• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.41-44
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• 2001

In reverse engineering, the whole surfaces of the three-dimensional(3D) product are measured using 3D positional scanners. The raw triangle meshes constructed from a scanned point set are not well suited for direct use in the downstream activities. This is because the amount of triangle meshes may be very large(from millions to hundreds of millions) and usually distorted by scanning error. Furthermore, the triangle meshes may contain several holes that must be filled. Thus, several solutions have to be addressed and implemented before a complete CAD models can be acquired. This paper discusses on the algorithms of decimation, smoothing, and hole-filling that are crucial to refine the triangle meshes. Several examples are also given and discussed to validate the system.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.229-231
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• 2007

Recently, 3D-electronic packaging by TSV is in interest. TSV(Through Silicon Via) is a interconnection hole on Si-wafer filled with conducting metal such as Copper. In this research, chips with TSV are connected by electroplated Sn bump without PR. Then chips with TSV are put together and stacked by the methode of Reflow soldering. The stacking was successfully done and had no noticeable defects. By eliminating PR process, entire process can be reduced and makes it easier to apply on commercial production.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.2
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• pp.83-90
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• 2004

This paper describes investigations of the UHF(Ultra High Frequency) PD(Partial Discharge) measuring technology designed for monitoring of PD in high power apparatus. Based on the spiral antenna theory, the hole type sensor for GIS with metal flange spacer and injection type sensor for oil filled transformer are developed. The experimental results show measurement characteristics of the PD sensor for several artificial defects in gas-insulated system(GIS) and oil transformer. Moreover, we proposed the new $\phi$-f-q method for the purpose of condition assessment of high power apparatus.

• Steel and Composite Structures
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• v.16 no.2
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• pp.187-201
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• 2014

A new through-beam connection system for a concrete filled steel tube column to RC beam is proposed. In this connection, there are openings on the steel tube while the reinforced concrete beams are continuous in the joint zone. The moment and shear force at the beam ends can be transferred to column by continuous rebar and concrete. The weakening of the axial load and shear bearing capacity due to the opening of the steel tube can be compensated by strengthening steel tube at joint zone. Using this connection, construction of the joint can be made more convenient since welding and hole drilling in situ can be avoided. Axial compression and reversed cyclic loading tests on specimens were carried out to evaluate performance of the new beam-column connection. Load-deflection performance, typical failure modes, stress and strain distributions, and the energy dissipation capacity were obtained. The experimental results showed that the new connection have good bearing capacity, superior ductility and energy dissipation capacity by effectively strengthen the steel tube at joint zone. According to the test and analysis results, some suggestions were proposed to design method of this new connection.

• Proceedings of the Korean Geotechical Society Conference
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• 1999.03a
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• pp.185-192
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• 1999

It had found that, as a result of cross-hole tonic logging test, concrete was not filled partially within the bottom 2.0 m of the large diameter (Ø= 2,500mm) rock socketed pile, MP20-P11(socket diameter (Ø= 2,200mm), which was a pile among piles group supporting a pier of Kwangan Grand Bridge. The pile was repaired by the combined cement grout injected through the pipes for the cross-hole sonic logging test and the bore holes for core samples. A month after the cement grouting, repairing was checked by coring and cross-hole sonic logging then 3 times of grouting and 2 times of coring were, in turns, peformed, then repairing was completed successfully. The vertical compressive capacity of the repaired large diameter socketed pile was evaluated by several formulas and software ROCKET, and was more conservative than design load (1,882 ton) of MP20-P11. It is expected that, in the case of the battered socketed piles, it could be more reasonable to analyze the behaviors of a battered pile using 3-D model. A 3-D analysis will be peformed in the future study.

• Nuclear Engineering and Technology
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• v.48 no.3
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• pp.805-819
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• 2016

The numerical simulation methodologies to evaluate the structural behaviors of prestressed concrete containment vessels (PCCVs) have been substantially developed in recent decades. However, there remain several issues to be investigated more closely to narrow the gap between test results and numerical simulations. As one of those issues, the effects of no stiffness inside unbonded tendon ducts on the behavior of PCCVs are investigated in this study. Duct holes for prestressing cables' passing are provided inside the containment wall and dome in one to three directions for general PCCVs. The specific stress distribution along the periphery of the prestressing duct hole and the loss of stiffness inside the hole, especially in an unbonded tendon system, are usually neglected in the analysis of PCCVs with the assumption that the duct hole is filled with concrete. However, duct holes are not small enough to be neglected. In this study, the effects of no stiffness inside the unbonded tendon system on the behaviors of PCCVs are evaluated using both analytical and numerical approaches. From the results, the effects of no stiffness in unbonded tendons need to be considered in numerical simulations for PCCVs, especially under internal pressure loading.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.38C no.5
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• pp.409-419
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• 2013

Kinect released by Microsoft in November 2010 is a motion sensing camera in xbox360 and gives depth and color images. However, Kinect camera also generates holes and noise around object boundaries in the obtained images because it uses infrared pattern. Also, boundary flickering phenomenon occurs. Therefore, we propose a real-time virtual-view video synthesis algorithm which results in a high-quality virtual view by solving these problems. In the proposed algorithm, holes around the boundary are filled by using the joint bilateral filter. Color image is converted into intensity image and then flickering pixels are searched by analyzing the variation of intensity and depth images. Finally, boundary flickering phenomenon can be reduced by converting values of flickering pixels into the maximum pixel value of a previous depth image and virtual views are generated by applying 3D warping technique. Holes existing on regions that are not part of occlusion region are also filled with a center pixel value of the highest reliability block after the final block reliability is calculated by using a block based gradient searching algorithm with block reliability. The experimental results show that the proposed algorithm generated the virtual view image in real-time.

