• Title/Summary/Keyword: failure pattern

검색결과 815건 처리시간 0.025초

BAYESIAN APPROACH TO MEAN TIME BETWEEN FAILURE USING THE MODULATED POWER LAW PROCESS

  • Na, Myung-Hwa;Kim, Moon-Ju;Ma, Lin
    • Journal of the Korean Society for Industrial and Applied Mathematics
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    • 제10권2호
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    • pp.41-47
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    • 2006
  • The Renewal process and the Non-homogeneous Poisson process (NHPP) process are probably the most popular models for describing the failure pattern of repairable systems. But both these models are based on too restrictive assumptions on the effect of the repair action. For these reasons, several authors have recently proposed point process models which incorporate both renewal type behavior and time trend. One of these models is the Modulated Power Law Process (MPLP). The Modulated Power Law Process is a suitable model for describing the failure pattern of repairable systems when both renewal-type behavior and time trend are present. In this paper we propose Bayes estimation of the next failure time after the system has experienced some failures, that is, Mean Time Between Failure for the MPLP model. Numerical examples illustrate the estimation procedure.

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Physical and Particle Flow Modeling of Shear Behavior of Non-Persistent Joints

  • Ghazvinian, A.;Sarfarazi, V.;Nejati, H.;Hadei, M.R.
    • 한국암반공학회:학술대회논문집
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    • 한국암반공학회 2011년도 추계 총회 및 창립 30주년 기념 심포지엄
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    • pp.3-21
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    • 2011
  • Laboratory experiments and numerical simulations using Particle Flow Code (PFC2D) were performed to study the effects of joint separation and joint overlapping on the full failure behavior of rock bridges under direct shear loading. Through numerical direct shear tests, the failure process is visually observed and the failure patterns are achieved with reasonable conformity with the experimental results. The simulation results clearly showed that cracks developed during the test were predominantly tension cracks. It was deduced that the failure pattern was mostly influenced by both of the joint separation and joint overlapping while the shear strength is closely related to the failure pattern and its failure mechanism. The studies revealed that shear strength of rock bridges are increased with increasing in the joint separation. Also, it was observed that for a fixed cross sectional area of rock bridges, shear strength of overlapped joints are less than the shear strength of non-overlapped joints.

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음향방출법을 이용한 탄소섬유/에폭시 복합재의 핀 체결부 파괴거동 (Failure Behavior of Pin-jointed Carbon/Epoxy Composites using Acoustic Emission)

  • 김찬규;황영은;윤성호
    • 한국추진공학회:학술대회논문집
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    • 한국추진공학회 2011년도 제37회 추계학술대회논문집
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    • pp.520-522
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    • 2011
  • 본 연구에서는 핀 로딩시험을 통해 탄소섬유/에폭시 복합재의 핀 체결부에 대한 베어링 강도와 파손 거동을 조사하였다. 이때 복합재는 필라멘트 와인딩 공법을 적용하여 제작하였으며 적층패턴은 두 가지 패턴을 고려하였다. 연구결과에 따르면 패턴 1은 net-tension 모드 파손이, 패턴 2는 bearing 모드 파손이 나타났으며 패턴 2의 음향방출 에너지는 패턴 1의 경우에 비해 높게 나타났다. 이로 미루어 보면 패턴 2가 패턴 1에 비해 구조적으로 안전함을 알 수 있었다.

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PCB의 금속 이온 마이그레이션 현상에 관한 연구 (A Study on the Metallic ion Migration Phenomena of PCB)

  • 홍원식;강보철;송병석;김광배
    • 한국재료학회지
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    • 제15권1호
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    • pp.54-60
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    • 2005
  • Recently a lots of problems have observed in high densified and high integrated electronic components. One of them is ion migration phenomena, which induce the electrical short of electrical circuit. ion migration phenomena has been observed in the field of exposing the specific environment and using for a long tin e. This study was evaluated the generation time of ion migration and was investigated properly test method through water drop test and high temperature high humidity test. Also we observed direct causes and confirmed generation mechanism of dendritic growth as we reproduced the ion migration phenomena. We utilized PCB(printed circuit board) having a comb pattern as follows 0.5, 1.0, 2.0 mm pattern distance. Cu, SnPb and Au were electroplated on the comb pattern. 6.5 V and 15 V were applied in the comb pattern and then we measured the electrical short time causing by ion migration. In these results, we examined a difference of ion migration time depending on pattern materials, applied voltage and pattern spacing of PCB conductor.

실시간 고장 예방을 위한 이벤트 기반 결함원인분석 시스템 (An Event-Driven Failure Analysis System for Real-Time Prognosis)

  • 이양지;김덕영;황민순;정영수
    • 한국CDE학회논문집
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    • 제18권4호
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    • pp.250-257
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    • 2013
  • This paper introduces a failure analysis procedure that underpins real-time fault prognosis. In the previous study, we developed a systematic eventization procedure which makes it possible to reduce the original data size into a manageable one in the form of event logs and eventually to extract failure patterns efficiently from the reduced data. Failure patterns are then extracted in the form of event sequences by sequence-mining algorithms, (e.g. FP-Tree algorithm). Extracted patterns are stored in a failure pattern library, and eventually, we use the stored failure pattern information to predict potential failures. The two practical case studies (marine diesel engine and SIRIUS-II car engine) provide empirical support for the performance of the proposed failure analysis procedure. This procedure can be easily extended for wide application fields of failure analysis such as vehicle and machine diagnostics. Furthermore, it can be applied to human health monitoring & prognosis, so that human body signals could be efficiently analyzed.

