• 접착 및 계면
• /
• 제12권4호
• /
• pp.138-143
• /
• 2011

특수한 방향족 화합물인 biphenylene 성분이 도입된 novolac 유도체를 기본 골격으로 하는 에폭시 수지 경화물은 난연제의 도움 없이도 자기소화성을 발현하며, 최근에 친환경 EMC (Epoxy Molding Compound) 소재로 상용화되고 있다. 본 연구에서는 이들을 골격으로 하는 에폭시수지와 경화제로 이루어진 경화물을 제조하여 DSC, DMA, TMA, TGA로부터 phenol 유도체의 분자구조와 반응성, 열팽창성, 탄성율 및 열분해성 등을 검토하였다. 주제와 경화제의 골격구조로 biphenyl novolac 구조가 모두 함유할 때 저팽창성, 기계적 성능 및 연소지연성 등이 우수하게 나타났다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제53권6호
• /
• pp.293-299
• /
• 2004

In this paper, thermal and mechanical properties of electric epoxy with water aging were discussed. We made elastic epoxy specimen adding a ratio of 0〔phr〕20〔phr〕, 35〔phr〕 and 53〔phr〕 with modifier to existing epoxy. We studied mechanical property of elastic resin after absorption in water from 0 to 484 hours. As a result, diffusion factor of elastic epoxy showed 20-21${\times}$10$^{-4}$ $\textrm{mm}^2$/s and general epoxy showed 9.5${\times}$10$^{-4}$ $\textrm{mm}^2$/s. Elastic property increased linearly according to addiction and decreased according to water absorption. Tensile strength was reduced according to addition. It was affected by water absorption of micro-void of elastic epoxy. Hardness inclined to decrease after increasing according to absorbed time. In water-absorption state, it was experimented a change of heat flow by temperature of elastic epoxy and change of thermal expansion coefficient. DSC (Differential Scanning Calorimetry) and TMA (Thermomechanical Analysis) equipments were used to measure Tg. A temperature ringe of DSC was from -0($^{\circ}C$) to 200($^{\circ}C$). One of TMA was from -0($^{\circ}C$) to 350($^{\circ}C$). In addition, we investigated structural analysis of water absorbed specimen using SEM (Scanning Electron Microscope).

• 전기학회논문지
• /
• 제67권9호
• /
• pp.1181-1188
• /
• 2018

In order to develop new insulating materials for GIS Spacer using environmentally friendly insulating gas, three kinds of dispersed liquid nano composites of solid epoxy /nano layered silicate filled material were prepared. And the epoxy/nano/micro silica composite was prepared by mixing epoxy/nano 3 phr dispersion/4 kinds of filler contents(40,50,60, 70wt%). The electrical insulation breakdown strengths of the nano and nano/micro mixed composites were evaluated by using 8 kinds of samples including the original epoxy. The mechanical tensile strength of the epoxy / nano / micro silica composite were evaluated, also. The TEM was measured to evaluate the internal structure of nano/micro composites. As a result, it was confirmed that the layered silicate nano particles was exfoliated through the process of inserting epoxy resin between silicate layers and the layers. In addition, dispersion of nano / micro silica resulted in improvement of electrical insulation breakdown strength with increase of filling amount of dense tissue with nanoparticles inserted between microparticles. In addition, the tensile strength showed a similar tendency, and as the content of microsilica filler increased, the mechanical improvement was further increased.

• Corrosion Science and Technology
• /
• 제2권4호
• /
• pp.202-206
• /
• 2003

Fusion Bonded Epoxy(FBE) systems have been widely used to protect pipelines for over 30 years. Numerous attempts have so far been made to improve the properties of FBE coatings such as chemical resistance, adhesion, water resistance, cathodic disbondment resistance, impact resistance, and flexibility to protect pipelines at a wet and a high temperature condition. But these attempts have not been successful in reducing some weakness, for instance, in pipeline operating at high temperature due to poor hot water resistance and cathodic protection. The purpose here is to build a basis for getting better corrosion resistance of FBE systems. Cresol-novolac epoxy coating systems were studied compared to bisphenol A type epoxy systems. After the immersion of the film in water at a high temperature for a long period, good adhesion to metal substrate and excellent cathodic disbond resistance were observed in the cresol-novolac epoxy resin systems. It is well known that the adhesion of organic coatings to metal substrate might be decreased due to the disruption of a chemical bond across the film and metal interface induced by water molecules. A high crosslinking density might decrease water permeability and improve cathodic disbonding protection in the coatings. Other factors are studied to understand anti-corrosion mechanism of Cresol-novolac epoxy coatings. In addition, the water absorption rate and the effect of cure temperature on the adhesion and cathodic disbonding resistance ofthe films were studied in different epoxy coatings and the effect of substrate was evaluated. The results of field application are proved that the Cresol-novolac epoxy coating system developed recently is one of the most suitable coatings for protection of pipelines.

