• 터널과지하공간
• /
• 제7권1호
• /
• pp.31-38
• /
• 1997

Residual shear strength should be taken into consideration as well as peak one when analysing stability of slopes constituted by weathered rock or overconsolidated soils since such materials could be subjected to progressive failure mechanism. When landslide of a slope is related to progressive failure phenomenon, the failure might occur even though shear strength of the slope materials does not reach their residual shear strength over the whole slip surface. Therefore, stability of the slope concerned may be overstimated or underestimated when using only its peak or residual shear srength parameters. Mechanical description for progressive failure phenomenon is given by Bjerrum(1967). In parameters. Mechanical description for progressive failure phenomenon is given by Bjerrum(1967). In this study, his theory has been extended to estimate the distance of failed zone for a plane slope and the results calculated by this extended equatio has been compared with that obtained by numerical modelling using FLAC. In addition, stress state on the slip surface has been, in detail, analysed to understand failure mechanism when a limited progressive failure occurs. Effects of mechanical and hydraulic factors on progressive failure have also been analysed.

• Journal of Information Technology Applications and Management
• /
• 제13권2호
• /
• pp.17-28
• /
• 2006

The SRGM has been studied under the assumption that S/W reliability can grow as the fault causing failure is removed even during operational phase because the debugging is available. On the other hand, some papers insist on the uniform failure rate during operational phase because the debugging may not be available in case of universal software. The phenomenon, however, has been observed informally many times that the products S/W reliability grows as the time goes by even without any debugging in point of customer view. I propose the simple approaching method to model the S/W reliability phenomenon that the failure rate reduces as time goes on without modifying the existing reliability model in this paper.

• Journal of Mechanical Science and Technology
• /
• 제14권7호
• /
• pp.744-751
• /
• 2000

To achieve lower flying height for high areal recording density, the laser zone texturing of the disk needs to be designed to reduce glide height. One problem of the laser bump design is that the regular laser bump pattern often produces glide resonance phenomenon, which leads to failure of the glide height test. However, it was found in this study that glide resonance is an intrinsic problem of the glide head used and resonance phenomenon depends on the type of the head slider, that is, the natural frequency of the slider body. Therefore, higher glide height or glide failure caused by glide resonance does not lead to head/media interface problem in the real drive operating conditions in which the data head is used. Pseudo-random bump pattern greatly reduces the glide resonance. Smaller bump pitch will also help to reduce the glide resonance. However, as bump spacing becomes smaller, glide height will be increased due to increased air pressure developed around the bumps. Lowering bump height is the most effect way to reduce glide avalanche.

• Structural Engineering and Mechanics
• /
• 제32권6호
• /
• pp.771-786
• /
• 2009

In the past few decades, effects of natural hazards, such as earthquakes and wind, on existing structures have attracted the attention of researchers and designers. More recently, however, the phenomenon of progressive collapse is becoming more recognized in the field of structural engineering. In practice, the phenomenon can result from a number of abnormal loading events, such as bomb explosions, car bombs, accidental fires, accidental blast loadings, natural hazards, faulty design and construction practices, and premeditated terrorist acts. Progressive collapse can result not only in disproportionate structural failure, but also disproportionate loss of life and injuries. This paper provides an up-to-date comprehensive review of this phenomenon and its momentousness in structural engineering communities. The literature reveals that although the phenomenon of progressive collapse of buildings is receiving considerable attention in the professional engineering community, more research work is still needed in this field to develop a new methodology for efficient and inexpensive design to better protect buildings against progressive collapse.

• 한국가스학회지
• /
• 제16권3호
• /
• pp.48-53
• /
• 2012

이 논문의 목적은 LPG 자동차의 액상 분사시스템에 관련된 고장사례를 연구하는 것이다. LPi 분사시스템인 인젝터를 점검한 결과, 인젝터에 카본이 누적되어 운전 중에 간헐적으로 연료를 분사하는 인젝터의 미세한 홀을 막아 연비를 5% 정도 떨어뜨리는 것으로 확인되었다. 엔진의 공회전을 조절하는 시스템인 공회전 조절장치 부품과 엔진에 공기를 공급하는 시스템인 스로틀 보디에 카본이 퇴적되어 공기의 흐름을 간섭함으로써 연비가 7% 악화된 것을 확인되었다. 엔진의 흡기 매니폴드 개스킷의 일부가 찢어져, 실린더 헤드와 실린더 블록의 밀착성이 약화되어 흡기행정에서 외부의 공기가 이 틈새로 간헐적으로 유입되면서 증가된 공기량만큼 연료량의 증가를 가져와 엔진의 회전수가 증가하여 부조화 현상이 발생되어 정상적인 상태보다 연비가 3% 정도 악화된 것으로 확인되었다. 이러한 고장사례는 운전중에 엔진의 출력 성능을 떨어뜨리고, 자동차의 연비를 악화시키는 요인이 된다. 따라서 품질확보에 철저하게 대처하여 고장현상을 최소화 하여야 할 것으로 판단된다.

