• Title/Summary/Keyword: eutectic melting

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Characteristics of the laser brazing on AZ31 magnesium alloy and Zn coated steel dissimilar joint (AZ31 마그네슘합금과 아연도금강판 이종소재의 레이저 브레이징 특성)

  • Lee, Mok-Young;Kim, Sook-Whan;NASIRI, ALI M.;ZHOU, NORMAN Y.
    • Laser Solutions
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    • v.17 no.1
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    • pp.7-12
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    • 2014
  • The dissimilar welding between magnesium alloy and steel sheet was required in automobile industry to increase the strength of the dissimilar joints. Laser brazing is one of the good joining processes for Mg- steel dissimilar joint. In this study, AZ31 magnesium alloy and Zn coated steel dissimilar joint was brazed using diode direct laser with Mg600 filler wire and Superior #21 flux. The wetting of Mg filler wire on Zn coating was very good because of the formation of eutectic phase with low melting temperature. The strength of the brazed joint between AZ31 magnesium alloy and Zn coated steel was 131.3N/mm. The fracture occurred at brazement.

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A Study on the Characteristics of Sn-Ag-X Solder Joint -The Wettability of Sn-Ag-Bi-In Solder to Plated Substrates- (Sn-Ag-X계 무연솔더부의 특성 연구 -기판 도금층에 따른 Sn-Ag-Bi-In 솔더의 젖음특성-)

  • 김문일;문준권;정재필
    • Journal of the Korean institute of surface engineering
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    • v.35 no.1
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    • pp.11-16
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    • 2002
  • As environmental concerns increasing, the electronics industry is focusing more attention on lead free solder alternatives. In this research, we have researched wettability of intermediate solder of Sn3Ag9Bi5In, which include In and Bi and has similar melting temperature to Sn37Pb eutectic solder. We investigated the wetting property of Sn3Ag9Bi5In. To estimate wettability of Sn3Ag9Bi5In solder on various substrates, the wettability of Sn3Ag9Bi5In solder on high-pure Cu-coupon was measured. Cu-coupon that plated Sn, Ni and Au/Ni and Si-wafer adsorbed Ni/Cu under bump metallurgy on one side. As a result, the wetting property of Sn3Ag9Bi5In solder is a little better than that of Sn37Pb and Sn3.5Ag.

Forming Mechanism of TiC Hollow Fibers during Self-Propagating High Temperature Synthesis (자전연소합성 반응중 속빈 TiC 섬유의 형성 기구)

  • 윤존도;방환철
    • Journal of the Korean Ceramic Society
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    • v.37 no.4
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    • pp.332-337
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    • 2000
  • Forming mechanism of fibrous TiC during self-propagating high temperature synthetic reaction was analyzed and suggested. It was revealed that critical temperature for the stable fiber formation was not the melting point of TiC, but the eutectic reaction temperature of TiC and C. Minimum amount of TiC diluent addition required to form fibers was calculated to be 25.6%, which was consistent with the experimental result. Synthesized fibers were found hollow tube-like. The morphology was explained by the diffusion rates of C and Ti in TiC, and by the molar volume chnage of C during the reaction. Expanding shell model was suggested for the hollow fiber formation mechanism.

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A study on the MC Carbide Morphologies Directionally Solidified Superalloys (일방향응고 초내열합금에서 MC 탄화물 형상에 관한 연구)

  • Kim, Seung-Eon;Jo, Chang-Yong;Kim, Hak-Min
    • 한국기계연구소 소보
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    • s.20
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    • pp.57-63
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    • 1990
  • The morphologies of MC carbides (M stands for metal) and creep-rupture properties in directionally solidified Rene 80 having standard and Hf-modified chemistries were studied. It was found that Hf depressed the melting point, $\gamma$- $\gamma$’ eutectic temperature and $\gamma$’ solvus of nickel-base superalloy Rene 80, but did not depress MC carbide forming temperature. The morphologies of MC carbides depended upon solidification sequence, which led to blocky type in the early stage and script type in the late stage of solidification. Creep failure occurs through the crack initiation at the transverse components of longitudinal grain boundaries or interdendritic carbides in directionally solidified superalloys. It could be concluded MC carbide morphologies played an important role in creep properties of DS superalloys, that is, Hf additions increased the creep ductilities and lives of Rene 80.

