• Title/Summary/Keyword: fabricating temperature

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The Effect of Substrate Temperature on the Electrical, Electronic, Optical Properties and the Local Structure of Transparent Nickel Oxide Thin Films

  • Lee, Kangil;Kim, Beomsik;Kim, Juhwan;Park, Soojeong;Lee, Sunyoung;Denny, Yus Rama;Kang, Hee Jae;Yang, Dong-Seok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.397-397
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    • 2013
  • The electrical, electronic, optical properties and the local structure of Nickel Oxide (NiO) thin film have been investigated by X-ray photoelectron spectroscopy (XPS), Reflection Electron Energy Loss Spectroscopy (REELS), UV-spectrometer,Hall Effect measurement and X-ray absorption spectroscopy (XAS). The XPS results show that the Ni 2p spectra for all films consist of $Ni2p_{3/2}$ at around 854.5 eV which indicate the presence of Ni-O bond from NiO phase and for the annealed film at temperature above $200^{\circ}C$ shows the coexist Ni oxide and Ni metal phase. The REELS spectra showed that the band gaps of the NiO thin films were abruptly decreased with increasing temperature. The values of the band gaps are consistent with the optical band gaps estimated by UV-Spectrometer. The optical transmittance spectra shows that the transparency of NiO thin films in the visible light region was deteriorated with higher temperature due to existence of $Ni^0$. Hall Effect measurement suggest that the NiO thin films prepared at relatively low temperatures (RT and $100^{\circ}C$) are suitable for fabricating p-type semiconductor which showed that the best properties was achieved at $100^{\circ}C$, such as a low resistivity of $7.49{\Omega}.cm$. It can be concluded that the annealing process plays a crucial role in converting from p type to n type semiconductor which leads to reducing electrical resistivity of NiO thin films. Furthermore, the extended X-ray absorption fine structure (EXAFS) spectrum at the Ni K-edge was used to address the local structure of NiO thin films. It was found that the thermal treatments increase the order in the vicinity of Ni atom and lead the NiO thin films to bunsenite crystal structure. Moreover, EXAFS spectra show in increasing of coordination number for the first Ni-O shell and the bond distance of Ni-O with the increase of substrate temperature.

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An Investigation on the Nonlinear Shear Behavior of FRP Composites Considering Temperature Variation and Fabricating Parameters (FRP 복합재료의 온도변화 및 제작인자별 비선형 전단거동 조사)

  • Jung, Woo-Young;Hwang, Jin-Seop
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.33 no.3
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    • pp.833-841
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    • 2013
  • In the case of composite material, a variety of characteristics were expressed depending on the materials that were composed of. In this study, the materials showing non-linear shear behavior were investigated among FRP composite. Each specimen was designed and analyzed according to ASTM D4255 method: regulations on the 2-rail. The dependent variables included in this experiment were a variety of fiber, fiber volume ratio, fiber array direction, temperature, material homogeneity. For determination of characteristics based on the fiber array, fiber array direction of 0, 30, 45, and 60 degrees were selected for test specimen. Temperature of 25, 40, 60, and $80^{\circ}C$ were considered for investigation of FRP materials'shear behavior based on the external temperature. Nonlinear shear behavior was observed throughout the FRP composite material in this study. Also, using vinyl ester resins, high fiber volume ratio, and fiber array direction of 45 degree appeared to show the most prominent nonlinear shear behavior. As for the findings related to the temperature change, non-linear behavior was decreased as the external temperature increased. For factory manufactured product, non-linear behavior was relatively at parity in comparison to the behavior found in the hand lay-up FRP composite specimen.

