• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제53권3호
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• pp.128-132
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• 2004

The perovskite ferroelectric materials of the PZT, SBT and BST series will attract much attention for application to ULSI devices. Among these materials, the BST ($Ba_0.6$$Sr_0.4$/$TiO_3$) is widely considered the most promising for use as an insulator in the capacitors of DRAMS beyond 1 Gbit and high density FRAMS. Especially, BST thin films have a good thermal-chemical stability, insulating effect and variety of Phases. However, BST thin films have problems of the aging effect and mismatch between the BST thin film and electrode. Also, due to the high defect density and surface roughness at grain boundarys and in the grains, which degrades the device performances. In order to overcome these weakness, we first applied the chemical mechanical polishing (CMP) process to the polishing of ferroelectric film in order to obtain a good planarity of electrode/ferroelectric film interface. BST ferroelectric film was fabricated by the sol-gel method. And then, we compared the surface characteristics before and after CMP process of BST films. We expect that our results will be useful promise of global planarization for FRAM application in the near future.

• 전기화학회지
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• 제12권3호
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• pp.251-257
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• 2009

In this study, we fabricated nickel oxide thin film for lithium based electrolyte using sol-gel method. This film was deposited by dip-coating method with mixed solvent of DameH (N,N-dimethylaminoethanol) and DI water. As changing the ratio between DmaeH and DI water, nickel oxide thin film was presented in different charge density and optical transmittance because they were shown various thickness. It was accounted for changing viscosity and density by the ratio of DmaeH and DI water. The thin film synthesized with 1 : 1 ratio of DmaeH and DI water was expressed best electrochromic performance in lithium based electrolyte, because of thick thickness but porous structures.

• 한국전기전자재료학회논문지
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• 제25권4호
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• pp.304-308
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• 2012

Transparent thin film transistors (TTFT) were fabricated using the rf magnetron sputtered ZnO-$SnO_2$ films as active layers. A ceramic target whose Zn atomic ratio to Sn is 2:1 was employed for the deposition of ZnO-$SnO_2$ films. To study the post-annealing effects on the properties of TTFT, ZnO-$SnO_2$ films were annealed at $200^{\circ}C$ or $400^{\circ}C$ for 5 min before In deposition for source and drain electrodes. Oxygen was added into chamber during sputtering to raise the resistivity of ZnO-$SnO_2$ films. The effects of oxygen addition on the properties of TTFT were also investigated. 100 nm $Si_3N_4$ film grown on 100 nm $SiO_2$ film was used as gate dielectrics. The mobility, $I_{on}/I_{off}$, interface state density etc. were obtained from the transfer characteristics of ZnO-$SnO_2$ TTFTs.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.339.1-339.1
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• 2014

In this paper we studied the application of inter-poly dielectric as silicon dioxide-like film was deposited by the higher energy assisting deposition (HEAD) process the modified CCP process, which enables low temperature (LT) process and improving film density. In these experiments the relative hydrogen concentration of $SiO_2$-like films deposited on silicon substrate were analyzed by the secondary ion mass spectroscopy (SIMS) and it was shown that our lower hydrogenated oxide (LHO) film prepared by HEAD process with the precursor contained the siloxane species had lower hydrogen concentration, $8{\times}10{\cdot}^{22}cm{\cdot}^3$ than that of the commercial undoped silicon glass (USG) film ($1{\times}10{\cdot}^{21}cm{\cdot}^3$) prepared by the high density plasma-chemical vapor deposition (HDP-CVD). We consider that the LHO film deposited by HEAD process used as high performance material into Flash memory devices.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.140-143
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• 2003

BST thin films have a good thermal-chemical stability, insulating effect and variety of phases. However, BST thin films have problems of the aging effect and mismatch between the BST thin film and electrode. Also, due to the high defect density and surface roughness at grain boundarys and in the grains, which degrades the device performances. In order to overcome these weakness, we first applied the chemical mechanical polishing (CMP) process to the polishing of ferroelectric film in order to obtain a good planarity of electrode/ferroelectric film interface. BST ferroelectric film was fabricated by the sol-gel method. And then, we compared the structural characteristics before and after CMP process of BST films. We expect that our results will be useful promise of global planarization for FRAM application in the near future.

• Transactions on Electrical and Electronic Materials
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• 제12권6호
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• pp.258-261
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• 2011

A ferroelectric $(Bi,La)_4Ti_3O_{12}$ (BLT) thin film fabricated by the pulsed-DC sputtering method was evaluated on a cell structure to check its compatibility to high density ferroelectric random access memory (FeRAM) devices. The BLT composition in the sputtering target was $Bi_{4.8}La_{1.0}Ti_{3.0}O_{12}$. Firstly, a BLT film was deposited on a buried Pt/$IrO_x$/Ir bottom electrode stack with W-plug connected to the transistor in a lower place. Then, the film was finally crystallized at $700^{\circ}C$ for 30 seconds in oxygen ambient. The annealed BLT layer was found to have randomly oriented and small ellipsoidal-shaped grains (long direction: ~100 nm, short direction: ~20 nm). The small and uniform-sized grains with random orientations were considered to be suitable for high density FeRAM devices.