• Tribology and Lubricants
• /
• 제26권5호
• /
• pp.277-282
• /
• 2010

The purpose of this paper is to study and analysis the failure examples for parasitic current leakage produced in starting system on gasoline engine. It verified the discharge of battery by electric leakage because of internal wiring damage problem for CD auto changer installed in car. Also, it verified the no-stating phenomenon because of deposit forming by chemical reaction of battery fluid between battery post and cable fixing parts. It verified the damage for brush holder and commutator mixing by internal short phenomenon because of brush carbon a particle and engine oil that was flowed into internal of starting motor. It verified the working phenomenon of audio by a point of contact even if the driver turn to "LOCK" position the key.

• 한국추진공학회:학술대회논문집
• /
• 한국추진공학회 2017년도 제48회 춘계학술대회논문집
• /
• pp.47-53
• /
• 2017

우주 발사체의 발사 실패 원인 중 가장 대표적인 것이 연소불안정 현상이다. 연소불안정은 연소실 내부의 압력 섭동과 열방출 섭동의 상호작용으로 인하여 연소실 내부의 압력 섭동이 크게 증폭되는 현상을 말하며, 이러한 현상이 심해지게 되면, 엔진의 폭발 또는 비행체의 추락 등이 일어나게 된다. 이러한 연소불안정 현상을 예측하고 회피하기 위해서는 현상의 이해가 반드시 필요하며, 이를 위해 국내외적으로 연소불안정에 대해 수치적, 이론적, 실험적인 접근을 통한 연구가 많이 진행되고 있다.

• Tribology and Lubricants
• /
• 제27권5호
• /
• pp.269-274
• /
• 2011

The purpose of this paper is to study and analyze the improvement method for the failure examples including the vehicle brake system in actual field. It was verified that the indicator plate of pad wear scratched the brake disk because of wearing after displacement of non- identification parts pad. The caliper of other vehicle was installed with brake system verified the phenomenon produced groove in center point because of one side wear when the pad was not fully contacted with the rub disk by other action surface pressure and pad action condition. It verified that the crack phenomenon fatigue was produced by brake thermal deformation because of decreasing the thickness by grinding to modify the non-uniformed wear of brake disk. It verified that the friction sound was produced by the friction phenomenon because of non-uniformed contact of lining and an alien substance with inner of the drum and lining braking by crack phenomenon with brake drum surface.

• Geomechanics and Engineering
• /
• 제24권2호
• /
• pp.179-191
• /
• 2021

In this study, the strength and failure mechanism of red sandstones with combined defects were investigated by uniaxial compression tests on red sandstones with different crack angles using two-dimensional particle flow code numerical software, and their mechanical parameters and failure process were studied and analyzed. The results showed that the mechanical characteristics such as peak strength, peak strain, and elastic modulus of the samples with prefabricated combined defects were significantly inferior than those of the intact samples. With increasing crack angle from 15° to 60°, the weakening area of cracks increased, elastic modulus, peak strength, and peak strain gradually reduced, the total number of cracks increased, and more strain energy was released. In addition, the samples underwent initial brittle failure to plastic failure stage, and the failure form was more significant, leading to peeling phenomenon. However, with increasing crack angle from 75° to 90°, the crack-hole combination shared the stress concentration at the tip of the crack-crack combination, resulted in a gradual increase in elastic modulus, peak strain and peak strength, but a decrease in the number of total cracks, the release of strain energy reduced, the plastic failure state weakened, and the spalling phenomenon slowed down. On this basis, the samples with 30° and 45° crack-crack combination were selected for further experimental investigation. Through comparative analysis between the experimental and simulation results, the failure strength and final failure mode with cracks propagation of samples were found to be relatively similar.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제54권3호
• /
• pp.109-113
• /
• 2005

It has been reported that the failure phenomenon and variation of electrical characteristic due to the effect of electrostatic discharge(ESD) in silicon devices. But we had fess reports about the phenomenon due to the ESD in the compound semiconductors. So there are a lot of difficulty to the phenomenon analysis and to select the protection method of main circuits or the devices. It has not been reported that the relation between the ESD stress and GaN devices, which is remarkable to apply the operation in high temperature and high voltage due to the superior material characteristic. We studied that the characteristic variation of the AlGaN/GaN HEMT current, the leakage current, the transconductance(gm) and the failure phenomenon of device due to the ESD stress. We have applied the ESD stress by transmission line pulse(TLP) method, which is widely used in ESD stress experiments, and observed the variation of the electrical characteristic before and after applying the ESD stress. The on-current trended to increase after applying the ESD stress. The leakage current and transconductance were changed slightly. The failure point of device was mainly located in middle and edge sides of the gate, was considered the increase of temperature due to a leakage current. The GaN devices have poor thermal characteristic due to usage of the sapphire substrate, so it have been shown to easily fail at low voltage compared to the conventional GaAs devices.