• 제목/요약/키워드: etchant

검색결과 226건 처리시간 0.027초

레이저를 이용한 PDP ITO 전극의 직접 패터닝

  • 권상직;김광호;전종록
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2007년도 춘계학술대회
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    • pp.94-98
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    • 2007
  • AC PDP에 사용되는 ITO 전극의 공정시간을 단축시키고 생산성을 향상시키기 위해서 $Nd:YVO_4$ laser(${\lambda}=1064\;nm$)를 사용하여 ITO 전극 패턴을 형성하였다. ITO etchant를 사용하여 ITO 전극 패턴을 형성한 샘플과 비교해서 laser를 사용하여 제작한 샘플은 ITO 라인 가장자리에 shoulder와 물결무늬를 형성했다. Q스위치 $Nd:YVO_4$ laser와 갈바노메트릭 스캐닝 시스템을 사용하여 500 mm/s의 스캔속도와 40 kHz의 펄스 반복 율을 기본조건으로 결정했다. PDP 테스트 샘플을 제작하여 방전 테스트를 진행하였다. 사진식각공정을 이용하여 만든 PDP 샘플과 비교해서 laser를 이용하여 제작한 PDP 샘플의 최소 방전유지전압은 더 높게 측정됐다. 이것은 ITO 라인의 shoulder와 물결무늬의 형성과 관련이 있다고 판단된다. 본 실험을 통해 레이저를 이용한 PDP용 ITO 전극막의 직접 패터닝 가능성을 확인할 수 있었다.

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Development of Multi-Chemical Supply System for Semiconductor Wafer Cleaning Station

  • Chung, Myung-Jin;Song, Young-Wook
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2005년도 ICCAS
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    • pp.1309-1312
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    • 2005
  • A multi-chemical supply system is developed and applied to a wet station, which uses the multi-chemical process in one bath. To control the concentration of two chemicals, control logic of a supply pump is programmed using the programable logic controller (PLC). By using the multi-chemical supply system, wet station with single bath is applied to cleaning process using multi chemicals such as buffed oxide etchant (BOE) and standard clean 1 (SC-1). The concentration of each chemical is measured in the bath to verify the multi-chemical supply system. The control range in the each chemical concentration is measured to 1.33weight% in NH4OH and 0.23weight% in H2O2. The multi-chemical supply system can be movable and usable as an independent module of fixed wet station. By simply midifying the PLC, a multi-chemical supply system can be developed for a wet station.

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SOI 구조를 이용한 실리콘 압저항 가속도계의 설계 및 제작 (Design and Fabrication of a Silicon Piezoresistive Accelerometer using SOI Structure)

  • 양희혁;양상식;한상우
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1993년도 정기총회 및 추계학술대회 논문집 학회본부
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    • pp.192-194
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    • 1993
  • In this paper, a silicon piezoresistive accelerometer of which the cantilevers have uniform thickness is designed and fabricated with SOI wafer. The accelerometer consists of a seismic mass and four cantilevers, and is fabricated mainly by the anisotropic etching method using EPW etchant. The fabrication processes are that of the frontside processes including the etching of the cantilevers and the doubleside alignment holes, the diffusion of the piezoresisters and patterning of the contact windows, and the metal connection process, and that of the backside processes including the etching of the shallow cavity and the seismic mass. Because of the uniformity of thickness, the performance of the accelerometer fabricated with SOI wafer is expected to be better than that of accelerometer fabricated by the time-controlled etching method.

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붕소 식각 정지층을 이용한 두 개의 한 방향 실리콘 미세 밸브의 제작 (Fabrication of Two One-Way Silicon Micro Valves using Boron Etch Stop Layer)

  • 서정덕;양의혁;양상식
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1993년도 정기총회 및 추계학술대회 논문집 학회본부
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    • pp.210-212
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    • 1993
  • In this paper, a silicon microvalve has been fabricated using micromachining technology. The valve consists of the several thin silicon diaphragms which are designed to open and close depending on the pressure difference. It is supposed to pass fluids in only one direction. The thin diaphragms are fabricated by boron etch stop using an anisotropic etchant, EPW. The fabricated valve has been tested for various pneumatic pressure. According to the experimental results, the slit width of the valve increases as the pneumatic pressure increases.

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주름진 박막을 전극으로 한 정전형 미세 구동기의 제작 (Fabrication of an Electrostatic Micro Actuator Using a Corrugated Diaphragm As an Electrode)

  • 김성윤;양의혁;양상식
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1993년도 정기총회 및 추계학술대회 논문집 학회본부
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    • pp.207-209
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    • 1993
  • In this paper, an electrostatic silicon micro actuator has been designed and fabricated using the micro machining technology. The actuator consists of two counter electrodes. One is an Al film deposited on a pyrex glass, and the other is a circular corrugated diaphragm with boron doped. The diaphragm is fabricated by boron etch stop technique using an anisotropic etchant, EPW.