• Nuclear Engineering and Technology
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• 제8권1호
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• pp.9-17
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• 1976

고준위 전자선량을 측정하기 위하여 두께 0.1mm인 polycarbonate 필름을 선정하여 선량계 특성을 조사하였다. 선량범위는 1.0-130Mrad이며 도정곡선을 이용하여 200Mrad까지도 측정할 수 있었고 측정요차는 3.5% 이내였다. 330nm데서 측정한 농도는 실온에서는 조사후 1일 동안에 약 7-13% 감소하였으며 그 후의 감소율은 매우 적어 약 0.6%/일 였다. 조사후의 농도변화는 흡수선량, 보존온도 및 파장에 따라 상이하였기 때문에 조사후 경과시간 및 보존온도와 조사시의 온도에 관한 효과를 검토하였다. 이 선량계를 사용할때에는 농도 변화의 오차를 줄이기 위해서는 1일후에 농도를 측정하거나 혹은 10$0^{\circ}C$에서 1시간 열 처리가 필요하였다.

• 전기전자학회논문지
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• 제23권2호
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• pp.375-379
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• 2019

Zn와 Sn의 원자비가 2:1인 타겟을 고주파 스파터링하여 $ZnO-SnO_2(ZTO)$박막을 증착하고 열처리에 따른 구조적 특성변화를 조사하였다. 이 ZTO박막을 활성층으로 사용하여 투명박막트랜지스터(TTFT)를 제조하였다. 약 100 nm 두께의 $SiO_2$위에 100 nm의 $Si_3N_4$막을 기른 후 TTFT의 게이트 절연막으로 채택하였다. TTFT의 전달 특성을 통해 이동도, 문턱전압, 작동전류-차단전류 비($I_{on}/I_{off}$), 계면트랩밀도를 구하였다. 기판 가열 및 후속 열처리가 ZTO TTFT의 특성 변화에 미치는 영향을 분석하였다.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2002년도 추계종합학술대회
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• pp.784-787
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• 2002

Sol-gel 법으로 PLT(28) 박막을 제작하여, 박막의 구조적 및 전기적 특성을 조사하였다. XRD와 AFM 관찰결과, $650^{\circ}C$에서 annealing 된 박막은 완전한 perovskite 구조를 가지며 표면거칠기도 22$\AA$ 으로 양호한 값을 나타내었다. Pt/TiO$_{x}$SiO2/Si 기판위에 PLT(28) 박막을 증착시켜 planar 형태의 캐패시터를 제작하여 전기적 특성을 조사하였다. 그 결과, PLT(28) 박막은 상유전상을 가지며,10kHz에서 비유전률과 유전손실은 761 과 0.024 이었다. 또, 5V에서 전하축적 밀도와 누설전류밀도는 각각 134fC/$\mu$m2 과 1.01 $\mu$A/cm2 이었다. 이로부터, PLT(28) 박막이 차세대 DRAM 용 캐패시터 절연막으로 사용될 수 있는 유망한 재료라고 생각된다.다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1990년도 추계학술대회 논문집 학회본부
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• pp.85-87
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• 1990

Silicon nitride film was deposited on a silicon wafer using a laser CVD(LCVD) technique, which is based on direct photolysis of $SiH_4/NH_3$ gas mixture by ArF laser beam(${\lambda}=193\;nm$). The refractive index of deposited SiN film is 1.9 at the temperature of $300^{\circ}C$, pressure of 5 torr. The breakdown field strength of LCVD SiN film was 10MV/cm. In IR spectrum, the absorption peak of Si-H, N-H, and Si-N is detected and it is shown that hydrogen is included in SiN film. From analysis of absorption band. it is calculated that density of Si-H, N-H bond is higher than $5{\times}10^{22}cm^{-3}$. LCVD MIS capacitor and PECVD MIS capacitor have injection-type hysteresis but it is known that hysteresis loss of LCVD MIS capacitor is smaller than that of PECVD MIS capacitor. It means that Interface state density of LCVD capacitor is smaller than that of PECVD capacitor. In addition, the flatband voltage($V_{FB}$) of LCVD is smaller than that of PECVD capacitor. And it means that fixed charged density($Q_{FIX}$) of LCVD capacitor is smaller than that of PECVD MIS capacitor.