An Evolution of Software Reliability in a Large Scale Switching System: using the software

  • Lee, Jae-Ki;Nam, Sang-Sik;Kim, Chang-Bong
    • 한국통신학회논문지
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    • 제29권4A호
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    • pp.399-414
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    • 2004
  • In this paper, an evolution of software reliability engineering in a large-scale software project is summarized. The considered software consists of many components, called functional blocks in software of switching system. These functional blocks are served as the unit of coding and test, and the software is continuously updated by adding new functional blocks. We are mainly concerned with the analysis of the effects of these software components in software reliability and reliability evolution. We analyze the static characteristics of the software related to software reliability using collected failure data during system test. We also discussed a pattern which represents a local and global growth of the software reliability as version evolves. To find the pattern of system software, we apply the S-shaped model to a collection of failure data sets of each evolutionary version and the Goel-Okumoto(G-O) model to a grouped overall failure data set. We expect this pattern analysis will be helpful to plan and manage necessary human/resources fur a new similar software project which is developed under the same developing circumstances by estimating the total software failures with respect to its size and time.

Head Reinforcement 인발강도를 위한 파괴 메캐니즘 (Failure Mechanism for Pull-Out Capacity of Headed Reinforcement)

  • 홍성걸;최동욱;권순영
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2002년도 봄 학술발표회 논문집
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    • pp.233-238
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    • 2002
  • This study presents failure mechanisms for the pull-out strength of headed reinforcement for upper bound solution based on the limit theorem. The failure mechanisms to be presented follow the failure surface pattern of punching shear failure found in the joints of slab with a column. Several failure surfaces of the mechanisms have different characteristics for dissipation works and these mechanisms are able to interpret the role of bar details surrounding headed reinforcement.

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ISB 판넬의 굽힘강성 및 파손특성에 관한 연구 (Investigation into Characteristics of Bending Stiffness and Failure for ISB Panel)

  • 안동규;이상훈;김민수;한길영;정창균;양동열
    • 한국정밀공학회지
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    • 제22권9호
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    • pp.162-172
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    • 2005
  • The objective of this research works is to investigate into characteristics of bending stiffness and failure for the ISB ultra-lightweight panel with internally structured material. The expanded metal with a crimped pyramid shape and woven metal are employed as an internally structured material. Through three-points bending test, the force-displacement curve and failure shape are obtained to examine the deformation pattern, characteristic data, such as maximum load, displacement at maximum load, etc, and failure pattern of the ISB panel. In addition, the influence of design parameters fur ISB panel on the specific stiffness, the specific stiffness per unit width, failure mode and failure map has been found. Finally, it has been shown that ISB containing expand metal with the crimped pyramidal shape is prefer to that containing woven metal from the view point of optimal design for ISB panel.

Effect of brittleness on the micromechanical damage and failure pattern of rock specimens

  • Imani, Mehrdad;Nejati, Hamid Reza;Goshtasbi, Kamran;Nazerigivi, Amin
    • Smart Structures and Systems
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    • 제29권4호
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    • pp.535-547
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    • 2022
  • Failure patterns of rock specimens represent valuable information about the mechanical properties and crack evolution mechanism of rock. Several kinds of research have been conducted regarding the failure mechanism of brittle material, however; the influence of brittleness on the failure mechanism of rock specimens has not been precisely considered. In the present study, experimental and numerical examinations have been made to evaluate the physical and mechanical phenomena associated with rock failure mechanisms through the uniaxial compression test. In the experimental part, Unconfined Compressive Strength (UCS) tests equipped with Acoustic Emission (AE) have been conducted on rock samples with three different brittleness. Then, the numerical models have been calibrated based on experimental test results for further investigation and comparing the micro-cracking process in experimental and numerical models. It can be perceived that the failure mode of specimens with high brittleness is tensile axial splitting, based on the experimental evidence of rock specimens with different brittleness. Also, the crack growth mechanism of the rock specimens with various brittleness using discrete element modeling in the numerical part suggested that the specimens with more brittleness contain more tensile fracture during the loading sequences.

공정인자들이 나노임프린트 리소그래피 공정에 미치는 영향에 대한 분자동역학 연구 (Molecular Dynamics Study on the Effect of Process Parameters on Nanoimprint Lithography Process)

  • 강지훈;김광섭;김경웅
    • Tribology and Lubricants
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    • 제22권5호
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    • pp.243-251
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    • 2006
  • Molecular dynamics simulations of nanoimprint lithography NIL) are performed in order to investigate effects of process parameters, such as stamp shape, imprinting temperature and adhesive energy, on nanoimprint lithography process and pattern transfer. The simulation model consists of an amorphous $SiO_{2}$ stamp with line pattern, an amorphous poly-(methylmethacrylate) (PMMA) film and an Si substrate under periodic boundary condition in horizontal direction to represent a real NIL process imprinting long line patterns. The pattern transfer behavior and its related phenomena are investigated by analyzing polymer deformation characteristics, stress distribution and imprinting force. In addition, their dependency on the process parameters are also discussed by varying stamp pattern shapes, adhesive energy between stamp and polymer film, and imprinting temperature. Simulation results indicate that triangular pattern has advantages of low imprinting force, small elastic recovery after separation, and low pattern failure. Adhesive energy between surface is found to be critical to successful pattern transfer without pattern failure. Finally, high imprinting temperature above glass transition temperature reduces the imprinting force.