• Journal of the Korean Society for Heat Treatment
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• v.36 no.2
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• pp.61-68
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• 2023

Ti and Ti alloys are used in the automobile and aerospace industries due to their high specific strength and excellent corrosion resistance. However their application is limited due to poor formability at room temperature and high unit cost. In order to overcome these issues, dissimilarly jointed materials, such as cladding materials, are widely investigated to utilize them in each industrial field because of an enhanced plasticity and relatively low cost. Among various dissimilar bonding processes, the rolled cladding process is widely used in Ti alloys, but has a disadvantage of low bonding strength. Although this problem can be solved through post-heat treatment, the mechanical properties at the bonded interface are deteriorated due to residual stress generated during post-heat treatment. Therefore, in this study, the microstructure change and residual stress trends at the interfaces of Ti/Al cladding materials were studied with increasing post-heat treatment temperature. As a result, compared to the as-rolled specimens, no difference in microstructure was observed in the specimens after postheat treatment at 300, 400, and 500℃. However, a new intermetallic compound layer was formed between Ti and Al when post-heat treatment was performed at a temperature of 600℃ or higher. Then, it was also confirmed that compressive residual stress with a large deviation was formed in Ti due to the difference in thermal expansion coefficient and modulus of elasticity between Ti Grade II and Al 1050.

• Korean Journal of Materials Research
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• v.8 no.8
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• pp.744-750
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• 1998

Unlike common device, MEMS(micro-electro-mechanical system) device consists of very small mechanical structures which determine the performance of the device. Because of its small mechanical structure inside. MEMS device is very sensitive to thermal stress caused by CTE(coefficient of thermal expansion) mismatch between its components. Therefore, its characteristics are affected by material properties. process temperature. and dimensions of each layer such as chip, adhesive and substrate. In this study. we investigated the change of the thermal stress in the chip attached to a substrate. With computer-aided finite element method (FEM), the computer simulation of the thermal stress was conducted on variables such as bonding material, process temperature, bonding layer thickness and die size. The commercial simulation program, ABAQUS ver5.6, was used. Subsequently 3-layer test samples were fabricated, and their degree of bending were measured by 3-D coordinate measuring machine. The experimental results were in good agreement with the simulation results. This study shows that the bonding layer could be the source of stress or act as the buffer layer for stress according to its elastic modulus and CTE. Solder adhesive layer was the source of stress due to its high elastic modulus, therefore high compressive stress was developed in the chip. And the maximum tensile stress was developed in the adhesive layer. On the other hand, polymer adhesive layer with low elastic modulus acted as buffer layer, and resulted in lower compressive stress. The maximum tensile stress was developed in the substrate.

• Proceedings of the KSR Conference
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• 2011.05a
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• pp.1502-1508
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• 2011

Ground anchor expands the hollow wall of settled part and has the structure which resists the designed tensile load by the bearing pressure generated by the wedge of the anchor body pressing in the expanded part. Such ground anchor has been recognized for stability and economicality since 1960s in technologically advanced nations such as Japan and Europe, and in 1970s, the Japan Society of Soil Engineering has established and announced the anchor concept map. The ground anchor introduced in Korea, however, has the structural problem where the tensile strength is comes only from the ground frictional force due to expansion of the wedge body. In an interval where the ground strength is locally reduced due to fault, discontinuation or such, this is pointed out as a critical weakness where the anchor body of around 1.0m must resist the tensile load. Also, in the installation of concrete block, the concentrated stress of concrete block constructed on the uneven rock surface causes damage, and many such issues in the anchor head have been reported. Thus, in this study, by using the expanded bit for precise expansion of settled part, the ground anchor system was completed so that the bearing pressure of ground anchor can be expressed as much as possible, and the bearing plate was inserted into the ground to resolve the existing issues of concrete block. Through numerical analysis and pullout test executed for verification of site applicability, the pullout-behavior characteristics of anchor was analyzed.

• Journal of the Korean Ceramic Society
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• v.49 no.4
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• pp.301-307
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• 2012

SiAlON glasses are silicates or alumino-silicates, containing Mg, Ca, Y or rare earth (RE) ions as modifiers, in which nitrogen atoms substitute for oxygen atoms in the glass network. These glasses are found as intergranular films and at triple point junctions in silicon nitride ceramics and these grain boundary phases affect their fracture behaviour. This paper provides an overview of the preparation of M-SiAlON glasses and outlines the effects of composition on properties. As nitrogen substitutes for oxygen in SiAlON glasses, increases are observed in glass transition temperatures, viscosities, elastic moduli and microhardness. These property changes are compared with known effects of grain boundary glass chemistry in silicon nitride ceramics. Oxide sintering additives provide conditions for liquid phase sintering, reacting with surface silica on the $Si_3N_4$ particles and some of the nitride to form SiAlON liquid phases which on cooling remain as intergranular glasses. Thermal expansion mismatch between the grain boundary glass and the silicon nitride causes residual stresses in the material which can be determined from bulk SiAlON glass properties. The tensile residual stresses in the glass phase increase with increasing Y:Al ratio and this correlates with increasing fracture toughness as a result of easier debonding at the glass/${\beta}-Si_3N_4$ interface.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.20 no.3
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• pp.321-327
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• 2007

This study presents a new gridless finite difference method for solving elastic crack problems. The method constructs the Taylor expansion based on the MLS(Moving Least Squares) method and effectively calculates the approximation and its derivatives without differentiation process. Since no connectivity between nodes is required, the modeling of discontinuity embedded in the domain is very convenient and discontinuity effect due to crack is naturally implemented in the construction of difference equations. Direct discretization of the governing partial differential equations makes solution process faster than other numerical schemes using numerical integration. Numerical results for mode I and II crack problems demonstrates that the proposed method accurately and efficiently evaluates the stress intensity factors.

