• Journal of the Korean Society of Food Science and Nutrition
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• v.15 no.1
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• pp.39-44
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• 1986

Kacdugi fermented in the subatomospheric pressure(350mmHg) and polyethylene film package to improve the quality and to investigate the effect of fermentative control at $25^{\circ}C$. Brix degree, acidity, vitamin C content and number of total microbe and Lactobacilli was determined and also, the edible period of kacdugi was checked up by sensory assessment. The increasing rate of brix degree during kacdugi fermentation was high in the subatomospheric pressure, but decreased at the last period of fermentation as same tendency to the control, and it was preferably increased at the last period of fermentation in the polyethylene film package. However, the acidity was higher in the control than sbuatomospheric pressure but it was low in the polyethylene film package. Vitamin C content was high in the control at beginning and middle period of fermentation but high in sbuatomospheric pressure, and was low in the polyethylene film package at the last period of fermentation. The number of Lactobacilli was more in the subatomospheric pressure and polyethylene film package than the control, but it was suddenly incressed for the total microbe in the polyethylene film package at last period of fermentation. The edible periods of kacdugi by the sensory assessment of sour flavor, hardness and complex flavor was second days in the control. third days in the polyethylene film package, and fifth days in the subatomospheric pressure after soaking.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.26 no.1
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• pp.19-23
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• 2020

Al-laminated packaging film incorporating ascorbic acid or tocopherol at inner food contact layer was tested in the potential to improve antioxidative preservation of powdered infant formula under CO₂-enriched atmosphere. Product of 200 g was packaged with the packaging film containing 0.3% antioxidant in sealant layer of low density polyethylene and stored at 30℃ for 286 days with periodic measurement of package atmosphere and product's quality attributes. The CO₂-flushed package resulted in shrinkage of tight contact between the product and the film not allowing gas sampling of package atmosphere after 140 days. Package of tocopherol-incorporated film allowed some ingress of oxygen after 112 days presumably due to its weakening of heat-seal area. The increased oxygen concentration in the tocopherol-added film package led to the concomitant increase of peroxide value, an index of lipid oxidation. On the other hand, packaging of ascorbic acid-added film pouch could suppress lipid oxidation marginally in consistent manner compared to control package without any antioxidant.

• Food Science and Preservation
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• v.2 no.2
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• pp.285-291
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• 1995

This study was performed to investigate the optimum moisture content and the best packaging method of dried persimmons for long term storage at room temperature. The package material to be used were 0.05mm polyethylene film, Wrap film, 0.08mm LDPE film exchanged nitrogen gas, and non package for untreated control. Before the storage, the initial moisture contents of dried persimmons were treated with 40%, 35% and 30%, respectively; 40% as traditional dryness, 35% as extending dry period one more week, and 30% as for two more weeks. The best package method was 0.08mm LDPE film exchanged nitrogen gas, and the optimum moisture control was 35%

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.63-69
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• 2013

The warpage of a bottom package of Package on Package(PoP) where a chip was mounted to a substrate by flip chip process was compared to that of a bottom package for which a chip was bonded to a substrate using die attach film(DAF). At the solder reflow temperature of $260^{\circ}C$, the packages processed with flip chip bonding and DAF bonding exhibited warpages of $57{\mu}m$ and $-102{\mu}m$, respectively. At the temperature range between room temperature and $260^{\circ}C$, the packages processed with flip chip bonding and DAF bonding exhibited warpage values ranging from $-27{\mu}m$ to $60{\mu}m$ and from $-50{\mu}m$ to $-15{\mu}m$, respectively.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.653-654
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• 2010

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.239-242
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• 2003

Optical module package is a hermetic metal-ceramic package for carrying optical IC. In case of LD(laser diode) module, window is used for both the path of optical signal and hermetic sealing of package. So, window has the metallization pattern on the surface for brazing process with package wall. In this study, several method were investigated for metallization. Thin film, thick film and mixed method were used for fabrication of metallization pattern. After brazing process, hermeticity and adhesion strength were tested for characterization of metallization pattern.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.65-70
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• 2014

