• Structural Engineering and Mechanics
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• v.64 no.2
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• pp.213-223
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• 2017

Bridges are lifeline and integral components of transportation system that are susceptible to seismic actions, their vulnerability assessment is essential for seismic risk assessment and mitigation. The vulnerability assessment of bridges common in Pakistan is very important as it is seismically very active region and the available code for the seismic design of bridges is obsolete. This research presents seismic vulnerability assessment of three real case simply supported multi-span reinforced concrete bridges commonly found in northern Pakistan, having one, two and three bents with circular piers. The vulnerability assessment is carried through the non-linear dynamic time history analyses for the derivation of fragility curves. Finite element based numerical models of the bridges were developed in MIDAS CIVIL (2015) and analyzed through with non-linear dynamic and incremental dynamic analyses, using a suite of bridge-specific natural spectrum compatible ground motion records. Seismic responses of shear key, bearing pad, expansion joint and pier components of each bridges were recorded during analysis and retrieved for performance based analysis. Fragility curves were developed for the bearing pads, shear key, expansion joint and pier of the bridges that first reach ultimate limit state. Dynamic analysis and the derived fragility curves show that ultimate limit state of bearing pads, shear keys and expansion joints of the bridges exceed first, followed by the piers ultimate limit state for all the three bridges. Mean collapse capacities computed for all the components indicated that bearing pads, expansion joints, and shear keys exceed the ultimate limit state at lowest seismic intensities.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.470-474
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• 1997

Since the ceramic/metal joints is joined at high temperature, the residual stress will develop during when cooled from bonding temperature due to remarkable difference of thermal expansion coefficient between creamic and metal. Moreover, the edge of jointed interface makes singular stress field in the ceramic/metal joints and this singular stress field much influences on the strength of joints. In this study, The influence of residual stress, mechanical load and repeat thermal sysle was estimated in the ceramic/metal joints. According to this influence, the change of singular stress field was analyed and then strength test, X-ray measurement are performed.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2010.05a
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• pp.664-665
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• 2010

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.365-370
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• 2004

Generally, component and FR-4 board are connected by solder joint. Because material properties of components and FR-4 board are different, component and FR-4 board show different coefficients of thermal expansion (CTE) and thus strains in component and board are different when they are heated. That is, the differences in CTE of component and FR-4 board cause the dissimilarity in shear strain and solder joint' failure. The first order Taylor series expansion of the limit state function incorporating with Tresca failure criterion is used in order to estimate the failure probability of solder joints under heated condition. Using shear stresses and shear strains appeared on the solder joint, we estimate the failure probability of solder joints with the Tresca failure criterion. The effects of random variables such as CTE, distance of the solder joint from the neutral point(DNP), temperature variation and height of solder on the failure probability of the solder joint are systematically studied by using the failure probability model with first order reliability method(FORM).

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.67-74
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• 2011

Keys to high wiring density semiconductor packages include flip-chip bonding and build-up substrate technologies. The current issues are the establishment of a fine pitch flip-chip bonding technology and a low coefficient of thermal expansion (CTE) substrate technology. In particular, electromigration and thermomigration in fine pitch flipchip joints have been recognized as a major reliability issue. In this paper, electromigration and thermomigration in Cu/Sn-3Ag-0.5Cu (SAC305)/Cu flip-chip joints and electromigration in Cu/In/Cu flip chip joints are investigated. In the electromigration test, a large electromigration void nucleation at the cathode, large growth of intermetallic compounds (IMCs) at the anode, a unique solder bump deformation towards the cathode, and the significantly prolonged electromigration lifetime with the underfill were observed in both types of joints. In addition, the effects of crystallographic orientation of Sn on electromigration were observed in the Cu/SAC305/Cu joints. In the thermomigration test, Cu dissolution was accelerated on the hot side, and formation of IMCs was enhanced on the cold side at a thermal gradient of about $60^{\circ}C$/cm, which was lower than previously reported. The rate of Cu atom migration was found comparable to that of electromigration under current conditions.