• 폴리머
• /
• 제35권1호
• /
• pp.47-51
• /
• 2011

본 연구는 에폭시의 난연 특성을 향상시키기 위하여 친환경, 저가, 고종횡비(high aspect ratio)를 갖는 무기계 난연첨가재인 일라이트를 사용하였고, 친수성 일라이트의 소수성 에폭시 내 분산 문제점을 개선하기 위하여 불소화 반응을 이용하여 인의 소수화 개질을 실시하였다. 일라이트의 불소화 개질에 의하여 경화 전 에폭시 용액 내에서 일라이트의 분산성 및 경화 후 형성된 복합체 내에서의 일라이트 분산성도 향상되었다. 이러한 분산성의 향상은 일라이트 불소화 개질로 인하여 소수화된 일라이트의 에폭시 용액에 대한 친화성 향상과 복합체 형성 시 에폭시 고분자의 일라이트 층간 삽입 혹은 에폭시에 의한 일라이트의 박리현상 등에 의하여 나타난 현상으로 판단된다. 따라서, 한계 산소 지수(limited oxygen index, LOI)는 일라이트의 불소화 영향으로 에폭시만의 값에 비해 약 24% 정도 증가한 것으로 보아 불소화 일라이트/에폭시 복합제의 제조로 에폭시의 난연 특성을 향상시킬 수 있음을 알 수 있었다.

• Transactions on Electrical and Electronic Materials
• /
• 제17권3호
• /
• pp.155-158
• /
• 2016

The effect of microsilica content modified with silicone-modified epoxy on electrical and mechanical properties of cycloaliphatic epoxy/microsilica system was investigated. The cycloaliphatic epoxy resin was diglycidyl 1,2-cyclohexanedicarboxylate and curing agent was an anhydride. Surface of microsilica was modified with silicone-modified epoxy. Electrical breakdown strength, the most important property for electrical insulation materials was tested. Tensile and flexural tests were also performed using universal testing machine (UTM). The microcomposite with 60 wt% microsilica shows maximum values in electrical breakdown strength.

• 한국염색가공학회지
• /
• 제11권6호
• /
• pp.7-17
• /
• 1999

Aminophosphazene derivatives were prepared from hexachlorocyclotriphosphazene and used for the curing agents of epoxy resins. The effect of the curing agent on the dynamic viscoelastic properties, flame proofing, and heat resistance of the cured epoxy resins were investigated and compared with those for the epoxy resins cured with aliphatic and aromatic amines. The epoxy resin cured by 1,1-diamino-3,3,5,5-tetrachlorocyclotriphosphazene showed the highest storage modulus and glass transition temperature when cured at 19$0^{\circ}C$ for 6 hours. The epoxy resins cured with phosphazene derivatives showed superior flame proofing to those with aliphatic amine and aromatic amine. Particularly it is an effective curing agent for epoxy resins to enhance the storage modulus, flame proofing and resistance to heat.

• 한국염색가공학회지
• /
• 제13권3호
• /
• pp.188-196
• /
• 2001

1, 1-diamino-3, 3, 5, 5-tetrachlorocyclotriphosphazene, 1, 1-diami-no3, 3, 5, 5-tetra-(p-bromophenoxy)cyclotriphosphazene, and 1, 1-diamino-3, 3, 5, 5-tetra-(p-chlorophenoxy) cyclotri-phosphazene(ACPP) was prepared from hexachlorocyclotriphosphazene and used for the curing agent of bisphenol A type epoxy resin and phenol novolak. The resistance to chemicals and water of the cured epoxy resins were examined by DMTA and compared with those of the epoxy rosins cured with phosphazene derivatives and 4, 4'-diaminodiphenylmethane. The effect of the curing agent on resistance to chemicals and water of the cured epoxy resins were investigated. The epoxy resins cured with 1, 1-diamino-3, 3, 5, 5-tetrachlorocyclotriphosphazene and 1, 1- diamino-3, 3, 5, 5-tetra- (p-bromophenoxy)cyclotriphosphazene showed superior resistance to chemicals and water to those of 1, 1-diamino-3, 3, 5, 5-tetra- (p-chlorophenoxy)cyclotriphosphazene and 4, 4'-diaminodiphenylmethane. It is an effective curing agent for epoxy resins to enhance the resistance to chemicals, water and tome proofing.

• 한국정밀공학회지
• /
• 제29권1호
• /
• pp.109-113
• /
• 2012

The LED failure rate greatly depends on the physical properties of packaging materials (epoxy). The glass transitions temperature (Tg) of the epoxy is one of the most important physical properties. Therefore, in the present study, various epoxies with high Tg were prepared and their failure shapes were analyzed. In addition, the failure shapes depending on the amount of epoxy and the wire bonding structure were measured. As a consequence, the lower failure rate was obtained with the smaller amount of epoxy. The safety of LED was improved with increasing the Tg of the epoxy.

• Transactions on Electrical and Electronic Materials
• /
• 제14권1호
• /
• pp.43-46
• /
• 2013

In order to develop electrical insulation material, organically modified layered silicate was incorporated into an epoxy matrix to prepare nanocomposite. Transmission electron microscopy (TEM) observation showed that organophillic clay was in an exfoliated state, while hydrophilic clay was not dispersed into nanolayers within the epoxy matrix. Epoxy/organophilic clay (2.8 wt%) nanocomposite was mixed and cured at $150^{\circ}C$ for 4.5 hr. I-V characteristics, volume resistance and dielectric properties for the cured nanocomposite were estimated. Current density increased with increasing temperature, and volume resistance decreased with increasing temperature, in neat epoxy and epoxy/organophilic clay (2.8 wt%) nanocomposite. As frequency increased, the dielectric loss value decreased in the two systems.