• 한국재료학회지
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• 제13권5호
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• pp.333-337
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• 2003

We report a new fabrication process for carbon nanotube field emitters with high performance. The key of the fabrication process is trim-and-leveling the carbon nanotubes grown in trench structures by employing a planarization process, which leads to a uniform distance from the carbon nanotube tip to the electrode. In order to enable this processing, spin-on-glass liquid is applied over the CNTs grown in trench to have them stubborn adhesion among themselves as well as to the substrate. Thus fabricated emitters reveal an extremely stable emission and aging characteristics with a large current density of 40 ㎃/$\textrm{cm}^2$ at 4.5 V/$\mu\textrm{m}$. The field enhancement factor calculated from the F-N plot is $1.83${\times}$10^{5}$ $cm^{－1}$ , which is a very high value and indicates a superior quality of the emitter originating from the nature of open-tip and high stability of the carbon nanotubes obtained new process.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1450-1452
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• 1996

In order to optimize the characteristics of gate insulator for FED(field emission device), we investigated the effect of wet-etching process on the gate insulator for fabrication of FED. We used the general three types of etchants for fabrication of the metal tip FEA(field emitter array), they are MO and oxide etchants to form the gate hole, and Al etchant to remove the release layer. In the result of the breakdown field of the insulator by the measure of the current-voltage characteristics, the breakdown field of insulator for immersing in oxide etchant was rapidly lowering with increasing etching time, but that for immersing in Al etchant was slow lowering. Also, in comparing cleaning with non-cleaning samples, the breakdown field of the cleaning samples was higher than that of non-cleaning samples.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1995년도 하계학술대회 논문집 C
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• pp.1137-1139
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• 1995

$SiN_x$ films deposited on bare Si and wet-etched Si by RPCVD were fabricated to investigated the effect of wet-etched surface of Si on the characteristics of the interface between $SiN_x$ and Si. FT-IR spectra on each film showed similar characteristics. However, it was confirmed that the electric characteristics(I-V, C-V) of the interface between $SiN_x$ and Si have been degraded by the wet etching process of Si, which is applied for the formation of Si field emitter array. Therefore, we suggest that the stacked structure of insulating layer with good interface characteristics is desirable for FED application.

• 대한화학회지
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• 제48권4호
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• pp.371-378
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• 2004

기존의 $SrGa_2S_4:Eu^{2+}$ 녹색 발광 형광체는 주로 CRT (Cathode Ray Tube)용이나 FED (Field Emission Display), 그리고 EL (Electroluminescence)용 발광소자로 많이 연구되어졌다. 현재는 장파장 영역의 여기 특성을 이용한 LED (Light Emitting Diode)용 형광체로 주목 되어지고 있다. $SrGa_2S_4:Eu^{2+}$ 형광체의 일반적 합성 방법은 Flux를 이용하여 인체에 유해한 $H_2S$나 $CS_2$ 기체를 사용할 뿐만 아니라 높은 합성온도, 긴 반응시간 및 공정이 복잡한 단점을 지니고 있다. 따라서 본 실험은 황화물계 원료인 SrS, $Ga_2S_3$ 그리고 EuS를 출발 물질로 하여 $H_2S$ 기체를 사용하지 않고 혼합 기체$(5% H_2/95% N_2)$를 사용해 환원 분위기 하에서 $SrGa_2S_4:Eu^{2+}$을 합성하였다. 그리고 다양한 합성 조건과 LED용으로 사용되기 위해 수세처리와 Sieving 과정을 거친 형광체의 발광특성을 검토하였다.