• Title/Summary/Keyword: film density

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Microstructure and Property Relationship of Laser Ablated YBCO Thin Films from Modified Melt-Textured Grown Targets

  • Kim, C.H.;Hahn, T.S.;Hong, K.S.
    • Progress in Superconductivity
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    • v.2 no.1
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    • pp.15-19
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    • 2000
  • [ $YBa_2Cu_3O_{7-\delta}$ ] thin films were deposited by laser ablation using modified melt-textured grown targets. As the laser energy density was increased, the films showed an increasing c-axis orientation and an improvement of superconducting properties. However, at 4 $J/cm^2$, the degree of c-axis alignment and $J_c$ of the film were considerably reduced. These were attributed to the enhanced a-axis outgrowths. It was shown that the increased laser energy density resulted in the formation of $Y_2O_3$ inclusions during the c-axis film growth, and that these inclusions nucleated the a-axis outgrowths.

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Influence of Channel Thickness Variation on Temperature and Bias Induced Stress Instability of Amorphous SiInZnO Thin Film Transistors

  • Lee, Byeong Hyeon;Lee, Sang Yeol
    • Transactions on Electrical and Electronic Materials
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    • v.18 no.1
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    • pp.51-54
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    • 2017
  • TFTs (thin film transistors) were fabricated using a-SIZO (amorphous silicon-indium-zinc-oxide) channel by RF (radio frequency) magnetron sputtering at room temperature. We report the influence of various channel thickness on the electrical performances of a-SIZO TFTs and their stability, using TS (temperature stress) and NBTS (negative bias temperature stress). Channel thickness was controlled by changing the deposition time. As the channel thickness increased, the threshold voltage ($V_{TH}$) of a-SIZO changed to the negative direction, from 1.3 to -2.4 V. This is mainly due to the increase of carrier concentration. During TS and NBTS, the threshold voltage shift (${\Delta}V_{TH}$) increased steadily, with increasing channel thickness. These results can be explained by the total trap density ($N_T$) increase due to the increase of bulk trap density ($N_{Bulk}$) in a-SIZO channel layer.

Lifetime Estimation of Amplifier IC due to Electromigration failure (Electromigration 고장에 의한 Amplifier IC의 수명 예측)

  • Lee, Ho-Young;Chang, Mi-Soon;Kwack, Kae-Dal
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1265-1270
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    • 2008
  • Electromigration is a one of a critical failure mechanism in microelectronic devices. Minimizing the thin film interconnections in microelectronic devices make high current densities at electrrical line. Under high current densities, an electromigration becomes critical problems in a microelectronic device. This phenomena under DC conditions was investigated with high temperature. The current density of 1.5MA/cm2 was stressed in interconnections under DC condition, and temperature condition $150^{\circ}C,\;175^{\circ}C,\;200^{\circ}C$. By increasing of thin film interconections, microelectronic devices durability is decreased and it gets more restriction by temperature. Electromigration makes electronic open by void induced, and hillock induced makes electronic short state.

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중성자 산란을 이용한 생체물질의 구조 연구 : 단백질의 생체유사막의 흡착

  • Sin, Gwan-U;Rafailovich, M.H.;Sokolov, J.;Pernodet, N.;Satija, S.K.
    • 한국생물공학회:학술대회논문집
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    • 2002.04a
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    • pp.30-33
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    • 2002
  • We have shown that it is possible to form a fibrilar network of fibronectin on a polyelectrolyte polymer film whose dimensions are similar to those reported on the extra cellular matrix. The fibronectin network was observed to form only when the charge density of the polymer was in excess of the natural charge density of the cell wall. Furthermore, the self-organized fibronectin layer was much thicker than the polymer film, indicating that long ranged interaction may playa key role in the assembly process. It is therefore important to understand the structure of the polymer layer/protein interface. Here we report on a neutron reflectivity study where we explore the structure of the polyelectrolyte layer, in this case sulfonated polystyrene (PSSx,), with varying degree of sulfonation (x<30%), as a function of sulfur content and counter ion concentration. These results are then correlated with systemic study of the adsorption and the multilayer formation of fibronectin as a function of incubation time for various sulfonation levels of $PSSx.^1$

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Crystallinity and Internal Defect Observation of the ZnTe Thin Film Used by Opto-Electronic Sensor Material (광소자로 사용되는 ZnTe박박의 결정성에 따른 결함 관찰)

  • Kim, B.J.
    • Journal of the Korean institute of surface engineering
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    • v.35 no.5
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    • pp.289-294
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    • 2002
  • ZnTe films have been grown on (100) GaAs substrate with two representative problems. The one is lattice mismatch, the other is thermal expansion coefficients mismatch of ZnTe /GaAs. It claims here, the relationship of film thickness and defects distribution with (100) ZnTe/GaAs using hot wall epitaxy (HWE) growth was investigated by transmission electron microscopy (TEM). It analyzed on the two-sort side using TEM with cross-sectional transmission electron microscopy (XTEM) and high-resolution electron microscopy (HREM). Investigation into the nature and behavior of dislocations with dependence-thickness in (100) ZnTe/ (100) GaAs hetero-structures grown by transmission electron microscopy (TEM). This defects range from interface to 0.7 $\mu\textrm{m}$ was high density, due to the large lattice mismatch and thermal expansion coefficients. The defects of low density was range 0.7$\mu\textrm{m}$~1.8$\mu\textrm{m}$. In the thicker range than 1.8$\mu\textrm{m}$ was measured hardly defects.