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Electrochemical extraction of uranium on the gallium and cadmium reactive electrodes in molten salt

  • Valeri Smolenski;Alena Novoselova
    • Nuclear Engineering and Technology
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    • v.56 no.1
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    • pp.42-47
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    • 2024
  • The electrochemical extraction of uranium in ternary low melting LiCl-KCl-CsCl eutectic on inert and reactive electrodes via different electrochemical techniques was investigated. It was established that the electrochemical reduction process of U(III) ions on the inert W electrode was irreversible and proceeded in one stage. On reactive liquid Ga and liquid Cd electrodes the reduction of uranium ions took place with the considerable depolarization with the formation of UGa2, UGa3 and UCd11 intermetallic compounds. Thermodynamic characteristics of uranium compounds and alloys were calculated. The conditions for the extraction of uranium from the electrolyte in the form of alloys on both liquid reactive electrodes via potentiostatic electrolysis were found.

Effects of the Brazing Bonding between Al2O3 and STS304 with an Ion Beams (이온빔을 이용한 STS304와 알루미나 브레이징 접합효과)

  • Park, Il-Soo
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.16 no.12
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    • pp.8679-8683
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    • 2015
  • Using a surface modification technique, ion beam assisted deposition (IBAD) of Ti thin film it becomes possible to prepare an active ceramic surface to braze $Al_2O_3$-STS304 with conventional Ag-Cu eutectic composition filler metal. Researches on bonding formations at interfaces of ceramic joints were mainly related on the development of filler metals to ceramic, the process parameters, and clarifications of reaction products. From the results, the reactive brazing is a very convenient technique compared to the conventional Mn-Mo method. However melting point of reactive filler is still higher than that of Ag-Cu eutectic and it forms the brittle inter metallic compound. Recently several new approaches are introduced to overcome the main shortcomings of the reactive metal brazing in ceramic-metal, metal vapor vacuum arc ion source was introduced to implant the reactive element directly into the ceramics surface, and sputter deposition with sputter etching for the deposition of active material.

Performance Analysis of The KALIMER Breakeven Core Driver Fuel Pin Based on Conceptual Design Parameters

  • Lee Dong Uk;Lee Byoung Oon;Kim Young Gyun;Lee Ki Bog;Jang Jin Wook
    • Nuclear Engineering and Technology
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    • v.35 no.4
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    • pp.356-368
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    • 2003
  • Material properties such as coolant specific heat, film heat transfer coefficient, cladding thermal conductivity, surface diffusion coefficient of the multi-bubble are improved in MACSIS-Mod1. The axial power and flux profile module was also incorporated with irradiation history. The performance and feasibility of the updated driver fuel pin have been analyzed for nominal parameters based on the conceptual design for the KALIMER breakeven core by MACSIS-MOD1 code. The fuel slug centerline temperature takes the maximum at 700mm from the bottom of the slug in spite of the nearly symmetric axial power distribution. The cladding mid-wall and coolant temperatures take the maximum at the top of the pin. Temperature of the fuel slug surface over the entire irradiation life is much lower than the fuel-clad eutectic reaction temperature. The fission gas release of the driver fuel pin at the end of life is predicted to be $68.61\%$ and plenum pressure is too low to cause cladding yielding. The probability that the fuel pin would fail is estimated to be much less than that allowed in the design criteria. The maximum radial deformation of the fuel pin is $1.93\%$, satisfying the preliminary design criterion ($3\%$) for fuel pin deformation. Therefore the conceptual design parameters of the driver fuel pin for the KALIMER breakeven core are expected to satisfy the preliminary criteria on temperature, fluence limit, deformation limit etc.

Phase Behavior Study of Fatty Acid Potassium Cream Soaps (지방산 칼륨 Cream Soaps 의 상거동 연구)

