• Journal of the Korean Society for Precision Engineering
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• v.28 no.2
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• pp.233-238
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• 2011

In piping design of nuclear power plant facilities, the load stress according to self-weight is important for design values in test run(shutdown and starting). But sometimes it needs more studies, such as seismic analysis of an earthquake of power plant area and fatigue life and stress of thermal expansion and anchor displacement in operating run. In this paper, seismic evaluations were performed to nuclear piping system of Shin-Kori NO. 3&4 being built in Pusan lately. Results of seismic analysis are evaluated on basis of KEPIC MN code. The structural integrity on RCB piping system was proved.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.49-53
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• 2004

Polymeric materials are widely used in the electronic industry as a common dielectric material or adhesive. The polymeric layer coated on Si substrate can be subjected to thermal stresses due to difference in thermal expansion coefficients. The mismatch in thermal properties between the polymeric layer and the substrate results in significant residual stresses. In this study, the thermal deformation is measured by a curvature measurement method using laser scanning, and the elastic modulus is calculated by an analytic model.

• Journal of the Korean GEO-environmental Society
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• v.17 no.7
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• pp.27-33
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• 2016

This study expanded Terzaghi arching formula, which assumed a vertical surface as a sliding surface, to consider an arbitrarily inclined surface as a sliding surface and examined the effect of a sliding surface. This study firstly developed a formula to expand the existing Terzaghi arching formula to consider an inclined surface as well as a vertical surface as a sliding surface under the downward movement of a trap door. Using the expanded formula, the effect of excavation, ground, and surcharge conditions on a vertical stress was examined and the results were compared with them from Terzaghi arching formula. The comparison indicated that the induced vertical stress was highly affected by the angle of an inclined sliding surface and the degree of influence depended on the excavation, ground, and surcharge conditions. It is expected that the results from this study would provide a better understanding of various arching phenomenon in the future.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.04a
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• pp.87-90
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• 2003

In this paper, the electromechanical displacements of curved actuators such as THUNDER are calculated by finite element method to design the optimal configuration of curved actuators. To predict the pre-stress in the device due to the mismatch in coefficients of thermal expansion, the adhesive as well as metal and PZT ceramic is also numerically modeled by using hexahedral solid elements. Because the modeling of these thin layers causes the numbers of degree of freedom to increase, large-scale structural analyses are performed in a cluster system in this study. The curved shape and pre-stress in the actuator are obtained by the cured curvature analysis. The displacement under the piezoelectric force by an applied voltage is also calculated to compare the performance of curved actuator. The thickness of metal and adhesive, the number of metal layer are chosen as design factors.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1407-1412
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• 2003

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temparature change is investigated using high-sensitivity $Moir{\acute{e}}$ interferometry. Using the real-time $Moir{\acute{e}}$ setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compond and the PCB.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.505-506
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• 2006

Size reduction of micro-aperture using additional deposition is presented in this study. PECVD process was used for additional deposition. Rate of deposition is different with deposition direction because corners of shadowmask membrane have a taper. Deposition into backside showed better than deposition into frontside with size reduction. Shadowmask membrane with two materials has stress because of the difference of a coefficient of thermal expansion The cantilever of membrane bend to opposite direction of deposition. Deposition to both frontside and backside could reduce inside stress.

• Transactions of the Korean Society of Automotive Engineers
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• v.9 no.4
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• pp.204-213
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• 2001

This paper develops the compliance approach to the problem of load sharing between a cracked plate and a cover plate used to bridge the crack. The theory is validated by using calculated stress intensity factors for the covered and uncovered cases and by using stop hole method to reduce experimentally observed growth rates to a common base. Calculations are then made on the effect of cover plate width on fatigue crack retardation in order to demonstrate the predictive capability of the technique.

• Tribology and Lubricants
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• v.15 no.4
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• pp.297-303
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• 1999

O-rings in automotive engines are important components such as a coolant pipe, engine oil circulating lines and fuel injector for sealing that makes efficient performance of the engine. Life cycle of O-rings is effected in environments of the O-ring seal, like that applied pressure, working temperature, precompressed ratio and materials. It is related in extrusion, expansion and fatigue failure of O-rings. In this paper, an pressurized, compressed elastomeric O-ring inserted into a rectangular groove is analysed numerically using the nonlinear finite element method. The calculated FEM results showed that extrusion ratio and contact stress are strongly related to the gap clearance and edge radius of the groove.

• Tribology and Lubricants
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• v.15 no.2
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• pp.150-155
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• 1999

The rolling fatigue lives (RFL) of five kinds of silicon nitride balls were investigated. Four kinds of Si$_3$N$_4$balls were fabricated using different raw materials, sintering aids and sintering conditions. Commercially available Si$_3$N$_4$ball was also studied for comparison. All the balls were finished up to the dimensional accuracy of Grade 10 defined in KS B 2001 (Steel Balls fer Ball Bearings) with a size of 9.525 mm. RFL tests were then conducted under the initial theoretical maximum contact stress 6.38 GPa and the spindle speed 10,000 rpm. Gear oil was provided by oiled race as lubricant. The results of RFL test indicated the prerequisitic conditions for the long rolling life of Si$_3$N$_4$ball : (1) the high density, (2) microstructures consisted of small uniformly distributed grains, (3) little glassy phase in grainboundary, and (4) little crystalline phase and secondary phase that induces residual thermal stress due to the differences of thermal expansion coefficient with Si$_3$N$_4$phase.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.150-152
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• 2007

It has been known that the underfilling technique is effective in reducing thermal and environmental stress concentration at solder joint in FC asscemblies. In this paper, the effect of thermomechanical properties of underfill such as coefficient of thermal expansion(CTE) and Young's modulus on reliability of FC assembly under thermal cycling was investigated. For parametric study for optimal design of underfill, finite element analyses(FEA) were performed for seven different CTEs and five different Young's modulus. The results show that the concentrated maximum stress decreases as Young's modulus of underfill increases and the CTE of underfill decreases.