• Restorative Dentistry and Endodontics
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• 제27권3호
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• pp.257-269
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• 2002

Objective : The purpose of this study was to evaluate the resin infiltration into dentin of one-bottle adhesive systems and self-etching primer bonded to Class V cavities using confocal laser scanning microscope(CLSM). Material and Methods : Forty Class V cavities were prepared from freshly extracted caries-free Human teeth. These teeth were divided into two groups based on the presence of cervical abrasion: Group I, cervical abrasion : Group II, wedge-shaped cavity preparation. Resin-dentin interfaces were produced with two one-bottle dentin bonding systems-ONE COAT BOND(OCB; Coltene$^R$) and Syntac$^R$SPrint$^{TM}$(SS; VIVADENT)-, one self-etching priming system-CLEARFIL$^{TM}$ SE BOND (SB : KURARAY)- and one multi-step dentin bonding system-Scotchbond$^{TM}$Multi-Purpose (SBMP, 3M Dental Products)-as control according to manufacturers' instructions. Cavities were restored with Spectrum$^{R}$(Dentsply). Specimens were immersed in saline for 24 hours and sectioned longitudinally with a low-speed diamond disc. The resin-dentin interfaces were microscopically observed using CLSM. The quality of resin-infiltrated dentin layers were evaluated by five dentists using 0~4 scale. Results : Confocal laser scanning microscopal investigations using primer labeled with rhodamine B showed that the penetration of the primer occurred along the cavity margins. Statistical analysis using one-way ANOVA followed by Duncan's Multiple Range test revealed that the primer penetration of the group 2(wedge-shaped cavity preparation) was more effective than group 1(cervical abrasion) and that of the gingival interfaces was more effective than the occlusal interfaces. In the one-bottle dentin bonding systems, the resin penetration score of OCB was compatible to SBMP, but those of SS and self-etching priming system, SB were lower than SBMP.

• 한국정보전자통신기술학회논문지
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• 제14권4호
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• pp.323-327
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• 2021

본 논문은 OLED에 사용되는 SUS MASK를 자동액관리 시스템을 사용하여 제작 하였다. SUS MASK의 홀 직경은 0.4 mm으로 설정하여 실험 하였다. 첨가제 F300이 홀 직경이 0.4 mm에 근접하고 오차범위는 평균 0.08로 측정되어 우수함을 알 수 있었다. 그리고 산화환원전위(ORP) 변화에 따른 CuCl2와 FeCl3의 무게 감소량을 측정결과, FeCl3이 ORP 변화에 상대적으로 민감도가 높은 것으로 나타났다. SUS Mask를 연속적으로 에칭하면서 ORP(610 mV)와 비중(1.463)이 자동으로 조절되는지를 실험를 하였다. 실험결과로서는 셋팅 값이 크게 변화되지 않아 자동액관리 시스템이 잘 조절이 잘 되는 것으로 나타났다. 그리고 홀 직경을 0.4 mm로 목표치로 설정한 후 실험 한 결과는 0.36부터 0.44까지 측정되었다. 따라서 SUS MASK 제조공정에서 에칭가공공정은 제작된 자동액관리 시스템을 적용시키면 보다 안정성 높은 정밀도로 향상 시킬 수 있을 것으로 기대된다.

• 한국세라믹학회지
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• 제46권1호
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• pp.30-34
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• 2009

A Sand blasting technology has been used to address via and trench processing of glass wafer of optic semiconductor packaging. Manufactured sand blast that is controlled by blast nozzle and servomotor so that 8" wafer processing may be available. 10mm sq test device manufactured by Dry Film Resist (DFR) pattern process on 8" glass wafer of $500{\mu}m's$ thickness. Based on particle pressure and the wafer transfer speed, etch rate, mask erosion, and vertical trench slope have been analyzed. Perfect 500 um tooling has been performed at 0.3 MPa pressure and 100 rpm wafer speed. It is particle pressure that influence in processing depth and the transfer speed did not influence.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1-5
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• 2005

The grinding process is replacing lapping and etching process because significant cost savings and performance improvemnets is possible. This paper presents the experimental results of wafer grinding. A three-variable two-level full factorial design was employed to reveal the main effects as well as the interaction effects of three process parameters such as wheel rotational speed, chuck table rotational speed and feed rate on TTV and STIR of wafers. The chuck table rotaional speed was a significant factor and the interaction effects was significant. The ground wafer shape was affected by surface shape of chuck table.

