• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.533-535
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• 2002

Electrode formation methods such as a metal-taping, a electrolytic plating, and a metal-paste melt-bonding, are introduced for an external electrode fluorescent lamp. The characteristics of luminance and efficiency for various external electrode types have been investigated.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.1 s.94
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• pp.227-237
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• 1999

As the interface bonding phenomenon between the matrix and the reinforcements has a large effect on the mechanical properties of MMCs, a sugestion of the strength analysis technique considering the residual stress and the interface bonding phenomenon is very important for the design of pans and the estimation of fatigue behavior. In this paper the three dimensional finite element anaysis is performed during the elasto-plastic deformation of the particulate reinforced metal matrix composites. It was analyzed with the volume fractions in view of microscale. Bonding strength. interface separation and matrix void growth between the matrix and the reinforcements will be predicted on deformation under tensile loading. An interface seperation is estimated by the fracture criterion which is a critical value of generalized plastic work per unit volume. The shape of the reinforcement is assumed to be a perfect sphere. And the type of the reinforcement distribution is assumed as FCC array. The thermal residual stress in MMCs is induced by the heat treatment. It is included at the simulation as an initial residual stress. The element birth and death method of the ANSYS program is used for the estimation of the interface bonding strength, void generation and propagation. It is assumed that the fracture in the matrix region begin to occur under the external loading when the plastic work per unit volume is equal to the critical value. The fracture strain will be defined. The experimental data of the extruded $SiC_p$>/606l Al composites are compared with the theoretical results.

• Journal of Sensor Science and Technology
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• v.15 no.1
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• pp.58-64
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• 2006

In this study, we describe a low-temperature wafer-level thermocompression bonding using electroplated gold seal line and bonding pads by electroplating method for RF-MEMS devices. Silicon wafers, electroplated with gold (Au), were completely bonded at $320^{\circ}C$ for 30 min at a pressure of 2.5 MPa. The through-hole interconnection between the packaged devices and external terminal did not need metal filling process and was made by gold films deposited on the sidewall of the throughhole. This process was low-cost and short in duration. Helium leak rate, which is measured to evaluate the reliability of bonded wafers, was $2.7{\pm}0.614{\times}10^{-10}Pam^{3}/s$. The insertion loss of the CPW packaged was $-0.069{\sim}-0.085\;dB$. The difference of the insertion loss between the unpackaged and packaged CPW was less than -0.03. These values show very good RF characteristics of the packaging. Therefore, gold thermocompression bonding can be applied to high quality hermetic wafer level packaging of RF-MEMS devices.

• Computers and Concrete
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• v.4 no.2
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• pp.119-134
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• 2007

External bonding of steel or FRP plates to reinforced concrete (RC) structures has been a popular method for strengthening RC structures; however, unexpected premature failure often occurs due to debonding between the concrete and the epoxy. We proposed a Coulomb criterion with a constant failure surface as the debonding failure criterion for the concrete-epoxy interface. Diagonal shear bonding tests were conducted to determine the debonding properties that were related to the failure criterion, such as the angle of internal friction and the coefficient of cohesion. In addition, an interface element that utilized the Coulomb criterion was implemented in a nonlinear finite element analysis program to simulate debonding failure behavior. Experimental studies and numerical analysies on RC beams strengthened by an externally bonded steel or FRP plate were used to determine the range of the coefficient of cohesion. The results that were presented prove that premature failure loads of strengthened RC beams can be predicted with using the bonding properties and the finite element program with including the proposed Coulomb criterion.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.34 no.5
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• pp.56-62
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• 2002

Alternative way of shaping fibers suitable for papermaking was introduced. Impact refining, which was done simply by hitting wet fibers with a metal weight vertically, was intended to keep the fibers from shortening and to cause mostly internal fibrillation. Virgin chemical pulp, its recycled one and OCC were used in the experiment. It was noticed from the experiment that impact refining on virgin chemical pulp kept the fiber length and increased bonding properties greatly. However, in the recycled fibers from the chemical pulp, fiber length and bonding properties were decreased. In OCC, which seems to contain fractions of semi-chemical pulp and mechanical pulp (GP), and which is recycled pulp from corrugated boxes, fiber length and bonding properties were decreased disastrously. We believe recycled cellulosic fibers (recycled chemical pulp and OCC in this case), which went through hornification, were less resistant to the mechanical impact than virgin chemical pulp. For virgin chemical pulp, impact refining allowed no significant fiber length shortening, high WRV, and high mechanical strength.