Effect of Fabricating Temperature on the Mechanical Properties of Spread Carbon Fiber Fabric Composites (스프레드 탄소섬유 직물 복합재료의 성형온도에 따른 기계적 특성에 관한 연구)

  • Eun, Jong Hyun;Gwak, Jae Won;Kim, Ki Jung;Kim, Min Seong;Sung, Sun Min;Choi, Bo Kyoung;Kim, Dong Hyun;Lee, Joon Seok
    • Composites Research
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    • v.33 no.3
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    • pp.161-168
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    • 2020
  • In this paper, we have studied the mechanical properties of thermoplastic carbon fiber fabric composites with spread technology and compression molding temperature were investigated. Carbon fiber reinforcement composites were fabricated using commercial carbon fiber fabrics and spread carbon fiber fabrics. Mechanical properties of the commercial carbon fiber composites (CCFC) and spread carbon fiber composites (SCFC) according to compression molding temperatures were investigated. Thermal properties of the polypropylene film were examined by rheometer, differential scanning calorimetry, thermal gravimetric analysis. Tensile, flexural and Inter-laminar shear test. Commercial carbon fiber reinforcement composites and spread carbon fiber composites were fabricated at 200~240℃ above the melting temperature of the polypropylene film. Impregnation properties according to compression molding temperature of the polypropylene film were investigated by scanning electron microscopy. As a result, as the compression molding temperature was increased, the viscosity of the polypropylene film was decreased. The mechanical properties of the compression molding temperature of 230℃ spread carbon fiber composite was superior.

The Effects of a Thermal Annealing Process in IGZO Thin Film Transistors

  • Kim, Hyeong-Jun;Park, Hyung-Youl;Park, Jin-Hong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.289.2-289.2
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    • 2016
  • In-Ga-Zn-O(IGZO) receive great attention as a channel material for thin film transistors(TFTs) as next-generation display panel backplanes due to its superior electrical and physical properties such as a high mobility, low off-current, high sub-threshold slope, flexibility, and optical transparency. For the purpose of fabricating high performance IGZO TFTs, a thermal recovery process above a temperature of $300^{\circ}C$ is required for recovery or rearrangement of the ionic bonding structure. However diffused metal atoms from source/drain(S/D) electrodes increase the channel conductivity through the oxidation of diffused atoms and reduction of $In_2O_3$ during the thermal recovery process. Threshold voltage ($V_{TH}$) shift, one of the electrical instability, restricts actual applications of IGZO TFTs. Therefore, additional investigation of the electrical stability of IGZO TFTs is required. In this paper, we demonstrate the effect of Ti diffusion and modulation of interface traps by carrying out an annealing process on IGZO. In order to investigate the effect of diffused Ti atoms from the S/D electrode, we use secondary ion mass spectroscopy (SIMS), X-ray photoelectron spectroscopy, HSC chemistry simulation, and electrical measurements. By thermal annealing process, we demonstrate VTH shift as a function of the channel length and the gate stress. Furthermore, we enhance the electrical stability of the IGZO TFTs through a second thermal annealing process performed at temperature $50^{\circ}C$ lower than the first annealing step to diffuse Ti atoms in the lateral direction with minimal effects on the channel conductivity.

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Thermal Investigation of Joule-Heating-Induced Crystallization of Amorphous Silicon Thin Film (비정질 실리콘의 결정화를 위한 줄 가열 유도 결정화 공정에 대한 열적 연구)

  • Kim, Dong-Hyun;Park, Seung-Ho;Hong, Won-Eui;Ro, Jae-Sang
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.35 no.3
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    • pp.221-228
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    • 2011
  • The large-area crystallization of amorphous silicon thin films on glass backplanes is one of the key technologies in the manufacture of flat-panel displays. Joule-heating induced crystallization (JIC) is a recently introduced crystallization technology. It is considered a highly promising technique for fabricating OLEDs, because the film of amorphous silicon on glass can be crystallized in tens of microseconds, minimizing thermal and structural damage to the glass. In this study, we theoretically and experimentally investigated the temperature variation during the phase transformation. The critical temperatures for crystallization were determined for both solid-solid and solid-liquidsolid transitions, by carrying out in-situ temperature measurements and numerical analysis of the JIC.