• The Journal of the Acoustical Society of Korea
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• v.39 no.2
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• pp.98-104
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• 2020

A method to reduce the Contraction and Expansion (CE) noise occurred in an air conditioner is investigated. The noise is measured during the cooling and heating phases in a temperature and humidity chamber to identify the generating phenomenon of CE noise of the air conditioner and the decomposition method is used to estimate its occurrence location. The CE noise of an air conditioner is known to be caused by a stick-slip phenomenon generated by joints of parts connected to the lower decor. Thus a friction experiment was conducted to investigate noise inducing factors. Also, this study established evaluation criteria to effectively analyze the results from friction experiments. Experimental results indicate that increasing surface roughness on both sides of joints is effective. Accordingly, the effect of increased surface roughness on joints of upper and lower decor of air conditioners is evaluated to see its feasibility in a temperature and humidity chamber.

• International Journal of Highway Engineering
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• v.20 no.3
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• pp.65-73
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• 2018

PURPOSES : In this study, the propriety of expansion joint spacing of airport concrete pavement was examined by using weather and material characteristics. METHODS : A finite element model for simulating airport concrete pavement was developed and blowup occurrence due to temperature increase was analyzed. The critical temperature causing the expansion of concrete slab and blow up at the expansion joint was calculated according to the initial vertical displacement at the joint. The amount of expansion that can occur in the concrete slab for 20 years of design life was calculated by summing the expansion and contraction by temperature, alkali-silica reaction, and drying shrinkage. The effective expansion of pavement section between adjacent expansion joints was calculated by subtracting the effective width of expansion joint from the summation of the expansion of the pavement section. The temperature change causing the effective expansion of pavement section was also calculated. The effective expansion equivalent temperature change was compared to the critical temperature, which causes the blowup, according to expansion joint spacing to verify the propriety of expansion joint applied to the airport concrete pavement. RESULTS : When an initial vertical displacement of the expansion joint was 3mm or less, the blowup never occurred for 300m of joint spacing which is used in Korean airports currently. But, there was a risk of blow-up when an initial vertical displacement of the expansion joint was 5mm or more due to the weather or material characteristics. CONCLUSIONS : It was confirmed that the intial vertical displacement at the expansion joint could be managed below 3mm from the previous research results. Accordingly it was concluded that the 300m of current expansion joint spacing of Korean airports could be used without blowup by controling the alkali-silica reaction below its allowable limit.

• Transactions of the Korean Society of Automotive Engineers
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• v.4 no.6
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• pp.18-26
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• 1996

A two dimensional thermo elasto-plastic finite element stress analysis was performed to study residual stress distributions in AI composites reinforced by SiC whisker and $ZrO_2$ ceramic joints. The influences on the residual stress distributions due to the difference of the reinforcement volume fraction and interlayer material property were investigated. Specifically, stress distributions between AI interlayer material property were investigated. Specifically, stress distributions between AI interlayer and $ZrO_2$ ceramic and between the AI interlayer and AI composite were computationally analzed.

• Journal of Welding and Joining
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• v.13 no.2
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• pp.82-95
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• 1995

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

• Journal of Korean Society of Environmental Engineers
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• v.39 no.12
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• pp.733-740
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• 2017

'The facilities standards of water supply' issued by the Ministry of Environment in 2004 indicates that expansion joints cannot be used in welding water supply steel pipes. However, their reason is not clear and it is difficult to confirm the stability of the steel pipe for a water supply pipeline. The purpose of this study is to determine whether or not an expansion joint is necessary to improve the stability of water supply in steel pipe through a displacement analysis of the pipework. The test results are as follows. Firstly, it was found that expansion and contraction of the water supply steel pipe (D 2,400 mm) occur repeatedly in 4 cycles per year, and the maximum expansion and contraction amount of the pipe is 13.03 mm in 1.24 km pipelines. Secondly, the thermal stress caused by expansion and contraction of the steel pipe is $13.7{\sim}36.1kgf/cm^2$ according to the burial depth (0~4 m). The main comparison factors to determine the stability of the steel pipe (STWW 400) were the allowable tensile strength and the fatigue limit, which were computed to be $4,100kgf/cm^2$ and $1,840kgf/cm^2$, respectively. Finally, the thermal stress of the steel pipe is very small compared to the allowable tensile stress and fatigue stress. Therefore, thermal stress does not affect the stability of the steel pipe, although the expansion and contraction of the steel pipe occurs by temperature changes. In conclusion, the study demonstrated that expansion joints are not required in water supply steel pipelines.