• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.10a
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• pp.7-10
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• 2003

Blue-light-emitting peiymer/dielectric nanolayer nanocomposites were prepared by the solution intercalation method and employed in electroluminescent device. Their photoluminescence and electroluminescence characteristics suggested that the nanolayers isolate the polymer chains and hinder the formation of excimers and aggregates. By reducing the excimer formation and its deleterious effects on emission efficiency, both the color purity and the luminescence stability were improved. Furthermore, the dielectric nanolayers have an aspect ratio of about 500 and therefore act as efficient barriers to oxygen and moisture diffusion, which produced a dramatic increase in the device stability.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.53-57
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• 2014

Thin glass (< 100 microns) is a promising material from which advanced interposers for high density electrical interconnects for 2.5D chip packaging can be produced. But thin glass is extremely brittle, so mechanical micromachining to create through glass vias (TGVs) is particularly challenging. In this article we show how laser processing using deep UV excimer lasers at a wavelength of 193 nm provides a viable solution capable of drilling dense patterns of TGVs with high hole counts. Based on mask illumination, this method supports parallel drilling of up over 1,000 through vias in 30 to $100{\mu}m$ thin glass sheets. (We also briefly discuss that ultrafast lasers are an excellent alternative for laser drilling of TGVs at lower pattern densities.) We present data showing that this process can deliver the requisite hole quality and can readily achieve future-proof TGV diameters as small $10{\mu}m$ together with a corresponding reduction in pitch size.