• The KSFM Journal of Fluid Machinery
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• v.19 no.1
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• pp.37-44
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• 2016

In this study, a parametric study of a centrifugal pump with double volute has been performed numerically using three-dimensional Reynolds-averaged Navier-Stokes equations. The shear stress transport model was selected as turbulence closure through turbulence model test. The finite volume method and unstructured grid system were used for the numerical analysis. The optimal grid system in the computational domain was determined through a grid dependency test. The expansion coefficient, circumferential and radial starting positions and length of divider were selected as the geometric parameters to be tested. And, the hydraulic efficiency and the radial thrust coefficient were considered as performance parameters. It was found that the radial thrust and hydrualic efficiency are more sensitive to the expansion angle and circumferential starting position of the divider than the other geometrical parameters.

• Computers and Concrete
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• v.16 no.6
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• pp.847-864
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• 2015

This study aimed to develop models of sulfate diffusion and ettringite content profile in cement paste for the predication of the damage behavior in cement paste subject to external sulfate. In the models, multiphase reaction equilibrium between ions in pore solution and solid calcium aluminates phases and the microstructure changes in different positions of cement paste were taken into account. The distributions of expansive volume strain and expansion stress in cement paste were calculated based on the ettringite content profile model. In addition, more sulfate diffusion tests and SEM analyses were determined to verify the reliability and veracity of the models. As the results shown, there was a good correlation between the numerical simulation results and experimental evidences. The results indicated that the water to cement ratio (w/c) had a significant influence on the diffusion of sulfate ions, ettringite concentration profile and expansion properties in cement paste specimens. The cracking points caused by ettringite growth in cement paste specimens were predicted through numerical methods. According to the simulation results, the fracture of cement paste would be accelerated when the specimens were prepared with higher w/c or when they were exposed to sulfate solution with higher concentration.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.05a
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• pp.29-33
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• 2001

In the present study, AZ91Mg/$\textrm{Al}_2\textrm{O}_3$ short fiber+SiC particulates hybrid metal matrix composites(MMCs) were fabricated by squeeze casting method. Different particulate sizes of 45, 29 and $9\mu\textrm{m}$ were hybridized with 5% volume fraction to investigate the effect of SiC particulates size on microstructure, mechanical and thermal properties such as hardness, flexural strength, wear resistance and thermal expansion. Results show that the microstructure of the hybrid composites were quite satisfactory, namely revealing relatively uniform distribution of reinforcements. Some aggregation of SiC particulates caused by particle pushing was observed especially in the hybrid composites containing in fine particulates($9\mu\textrm{m}$). The hardness and flexural strength were improved by decreasing particulates size, whereas wear resistance improved by increasing particulates size because of large particulates restricting matrix wear from contacted stress. Regardless of particulates size, thermal expansion of composites was the same. This may be because the content of particulates was in all cases 5 volume fraction.1

• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.6
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• pp.1872-1885
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• 1991

The analysis of electromagnetic forming process consists of the analysis of the electric circuit and the dynamic deformation analysis. The purpose of the electric circuit analysis is to calculate the magnetic pressure and to apply it to the deformation analysis. Some investigators performed the analysis assuming the pressure distribution in longitudinal direction. However there was a difference between the calculated and experimental results. The difference mainly came from the assumption of the pressure distribution. One must know the magnetic field distribution in an actual situation for the analysis to be less erroneous. In this work the electromagnetic field analysis was performed by the finite element method to obtain a more realistic pressure distribution. A better agreement between the calculated and experimental results was obtained. It became possible to predict the deformation behavior of the workpiece of finite length.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.12
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• pp.153-159
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• 1997

A thermally-driven polysilicon microactuator has been fabricated using surface micromachining techniques. It consists of P-doped polysilicon as a structural layer and TEOS(tetraethylorthosilicate) oxide as a sacrificial layer. The polysilicon was annealed for the relaxation of residual stress which is the main cause to its deformation such as bending and buckling. And newly developed HF GPE(gas-phase etching) process was also employed to eliminate the troublesome stiction problem using anhydrous HF gas and CH$_{3}$OH vapor, and successfully fabricated the microactuators. The actuation is incurred by the thermal expansion due to the current flow in the active polysilicon cantilever, which motion is amplified by lever mechanism. The moving distance of polysilicon microactuator was experimentally conformed as large as 21 .mu. m at the input voltage level of 10V and 50Hz square wave. The actuating characteris- tics are also compared with the simulalted results considering heat transfer and thermal expansion in the polysilicon layer. This microactuator technology can be utilized for the fabrication of MEMS (microelectromechanical system) such as microrelay, which requires large displacement or contact force but relatively slow response.