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미세 가공 시스템에서 분무특성이 에칭특성에 미치는 영향에 관한 연구 (A Study on Effect of Spray Characteristics on Etching Characteristics in Micro Fabrication System)

  • 정지원;김덕줄
    • 대한기계학회논문집B
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    • 제28권1호
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    • pp.109-117
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    • 2004
  • The objective of this study is to investigate the effect of the spray characteristics on the etching characteristics for the optimization of etching process in the micro fabrication industry. The etching characteristics such as etching rate and etching factor were investigated under different etching conditions. To compare with the etching characteristic, the spray characteristics such as droplet size and velocity were measured by PDA system. The etching rate was increased in case of high spray pressure and in the region of spray center. The etching factor was increased with decrease in the distance from nozzle tip and increase in the etchant temperature. It was found that the spray characteristics were correlated with the etching characteristics.

레이저습식각을 이용한 용융실리카의 미세구멍가공 (Micro-drilling of Fused Silica by Laser Induced Wet Etching)

  • 백병선;이종길;전병희
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 춘계학술대회
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    • pp.1344-1348
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    • 2003
  • It is generally known to be difficult to etch a surface of a transparent material such as fused silica by conventional laser ablation in which the surface is simply irradiated with a laser beam. A lot of studies have been done to provide a method capable of efficiently etching transparent materials without defects such as cracks. One of the promising methods or the micro-machining of optically transparent materials is laser induced etching. In this study, micro-drilling of fused silica by laser induced wet etching was conducted. KrF excimer and YAG laser were used as light sources. Acetone solution pyrene and ethanol solution of rhodamine were used as etchant.

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Microstructural characteristics in tough pitch copper for revealing the work hardening region

  • Okayasu, Mitsuhiro;Taki, Tatsuya;Takasu, Satoshi;Takeuchi, Shuhei;Shiraishi, Tetsuro
    • Advances in materials Research
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    • 제1권4호
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    • pp.349-359
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    • 2012
  • To reveal localized plastic deformation zones in a tough pitch copper, the etching characteristics of a copper sample have been examined. The etching was carried out on a sample surface using an etchant consisting of 25 ml nitric acid solution and 75 ml water. To clarify the plastic deformation zone, the sample deformed plastically was heated to between $250^{\circ}C$ and $300^{\circ}C$ before the etching process. This is due to a change of the microstructure and crystal orientation in the plastic deformation zone producing recrystallized small grains. In this case, the plastically deformed zone is severely etched, whereas the undeformed zone is only slightly etched. Identification of the details of the deformation zone from the etching is further discussed.

V형 홈 형성에 의한 $N^+P$ 접합형 태양전지의 효율 개선 (Efficiency Improvement of $N^+P$ Junction Solar Cell by Forming V-Groove on the Silicon Surface)

  • 채상훈;김재창;이양성
    • 대한전자공학회논문지
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    • 제21권1호
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    • pp.45-50
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    • 1984
  • 결정면이 (100)인 실리콘 웨이퍼 위에 열확산(thermal diffusion)법을 이용하여 표면에 V형 흠이 형성된 N+P 태양전지를 제작하였다. (100) 실리콘 표면에 V형 홈을 형성시키기 위하여 이방성 부식용액으로는 etylendiamine, water, pyrocathecol 혼합용액을 사용하였다. 100mW/㎠의 조명아래에서 V형홈을 형성시킨 태양전지가 효율면에서 일반 평면 N+P 태양전지보다는 2.5∼3.5%, texturized 태양전지보다는 0.4∼0.6%정도의 증가를 보였다.

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희생층을 이용한 은 나노와이어 패터닝 공정 개발 (Development of Ag Nanowire Patterning Process Using Sacrificial Layer)

  • 하본희;조성진
    • 한국전기전자재료학회논문지
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    • 제29권7호
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    • pp.435-439
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    • 2016
  • We developed a Ag nanowire patterning technique using a water-soluble sacrificial layer. To form a water-soluble sacrificial layer, germanium was deposited on the substrate and then water-soluble germanium oxide was simply formed by thermal oxidation of germanium using a conventional furnace. The formation of Ag nanowire patterns with various line and space arrangements was successfully demonstrated using this patterning process. The main advantage of this patterning technique is that it does not use a strong acid etchant, thereby preventing damage to the Ag nanowire during the patterning process.