Warpage of top packages to form thin package-on-packages was measured with progress of their process steps such as PCB substrate itself, chip bonding, and epoxy molding. The $100{\mu}m$-thick PCB substrate exhibited a warpage of $136{\sim}214{\mu}m$. The specimen formed by mounting a $40{\mu}m$-thick Si chip to such a PCB using a die attach film exhibited the warpage of $89{\sim}194{\mu}m$, which was similar to that of the PCB itself. On the other hand, the specimen fabricated by flip chip bonding of a $40{\mu}m$-thick chip to such a PCB possessed the warpage of $-199{\sim}691{\mu}m$, which was significantly different from the warpage of the PCB. After epoxy molding, the specimens processed by die attach bonding and flip chip bonding exhibited warpages of $-79{\sim}202{\mu}m$ and $-117{\sim}159{\mu}m$, respectively.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.25.1-25.1
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• 2011

Over the past few decades, metallic nanoparticles (NPs) have been of great interest due to their unique mesoscopic properties which distinguish them from those of bulk metals; such as lowered melting points, greater versatility that allows for more ease of processability, and tunable optical and mechanical properties. Due to these unique properties, potential opportunities are seen for applications that incorporate nanomaterials into optical and electronic devices. Specifically, the development of metallic NPs has gained significant interest within the electronics field and technological community as a whole. In this study, gold (Au) pads for surface finish in electronic package were developed by inkjet printing of Au NPs. The microstructures of inkjet-printed Au film were investigated by various thermal treatment conditions. The film showed the grain growth as well as bonding between NPs. The film became denser with pore elimination when NPs were sintered under gas flows of $N_2$-bubbled through formic acid ($FA/N_2$) and $N_2$, which resulted in improvement of electrical conductance. The resistivity of film was 4.79 ${\mu}{\Omega}$-cm, about twice of bulk value. From organic anlayses of FTIR, Raman spectroscopy, and TGA, the amount of organic residue in the film was 0.43% which meant considerable removal of the solvent or organic capping molecules. The solder ball shear test was adopted for solderability and shear strength value was 820 gf (1 gf=9.81 mN) on average. This shear strength is good enough to substitute the inkjet-printed Au nanoparticulate film for electroplating in electronic package.

• Journal of the East Asian Society of Dietary Life
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• v.13 no.6
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• pp.615-623
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• 2003

This study has been conducted to develop brown stock with the high pressure cooking(HPC) method. The sterilization methods, package film and storage methods, and quality maintenance during storage were investigated in this study. The packaging quality of NY/PP was inferior to that of PE/AL/PP since NY/PP facilitated the ventilation and moisture absorption. The maximum duration of the safe storage was found to be 50 days at 25$^{\circ}C$, 30 days at 35$^{\circ}C$ for NY/PP package film, and 60 days at 25$^{\circ}C$, 40 days at 35$^{\circ}C$ for PE/AL/PP one. These results showed that the overall quality of brown stock by the HPC method was not different significantly from that of brown stock by the traditional approach. Furthermore, the HPC approach might improve the productivity by saving the labour cost, food cost, and cooking time. Therefore, the traditional method might well be substituted by this newly developed method.

• Journal of the Korean Society of Industry Convergence
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• v.2 no.1
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• pp.105-112
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• 1999

Model predicting the respiration rate of pear under modified LDPE film pouch has been developed. The assumptions of the model have three bases; 1) respiration rate is depending on $CO_2$ and $O_2$ concentration in the package, 2) the oxidation of glucose in pear generates carbon dioxides, and 3) gases permeation through the package film bases on the Langmuir adsorption theory and Fick's law. The simulated results agreed fairly well with the experimental data so as this model to be useful in designing the modified atmospheric packaging system.