, vitamin C content and number of total microbe and Lactobacilli was determined and also, the edible period of kacdugi was checked up by sensory assessment. The increasing rate of brix degree during kacdugi fermentation was high in the subatomospheric pressure, but decreased at the last period of fermentation as same tendency to the control, and it was preferably increased at the last period of fermentation in the polyethylene film package. However, the acidity was higher in the control than sbuatomospheric pressure but it was low in the polyethylene film package. Vitamin C content was high in the control at beginning and middle period of fermentation but high in sbuatomospheric pressure, and was low in the polyethylene film package at the last period of fermentation. The number of Lactobacilli was more in the subatomospheric pressure and polyethylene film package than the control, but it was suddenly incressed for the total microbe in the polyethylene film package at last period of fermentation. The edible periods of kacdugi by the sensory assessment of sour flavor, hardness and complex flavor was second days in the control. third days in the polyethylene film package, and fifth days in the subatomospheric pressure after soaking.

• 한국포장학회지
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• 제26권1호
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• pp.19-23
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• 2020

Al-laminated packaging film incorporating ascorbic acid or tocopherol at inner food contact layer was tested in the potential to improve antioxidative preservation of powdered infant formula under CO₂-enriched atmosphere. Product of 200 g was packaged with the packaging film containing 0.3% antioxidant in sealant layer of low density polyethylene and stored at 30℃ for 286 days with periodic measurement of package atmosphere and product's quality attributes. The CO₂-flushed package resulted in shrinkage of tight contact between the product and the film not allowing gas sampling of package atmosphere after 140 days. Package of tocopherol-incorporated film allowed some ingress of oxygen after 112 days presumably due to its weakening of heat-seal area. The increased oxygen concentration in the tocopherol-added film package led to the concomitant increase of peroxide value, an index of lipid oxidation. On the other hand, packaging of ascorbic acid-added film pouch could suppress lipid oxidation marginally in consistent manner compared to control package without any antioxidant.

• 한국식품저장유통학회지
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• 제2권2호
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• pp.285-291
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• 1995

This study was performed to investigate the optimum moisture content and the best packaging method of dried persimmons for long term storage at room temperature. The package material to be used were 0.05mm polyethylene film, Wrap film, 0.08mm LDPE film exchanged nitrogen gas, and non package for untreated control. Before the storage, the initial moisture contents of dried persimmons were treated with 40%, 35% and 30%, respectively; 40% as traditional dryness, 35% as extending dry period one more week, and 30% as for two more weeks. The best package method was 0.08mm LDPE film exchanged nitrogen gas, and the optimum moisture control was 35%

• 마이크로전자및패키징학회지
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• 제20권3호
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• pp.63-69
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• 2013

Package on Package(PoP)용 하부 패키지에 대해 플립칩 본딩으로 칩을 기판에 실장한 패키지와 die attach film(DAF)을 사용하여 칩을 기판에 접착한 패키지의 warpage 특성을 비교하였다. 플립칩 본딩으로 칩을 기판에 실장한 패키지와 DAF를 사용하여 칩을 기판에 실장한 패키지는 솔더 리플로우 온도인 $260^{\circ}C$에서 각기 $57{\mu}m$와 $-102{\mu}m$의 warpage를 나타내었다. 상온에서 $260^{\circ}C$ 사이의 온도 범위에서 플립칩 실장한 패키지는 $-27{\sim}60{\mu}m$ 범위의 warpage를 나타내는 반면에, DAF 실장한 패키지는 $-50{\sim}-153{\mu}m$ 범위의 warpage를 나타내었다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.653-654
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• 2010

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.239-242
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• 2003

Optical module package is a hermetic metal-ceramic package for carrying optical IC. In case of LD(laser diode) module, window is used for both the path of optical signal and hermetic sealing of package. So, window has the metallization pattern on the surface for brazing process with package wall. In this study, several method were investigated for metallization. Thin film, thick film and mixed method were used for fabrication of metallization pattern. After brazing process, hermeticity and adhesion strength were tested for characterization of metallization pattern.

• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.65-70
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• 2014

박형 package-on-package의 상부 패키지에 대하여 PCB 기판, 칩본딩 및 에폭시 몰딩과 같은 공정단계 진행에 따른 warpage 특성을 분석하였다. $100{\mu}m$ 두께의 박형 PCB 기판 자체에서 $136{\sim}214{\mu}m$ 범위의 warpage가 발생하였다. 이와 같은 PCB 기판에 $40{\mu}m$ 두께의 박형 Si 칩을 die attach film을 사용하여 실장한 시편은 PCB 기판의 warpage와 유사한 $89{\sim}194{\mu}m$의 warpage를 나타내었으나, 플립칩 공정으로 Si 칩을 PCB 기판에 실장한 시편은 PCB 기판과 큰 차이를 보이는 $-199{\sim}691{\mu}m$의 warpage를 나타내었다. 에폭시 몰딩한 패키지의 경우에는 DAF 실장한 시편은 $-79{\sim}202{\mu}m$, 플립칩 실장한 시편은 $-117{\sim}159{\mu}m$의 warpage를 나타내었다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 추계학술발표대회
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• pp.25.1-25.1
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• 2011

Over the past few decades, metallic nanoparticles (NPs) have been of great interest due to their unique mesoscopic properties which distinguish them from those of bulk metals; such as lowered melting points, greater versatility that allows for more ease of processability, and tunable optical and mechanical properties. Due to these unique properties, potential opportunities are seen for applications that incorporate nanomaterials into optical and electronic devices. Specifically, the development of metallic NPs has gained significant interest within the electronics field and technological community as a whole. In this study, gold (Au) pads for surface finish in electronic package were developed by inkjet printing of Au NPs. The microstructures of inkjet-printed Au film were investigated by various thermal treatment conditions. The film showed the grain growth as well as bonding between NPs. The film became denser with pore elimination when NPs were sintered under gas flows of $N_2$-bubbled through formic acid ($FA/N_2$) and $N_2$, which resulted in improvement of electrical conductance. The resistivity of film was 4.79 ${\mu}{\Omega}$-cm, about twice of bulk value. From organic anlayses of FTIR, Raman spectroscopy, and TGA, the amount of organic residue in the film was 0.43% which meant considerable removal of the solvent or organic capping molecules. The solder ball shear test was adopted for solderability and shear strength value was 820 gf (1 gf=9.81 mN) on average. This shear strength is good enough to substitute the inkjet-printed Au nanoparticulate film for electroplating in electronic package.

• 동아시아식생활학회지
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• 제13권6호
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• pp.615-623
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• 2003

This study has been conducted to develop brown stock with the high pressure cooking(HPC) method. The sterilization methods, package film and storage methods, and quality maintenance during storage were investigated in this study. The packaging quality of NY/PP was inferior to that of PE/AL/PP since NY/PP facilitated the ventilation and moisture absorption. The maximum duration of the safe storage was found to be 50 days at 25$^{\circ}C$, 30 days at 35$^{\circ}C$ for NY/PP package film, and 60 days at 25$^{\circ}C$, 40 days at 35$^{\circ}C$ for PE/AL/PP one. These results showed that the overall quality of brown stock by the HPC method was not different significantly from that of brown stock by the traditional approach. Furthermore, the HPC approach might improve the productivity by saving the labour cost, food cost, and cooking time. Therefore, the traditional method might well be substituted by this newly developed method.

• 한국산업융합학회 논문집
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• 제2권1호
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• pp.105-112
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• 1999

Model predicting the respiration rate of pear under modified LDPE film pouch has been developed. The assumptions of the model have three bases; 1) respiration rate is depending on $CO_2$ and $O_2$ concentration in the package, 2) the oxidation of glucose in pear generates carbon dioxides, and 3) gases permeation through the package film bases on the Langmuir adsorption theory and Fick's law. The simulated results agreed fairly well with the experimental data so as this model to be useful in designing the modified atmospheric packaging system.