Formation of Ohmic Contacts on acceptor ion implanted 4H-SiC (이온 이온주입한 p-type 4H-SiC에의 오믹 접촉 형성)

  • Bahng, W.;Song, G.H.;Kim, H.W.;Seo, K.S.;Kim, S.C.;Kim, N.K.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.07a
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    • pp.290-293
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    • 2003
  • Ohmic contact characteristics of Al ion implanted n-type SiC wafer were investigated. Al ions implanted with high dose to obtain the final concentration of $5{\times}10^{19}/cm^3$, then annealed at high temperature. Firstly, B ion ion implanted p-well region were formed which is needed for fabrication of SiC devices such as DIMOSFET and un diode. Secondly, Al implanted high dose region for ohmic contact were formed. After ion implantation, the samples were annealed at high temperature up to $1600^{\circ}C\;and\;1700^{\circ}C$ for 30 min in order to activate the implanted ions electrically. Both the inear TLM and circular TLM method were used for characterization. Ni/Ti metal layer was used for contact metal which is widely used in fabrication of ohmic contacts for n-type SiC. The metal layer was deposited by using RF sputtering and rapid thermal annealed at $950^{\circ}C$ for 90sec. Good ohmic contact characteristics could be obtained regardless of measuring methods. The measured specific contact resistivity for the samples annealed at $1600^{\circ}C\;and\;1700^{\circ}C$ were $1.8{\times}10^{-3}{\Omega}cm^2$, $5.6{\times}10^{-5}{\Omega}cm^2$, respectively. Using the same metal and same process of the ohmic contacts in n-type SiC, it is found possible to make a good ohmic contacts to p-type SiC. It is very helpful for fabricating a integrated SiC devices. In addition, we obtained that the ratio of the electrically activated ions to the implanted Al ions were 10% and 60% for the samples annealed at $1600^{\circ}C\;and\;1700^{\circ}C$, respectively.

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Interfacial Layer Control in DSSC

  • Lee, Wan-In
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.75-75
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    • 2011
  • Recently, dye-sensitized solar cell (DSSC) attracts great attention as a promising alternative to conventional silicon solar cells. One of the key components for the DSSC would be the nanocrystalline TiO2 electrode, and the control of interface between TiO2 and TCO is a highly important issue in improving the photovoltaic conversion efficiency. In this work, we applied various interfacial layers, and analyzed their effect in enhancing photovoltaic properties. In overall, introduction of interfacial layers increased both the Voc and Jsc, since the back-reaction of electrons from TCO to electrolyte could be blocked. First, several metal oxides with different band gaps and positions were employed as interfacial layer. SnO2, TiO2, and ZrO2 nanoparticles in the size of 3-5 nm have been synthesized. Among them, the interfacial layer of SnO2, which has lower flat-band potential than that of TiO2, exhibited the best performance in increasing the photovoltaic efficiency of DSSC. Second, long-range ordered cubic mesoporous TiO2 films, prepared by using triblock copolymer-templated sol-gel method via evaporation-induced self-assembly (EISA) process, were utilized as an interfacial layer. Mesoporous TiO2 films seem to be one of the best interfacial layers, due to their additional effect, improving the adhesion to TCO and showing an anti-reflective effect. Third, we handled the issues related to the optimum thickness of interfacial layers. It was also found that in fabricating DSSC at low temperature, the role of interfacial layer turned out to be a lot more important. The self-assembled interfacial layer fabricated at room temperature leads to the efficient transport of photo-injected electrons from TiO2 to TCO, as well as blocking the back-reaction from TCO to I3-. As a result, fill factor (FF) was remarkably increased, as well as increase in Voc and Jsc.

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Characteristic Evaluation of the Fe-Al Alloy Preform Fabrication by Reactive Sintering Process for the Al Matrix Composites. (반응소결법으로 제조한 Al기 복합재용 Fe-Al합금 예비성형체의 특성평가)