• Bulletin of the Korean Chemical Society
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• v.29 no.2
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• pp.393-397
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• 2008

Inductively coupled plasma atomic emission spectrometry (ICP-AES) was used to determine the presence of germanium and phosphorus in a pure gold bonding wire. The samples were dissolved with hydrobromic acid and nitric acid at room temperature. The quantitation limits were 0.012 mg L-1 at 265.118 nm for Ge and 0.009 mg L-1 at 177.495 nm for P. Using the mixed acid digestion formula of DIW+HBr+HNO3, the recoveries were in the range of 98-100% and the relative standard deviation was within 1.1-2.3%. On the other hand, the amount of Ge decreased by about 16.2% using DIW+HCl+HNO3, due to the formation of a volatile compound. The Ge contents determined using the external method and the standard addition method were 9.45 mg kg-1 and 9.24 mg kg-1, respectively, and the P contents, using the same methods, were 22.49 mg kg-1 and 23.09 mg kg-1, respectively. Both methods were successfully used to determine the trace amounts of P and Ge in the pure gold bonding wire samples.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.2
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• pp.102-107
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• 2019

The vehicle market has developed environment-friendly vehicles to comply with fuel economy regulations and exhaust regulations that have become stricter and stricter over time. Many studies have been conducted to improve the travel performance and fuel economy of environment-friendly vehicles, and vehicle manufacturers have been studying how to manufacture light-weight vehicles in order to improve the fuel economy of both existing vehicles and the newer environment-friendly vehicles. Exemplary light-weight vehicle technologies optimizes the design of the vehicle body structure, which is a vehicle weight-reducing method that modifies component shapes or layouts to optimize the structure of the vehicle. In addition, the new process technology uses new light-weight and very strong materials, and not typical materials, to manufacture light-weight vehicles. This study aims at the optimal design of vehicle body structures using multi-materials for the Fender-Apron, which is an important frame member for the external front side of a vehicle body, by conducting FEA (Finite Element Analysis) and multi-material bonding.

• Journal of the Korea Concrete Institute
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• v.11 no.6
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• pp.129-135
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• 1999

Reinforced concrete structures are constructed under the basic assumption of perfect bonding between steel and concrete. The corrosion of steel in the reinforced concrete beams results in the excessive cracks and gradual deterioration of concrete. This paper are concerned about the slip characteristics of reinforced concrete between steel and concrete. The accelerated test by external power supply was conducted with the three corrosion rates in the laboratory. As a result, it was obtained as follows: (1) the yield strength of steel was reduced according to corrosion states. (2) the equivalent steel area should be considered for detailed analysis. (3) According to the use of corroded steel or not, slip amounts between concrete and steel in test beams increased as the corrosion rate increased. These results can be explained from the bond loss between concrete and steel in test beams.

• Journal of Industrial and Engineering Chemistry
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• v.67
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• pp.312-315
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• 2018

Although the reversibility of 10,12-pentacosadiynoic amino meta-acid(PCDA-mBzA) against temperature and pH was reported, the modulation of reversibility by ion adsorption at terminal functional group has not been investigated. In this work, we developed a simple method for modulating the reversibility of PCDA-mBzA films upon a thermal stimulus by cadmium ion adsorption inducing the breakage of the outer hydrogen bonding of two hydrogen bonds, which are responsible for the reversible properties of PCDA-mBzA. External reflection-Fourier transform infrared (ER-FTIR) analyses revealed that the hydrogen bonding between the carboxylic acid groups was broken through ion adsorption and only a single hydrogen bond between the amide groups remained in the PCDA-mBzA polymer. In addition, PCDA-mBzA films could recover their original property through cadmium ion desorption. These results present that the transition between reversibility and irreversibility can be modulated artificially simply through the adsorption and desorption of metal ions.

• Journal of the Korean institute of surface engineering
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• v.55 no.4
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• pp.202-214
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• 2022

Internal connections between device, package and external terminals for connecting packaging and printed circuit board are normally manufactured by electroless Ni-P plating followed by immersion Au plating (ENIG process) to ensure the connection reliability. In this study, a new non-cyanide-based immersion and electroless Au plating solutions using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated on different underlayer electroless Ni-P plating layers. As a result, it was confirmed that the deposition behavior and film properties of electroless Au plating are affected by grain size and impurity of the electroless Ni-P film, which is used as the plating underlayer. Au plating on the electroless Ni-P plating film with a dense surface structure showed the highest bonding strength. In addition, the electroless Au plating film on the Ni-P plating film has a smaller particle size exhibited higher bonding strength than that on the large particle size.