• Restorative Dentistry and Endodontics
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• v.21 no.2
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• pp.451-469
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• 1996

The purpose of this study was to investigate the effect of calcium hydroxide and glass ionomer cement fillings on the levels of $LTB_4$ and $LTC_4$ in experimentally inflamed rat dental pulp. The dental pulp in the mandibular incisor of wistar rat was irritated by cutting a 5mm deep hole in the dentin with a twist drill bur of 0.5mm diameter, without cooling. The cavities were filled with calcium hydroxide(light-cured) and glass ionomer cement(light cured). The untreated pulp served as control tissue specimen. After cavity preparations, the rat with or without various treatment were sacrificed in various time by decapitation. The dental pulp tissue were carefully removed and the concentrations of $LTB_4$ and $LTC_4$ were determined by radioimmunoassay. And pulps were examined histologically to observe inflammatory feature. The result were obtained as follows : 1. The inflammatory features of pulps were observed microscopically in all experimental groups. And degree of inflammation was decreased with time. 2. The concentrations of $LTB_4$ and $LTC_4$ for all experimental groups were significantly higher than those for control group 6 hours after cavity preparation(p<0.05). 3. The group filled with calcium hydroxide was the lowest, and the group filled with glass ionomer cement, the group of irritation in that order showed increased concentrations of $LTB_4$ and $LTC_4$ 6 hours after cavity preparation. In the concentrations of $LTB_4$, significant differences among 3 groups were noted(p<0.05). 4. The group filled with calcium hydroxide was the lowest, and the group filled with glass ionomer cement, the group of irritation in that order showed increased concentrations of $LTB_4$ and $LTC_4$ 24 hours after cavity preparation. And there were statistically significant difference in concentrations of $LTB_4$ between the group of irritation and the group filled with calcium hydroxide(p<0.05). 5. The group filled with calcium hydroxide was the lowest, and the group filled with glass ionomer cement, the group of irritation in that order showed increased concentrations of $LTB_4$ and $LTC_4$ 48 hours after cavity preparation. But no statistically difference was found (p>0.05). 6. The concentrations of $LTB_4$ and $LTC_4$ in all experimental groups were highest level at 6 hour after experiment and decreased as time progresses(correlation coefficient>0.8).

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.45-50
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• 2006

Copper via filling is the important factor in 3-D stacking interconnection of SiP (system in package). As the packaging density is getting higher, the size of via is getting smaller. When DC electroplating is applied, a defect-free hole cannot be obtained in a small size via hole. To prevent the defects in holes, pulse and pulse reverse current was applied in copper via filling. The holes, $20\and\;50{\mu}m$ in diameter and $100{\sim}190\;{\mu}m$ in height. The holes were prepared by DRIE method. Ta was sputtered for copper diffusion barrier followed by copper seed layer IMP sputtering. Via specimen were filled by DC, pulse and pulse-reverse current electroplating methods. The effects of additives and current types on copper deposits were investigated. Vertical and horizontal cross section of via were observed by SEM to find the defects in via. When pulse-reverse electroplating method was used, defect free via were successfully obtained.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.13-13
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• 2010

Switching an elementary excitation by injecting a single carrier would offer the exciting opportunity for the ultra-high data storage technologies. However, there has been no methodology available to investigate the interaction of low energy discrete carriers with nano-structures. In order to map out the spatial dependency of such single carrier level interactions, we developed a pulse-and-probe algorithm, combining with low temperature scanning tunneling microscopy. The new tool, which we call single carrier spectroscopy, allows us to track the interaction with the target macrostructure with tunneling carriers on a single carrier basis. Using this tool, we demonstrate that it is possible not only to locally write and erase individual bi-solitons, reliably and reversibly, but also to track of creation yields of single and multiple bi-solitons. Bi-solitons are pairs of solitons that are elementary out-of-phase excitations on anti-ferromagnetically ordered pseudo-spin system of Si dimers on Si(001)-c(42) surfaces. We found that at low energy tunneling the single bisoliton creation mechanism is not correlated with the number of carriers tunneling, but with the production of a potential hole under the tip. An electric field at the surface determines the density of the local charge density under the tip, and band-bending. However a rapid, dynamic change of a field produces a potential hole that can be filled by energetic carriers, and the amount of energy released during filling process is responsible for the creation of bi-solitons. Our model based on the field-induced local hole gives excellent explanation for bi-soliton yield behaviors. Scanning tunneling spectroscopy data supports the existence of such a potential hole. The mechanism also explains the site-dependency of bi-soliton yields, which is highest at the trough, not on the dimer rows. Our study demonstrates that we can manipulate not just single atoms and molecules, but also single pseudo-spin excitations as well.