  • Noh, Min Joo;Yeo, Hye Lim;Lee, Ji Hyun;Park, Myeong Sam;Lee, Jun Bae;Yoon, Moung Seok
    • Journal of the Society of Cosmetic Scientists of Korea
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    • v.48 no.1
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    • pp.55-64
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    • 2022
  • The potassium cream soap with fatty acid called cleaning foam has a crystal gel structure, and unlike an emulsion system, it is weak to shear stress and shows characteristics that are easily separated under high temperature storage conditions. The crystal gel structure of cleansing foams is significantly influenced by the nature and proportion of fatty acids, degree of neutralization, and the nature and proportion of polyols. In order to investigate the effect of these parameters on the crystal gel structure, a ternary system consisting of water/KOH/fatty acid was investigated in this study. The investigation of differential scanning calorimeter (DSC) revealed that the eutectic point was found at the ratio of myristic acid (MA) : stearic acid (SA) = 3 : 1 and ternary systems were the most stable at the eutectic point. However, the increase in fatty acid content had little effect on stability. On the basis of viscosity and polarized optical microscopy (POM) measurements, the optimum degree of neutralization was found to be about 75%. The system was stable when the melting point (Tm) of the ternary system was higher than the storage temperature and the crystal phase was transferred to lamellar gel phase, but the increase in fatty acid content had little effect on stability. The addition of polyols to the ternary system played an important role in changing the Tm and causing phase transition. The structure of the cleansing foams were confirmed through cryogenic scanning electron microscope (Cryo-SEM), small and wide angle X-ray scattering (SAXS and WAXS) analysis. Since butylene glycol (BG), propylene glycol (PG), and dipropylene glycol (DPG) lowered the Tm and hindered the lamellar gel formation, they were unsuitable for the formation of stable cleansing foam. In contrast, glycerin, PEG-400, and sorbitol increased the Tm, and facilitated the formation of lamellar gel phase, which led to a stable ternary system. Glycerin was found to be the most optimal agent to prepare a cleansing foam with enhanced stability.

Mechanism of Crack Formation in Pulse Nd YAG Laser Spot Welding of Al Alloys (Al합금 펄스 Nd:YAG 레이저 점 용접부의 균열 발생기구)

  • Ha, Yong Su;Jo, Chang Hyeon;Gang, Jeong Yun;Kim, Jong Do;Park, Hwa Sun
    • Journal of Welding and Joining
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    • v.18 no.2
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    • pp.213-213
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    • 2000
  • This study was performed to investigate types and formation mechanism of cracks in two Al alloy welds, A5083 and A7NO1 spot-welded by pulse Nd: YAG laser, using SEM, EPMA and Micro-XRD. In the weld zone, three types of crack were observed: center line crack($C_{C}$), diagonal crack($C_{D}$), and U shape crack($C_{U}$). Also, HAZ crack($C_{H}$), was observed in the HAZ region, furthermore, mixing crack($C_{M}$), consisting of diagonal crack and HAZ crack was observed.White film was formed at the hot crack region in the fractured surface after it was immersed to 10%NaOH water. In the case of A5083 alloy, white films in C crack and $C_D crack region were composed of low melting phases, Fe₂Si$Al_8$ and eutectic phases, Mg₂Al₃ and Mg₂Si. Such films observed near HAZ crack were also consist of eutectic Mg₂Al₃. In the case of A7N01 alloy, eutectic phases of CuAl₂, $Mg_{32}$ (Al,Zn) ₃, MgZn₂, Al₂CuMg and Mg₂Si were observed in the whitely etched films near $C_{C}$ crack and $C_{D}$ crack regions. The formation of liquid films was due to the segregation of Mg, Si, Fe in the case of A5083 alloy and Zn, Mg, Cu, Si in the case of A7N01 aooly, respectively.The $C_{D}$ and $C_{C}$ cracks were regarded as a result of the occurrence of tensile strain during the welding process. The formation of $C_{M}$ crack is likely to be due to the presence of liquid film at the grain boundary near the fusion line in the base metal as well as in the weld fusion zone during solidification. The $C_{U}$ crack is considered a result of the collapsed keyhole through incomplete closure during rapid solidification. (Received October 7, 1999)

INTERCONNECTION TECHNOLOGY IN ELECTRONIC PACKAGING AND ASSEMBLY

  • Wang, Chunqing;Li, Mingyu;Tian, Yanhong
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.439-449
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    • 2002
  • This paper reviews our recent research works on the interconnection technologies in electronic packaging and assembly. At the aspect of advanced joining methods, laser-ultrasonic fluxless soldering technology was proposed. The characteristic of this technology is that the oxide film was removed through the vibration excitated by high frequency laser change in the molten solder droplet. Application researches of laser soldering technology on solder bumping of BGA packages were carried out. Furthermore, interfacial reaction between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow was analyzed. At the aspect of soldered joints' reliability, the system for predicting and analyzing SMT solder joint shape and reliability(PSAR) has been designed. Optimization design method of soldered joints' structure was brought forward after the investigation of fatigue failure of RC chip devices and BGA packages under temperature cyclic conditions with FEM analysis and experimental study. At the aspect of solder alloy design, alloy design method based on quantum was proposed. The macroproperties such as melting point, wettability and strength were described by the electron parameters. In this way, a great deal of the experimental investigations was replaced, so as to realize the design and research of any kinds of solder alloys with low cost and high efficiency.

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