• Restorative Dentistry and Endodontics
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• 제35권2호
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• pp.106-115
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• 2010

본 연구는 간접 복합레진 수복물을 1종의 자가부식형 레진시멘트와 3종의 자가접착형 레진시멘트를 이용하여 상아질에 합착하였을 때 각 레진시멘트의 미세인장 결합강도와 결합계면의 차이를 평가하기 위하여 시행하였다. 발거된 상.하악 대구치 교합면 측 상아질에 Tescera 복합레진 블록을 레진시멘트(PA 군: Panavia F 2.0, RE 군: RelyX Unicem Clicker, MA 군: Maxem, BI 군: BisCem)를 이용하여 합착하였다. 증류수에 24시간 동안 보관한 후, 합착된 면의 단면적이 $1.0\;{\times}\;1.0\;mm$인 막대모양의 시편을 제작하여 각 시편에 분당 0.5 mm의 crosshead speed로 인장하중을 가하였다. 각 군의 미세인장 결합강도는 one-way ANOVA와 Tukey의 HSD 방법을 이용하여 비교하였다. FE-SEM 하에서 모든 파절편의 상아질 쪽 파절양상과 레진시멘트-상아질 및 레진시멘트-복합레진의 계면을 관찰하였다. 본 연구의 결과 간접 복합레진 블록을 레진시멘트로 상아질에 합착할 때 PA 군과 RE 군은 MA 군과 BI군보다 높은 결합강도와 긴밀한 접착 및 레진테그가 관찰되었고, 복합레진과 레진시멘트 간에는 간극이 관찰되었다.

• 대한치과보철학회지
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• 제42권5호
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• pp.501-513
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• 2004

Purpose : The purpose of this study was to evaluate the effects of etching time on shear bond strength of four resin cements to IPS Empress 2 ceramic. Material and Methods: Forty rectangular shape ceramic specimens ($10{\times}15{\times}3.5mm$ size) were used for this study. The ceramic specimens divided into four groups and were etched with 10% hydrofluoric acid for 0, 10, 30, 60, 180, 300, 420, 600, and 900 seconds respectively. Etched surfaces of ceramic specimens were coated with ceramic adhesive system and bonded with four resin cement (Variolink II, Panavia F, Panavia 21, Super-Bond C&B) using acrylic glass tube. All cemented specimens were tested under shear loading untill fracture on universal testing machine at a crosshead speed 1mm/min: the maximum load at fracture (kg) was recored. Shear bond strengh data were analyzed with oneway analysis of variance and Tukey HSD tests (p<.05). Etched ceramic surfaces (0-, 60-, 300-, and 600-seconds etching period) and fracture surfaces after shear testing were examined mophologically using scanning electron microscopy. Results : Ceramic surface treatment with 10% hydrofluoric acid improved the bond strength of three resin cement except for Super-Bond C&B cement. Variolink II (41.0$\pm$2.4 MPa) resin cement at 300-seconds etching time showed statistically higher shear bond strength than the other resin cements (Panavia F: 28.3$\pm$2.3 MPa, Panavia 21: 21.5$\pm$2.2 MPa, Super-Bond C&B: 16.7$\pm$1.6 MPa). Ceramic surface etched with 10% hydrofluoric acid for 300 seconds showed more retentive surface texture. Conclusion: Within the limitation of this study, Variolink II resin cement are suitable for cementation of Empress 2 all-ceramic restorations and etching with 10% hydrofluoric acid for 180 to 300 seconds is required to enhance the bond strength.