Polycrystalline Silicon Thin Film Transistor Fabrication Technology (다결정 실리콘 박막 트랜지스터 제조공정 기술)

  • 이현우;전하응;우상호;김종철;박현섭;오계환
    • Journal of the Korean Vacuum Society
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    • v.1 no.1
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    • pp.212-222
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    • 1992
  • To use polycrystalline Si Thin Film Transistor (poly-Si TFT) in high density SRAM instead of High Load Resistor (HLR), TFT is needed to show good electrical characteristics such as large carrier mobility, low leakage current, high driver current and low subthreshold swing. To satisfy these electrical characteristics, the trap state density must be reduced in the channel poly. Technological issues pertinent to the channel poly fabrication process are investigated and discussed. They are solid phase growth (SPG), Si-ion implantation, laser annealing and hydrogenation. The electrical properties of several CVD oxides used as the gate oxide of TFT are compared. The dependence of the electrical characteristics of TFT on source-drain ion-implantation dose, drain offset length and dopant lateral diffusion are also described.

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The Electrical Properties of Mo-doped BiNbO4 Ceramic Thick Film Monopole Antenna (Mo을 치환한 BiNbO4 세라믹 후막 모노폴 안테나의 전기적 특성)

  • 서원경;허대영;최문석;안성훈;정천석;이재신
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.11
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    • pp.987-993
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    • 2003
  • We fabricated thick film monopole antennas using Mo-doped BiNbO$_4$ ceramics and investigated their electrical properties as a function of the Mo-doping concentration. Compared with undoped BiNbO$_4$ ceramics, 10 at.% Mo-doping improved microwave dielectric properties of ceramics by increased sintered density as well as decreased space charge density. Further increase in the Mo-doping concentration caused formation of Bi$_2$MoO$_{6}$ phases, resulting in deterioration of the microwave characteristics. The gain and bandwidth of the ceramic monopole antenna were also greatly affected by the Mo-doping concentration. When Mo-doping concentration was 10 at.%, highest gain of -0.7dBi with lowest bandwidth of 30% at 2.3GHz was obtained.

FUTURE HEAD/MEDIA TECHNOLOGIES IN RIGID DISK DRIVES

  • Byun, Chong-Won
    • Proceedings of the Korean Magnestics Society Conference
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    • 1994.03a
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    • pp.12-13
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    • 1994
  • Magnetic recording is still considered to be a.leader in storage industries in general. The rigid disk drive, in particular, has an advantage over tape, optical, magneto-optical, or flash memories, because of high areal density and fast access time with reasonably low cost per Mbyte. However, to be competitive in the market and to keep an edge over other storage devices, head and media in rigid disk drives require better performance per cost and more aggressive improvement in areal density, as shown in Fig. 1, than before. In this review paper, the future trend in head/media technologies of the rigid disk drive has been reviewed. Thin film media and thin film inductive/MR heads will be mainly discussed, since they are expected to be dominant in the future high-end drives over other technologies, such as particulate media or MIG heads.(omitted)mitted)

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Study of surface state density of hydrogenated amorphous silicon thinfilm transistors by admittance spectroscopy

  • Hsieh, Ming-Ta;Chang, Chan-Ching;Chen, Jenn-Fang;Zan, Hsiao-Wen;Yen, Kuo-Hsi;Shih, Ching-Chieh;Chen, Chih-Hsien;Lee, Yeong-Shyang;Chiu, Hsin-Chih
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.904-907
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    • 2007
  • We reported a simplified circuit model to investigate the interface states and the quality of a-Si film based on a MIS structure using admittance spectroscopy. The model can be employed easily to monitor the fabrication process of thin-film transistor and to obtain the important parameters.

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Influence of Channel Length on the Performance of Poly-Si Thin-Film Transistors (다결정 실리콘 박막 트랜지스터의 성능에 대한 채널 길이의 영향)

  • 이정석;장창덕;백도현;이용재
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.05a
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    • pp.450-453
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    • 1999
  • In this paper, The relationship between device performance and channel length(1.5-50$\mu$m) in polysilicon thin-film transistors fabricated by SPC technology was Investigated by measuring electric Properties such as 1-V characteristics, field effect mobility, threshold voltage, subthreshold swing, and trap density in grain boundary with channel length. The drain current at ON-state increases with decreasing channel length due to increase of the drain field, while OFF-state current (leakage current) is independent of channel length. The field effect mobility decrease with channel length due to decreasing carrier life time by the avalanche injection of the carrier at high drain field. The threshold voltage and subthreshold swing decrease with channel length, and then increase in 1.5 $\mu$m increase of increase of trap density in grain boundary by impact ionization.

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