  • Choi, Dap-Chon;Park, Sung-Hyuk;Joo, Hyung-Gon
    • Journal of Korea Foundry Society
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    • v.19 no.6
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    • pp.493-500
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    • 1999
  • Squeeze casting was used for fabricating a light metal base composite having high strength and wearresistance. Reactive sintering was used to prepare the preform of Squeeze casting. To utilize Fe-Al intermetallic compounds and SiC particle as a reinforcement, there needs to prepare Fe-Al mixed powder at 50, 60, 70at.%Al, and add SiC powder to the above mixture at 4, 7, 16, 24wt.%. The prepared mixture with SiC was reactive sintered in a tube furnace at $660^{\circ}C$ to get a porous hybrid preform of intermetallic compound and SiC. The preform prepared above was placed in a metal mold, preheated at $660^{\circ}C$ AC4C matrix was injected into the mold with the temperature of the melt at $610^{\circ}C$ After these processes, 66MPa was applied to the mold for 5 minute to finish the whole procedure. The maximum reaction temperature was increased with the increased Al amount, but decreased with the increased SiC amount. The density of the preform was decreased with SiC amount increase in the compacts due to swelling of the preform. An optical microscope was applied to observe the micro structure and the dispersion of the reinforcements. To analyze phases, We utilized XRD, EDS. Hardness test were chosen to get the information of mechanical properties. There were no significant changes in micro structure between the composite and preform. However, it was shown that uniform dispersion of the reinforcers and complete infiltration of the melt into the preform were achieved through the procedure of the squeeze casting. It was observed that the hardness of the composite is decreased with increased SiC amount, resulting from the volumetric expansion of the preform.

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A Study on the Permeance Through Polymer Membranes and Selectivity of $CH_4/N_2$ (폴리이미드와 폴리이써설폰 분리막을 이용한 $CH_4/N_2$의 투과선택도 특성)

  • Park, Bo-Ryoung;Kim, Dae-Hoon;Lee, Gang-Woo;Hwang, Taek-Sung;Lee, Hyung-Keun
    • Korean Chemical Engineering Research
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    • v.49 no.4
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    • pp.498-504
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    • 2011
  • In this research, hollow fiber membranes were used in order to investigate to permeation and selectivity of the $CH_4$ and $N_2$. Polyimide and polyethersulfone hollow fiber membrane were prepared by the dry-wet phase inversion method and the module was manufactured by fabricating fibers after surface coating with silicone elastomer. The scanning electron microscopy (SEM) studies showed that the produced fibers typically had an asymmetric structure. The permeance of $CH_4$ and $N_2$ were increased with pressure and temperature. However, the selectivity was decreased with increasing temperature. The permeances of $CH_4$ and $N_2$ were decreased with increasing the air gap and the effect of post-treatment on membrane showed the increase in permeance up to 3.2~7.0 times.

Valuation properties of $SiO_2-B_2O_3$-R(R=CaO, BaO, ZnO, $Bi_2O_3$) borosilicate glass system for fabricating low temperature ceramics (저온 소결 세라믹스 제조를 위한 $SiO_2-B_2O_3$-R(CaO, BaO, ZnO, $Bi_2O_3$)계 붕규산염 유리 특성 평가)

  • Yoon, Sang-Ok;Lee, Hyun-Sik;Kim, Kwan-Soo;Heo, Wuk;Shim, Sang-Heung;Park, Jong-Guk
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.272-273
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    • 2006
  • LTCC(low temperature co-fired ceramics)용 glass/ceramic 복합체를 제조하기 위해 4 종류의 borosilicate계 glass를 선정하고 filler로 $Al_2O_3$ ceramics를 filler 사용하여 30~50 vol% glass frit에 따른 소결 및 유전 특성에 대하여 조사하였다. Glass frit은 $SiO_2$$B_2O_3$ 함량비를 고정한 후 R(CaO, BaO, ZnO, $Bi_2O_3$)에 따라 유리 연화온도(Ts)와 함량이 소결에 미치는 영향 및 유전 특성 변화를 고찰한 결과, CaO-$B_2O_3-SiO_2$ glass의 경우 다량의 2 차상이 형성되었고, 이에 $900^{\circ}C$ 이하에서 완전 소결이 이루어지지 않았으며, BaO-$B_2O_3-SiO_2$ glass는 celsian($BaAl_2Si_2O_8$) 결정이 형성되면서 소결성의 저하를 갖고 왔으며, ZnO-$B_2O_3-SiO_2$ glass는 소결이 진행됨에 따라 주상이 $Al_2O_3$에서 gahnite($ZnAl_2O_4$) 결정이 형성되면서 품질계수가 크게 증가하였으며, $Bi_2O_3-B_2O_3-SiO_2$ glass는 45 vol%일 때 $900^{\circ}C$에서부터 일정한 선수축율 특성을 나타내었지만, 다량의 액상으로 인하여 유전 특성의 저하를 나타내었다.

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