• Restorative Dentistry and Endodontics
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• 제18권1호
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• pp.1-26
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• 1993

The purpose of this study was to investigate the effect of acid etching on the surface appearance and fracture toughness of five glass ionomer cements. Five kinds of commercially available glass ionomer cements including chemical curing filling type, chemical curing lining type, chemical curing metal reinforced type, light curing tilling type and light curing lining type were used for this study. The specimens for SEM study were fabricated by treating each glass ionomer cement with either visible light curing or self curing after being inserted into a rubber mold (diameter 4mm, depth 1mm). Some of the specimens were etched with 37% phosphoric acid for 0, 15, 30, 60, go seconds, at 5 minutes, 1 hour and 1 day after mixing of powder and liquid. Unetched ones comprised the control group and the others were the experimental groups. The surface texture was examined by using scanning electron microscope at 20 kV. (S-2300, Hitachi Co., Japan). The specimens for fracture toughness were fabricated by curing of each glass ionomer cement previously inserted into a metal mold for the single edge notch specimen according to the ASTME399. They were subjected to a three-point bend test after etching for 0, 30, 60, and 90 seconds at 5 minutes-, 1 hour-and 1 day-lapse after the fabrication of the specimens. The plane strain fracture toughness ($K_{IC}$) was determined by three-point bend test which was conducted with cross-head speed of 0.5 mm/min using Instron universal testing machine (Model No. 1122) following seven days storage of the etched specimens under $37^{\circ}C$, 100% humidity condition. Following conclusions were drawn. 1. In unetched control group, crack was present, but the surface was generally smooth. 2. Deterioration of the surface appearance such as serious dissolving of gel matrix and loss of glass particles occured as the etching time was increased beyond 15 s following Immediate etching of chemical curing type of glass ionomer cements. 3. Etching after 1 h, and 1 d reduced surface damage, 15 s, and 30s etch gave rough surface appearance without loss of glass particle of chemical curing type of glass ionomer cements. 4. Light curing type glass ionomer cement was etched by acid, but there was no difference in surface appearances according to various waiting periods. 5. It was found that the value of plane stram fracture toughness of glass ionomer cements was highest in the light curing filling type as $1.79\;MNm^{-1.5}$ followed by the light curing lining type, chemical curing metal reinforced type, chemical curing filling type and chemical curing lining type. 6. The value of plane stram fracture toughness of the chemical curing lining type glass ionomer cement etched after 5 minutes was lower than those of the cement etched after 1 hour or day or unetched (P < 0.05). 7. Light curing glass ionomer cement showed Irregular fractured surface and chemical curing cement showed smooth fractured surface.

• 전자공학회논문지A
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• 제33A권5호
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• pp.108-116
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• 1996

A semiconductor process imulator operated in windows$^{TM}$ environment has been developed. two-dimensional process simulation in personal computer has been enabled due to the improvement of CPU speed and the efficient use of memory. The process simulator in this paper is capable of calculating diffusion, oxidation, ion implantation, etching and deposition in two-dimensional manner. In addition, graphic-user-friendly editor, parser, and multi-dimensional graphical routine is also available in the devloped simulator.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.160-163
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• 2002

Micro via hole Fabrication is studied by means of minimizing method to circuit size as many electric products developed to portable and minimize. Most of currently micro via hole fabrication using laser is that fabricate insulator layer using CO2 Laser after Cu layer by etching, or fabricate insulator layer using IR after trepanning Cu by UV. In this paper, it was performed that a metal layer and insulator layer were worked upon only one UV laser, and increase to processing speed by experiment.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1994년도 하계학술대회 논문집 C
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• pp.1425-1427
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• 1994

Laser ablation of glass substrates (8K-7 and synthetic quartz) using a transversely excited atmospheric (TEA) $CO_2$ laser has been inverstigated to obtain high speed etching. The ablation occurs by local heating of a substrate with a focused TEA-$CO_2$ laser beam. The dependence of ablation rate on pulse count and repetition-rate of laser has been discussed.