• Corrosion Science and Technology
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• v.5 no.3
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• pp.99-105
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• 2006

This paper is to investigate feasibility on quantitative aging state of epoxy coating on concrete wall in containment structure under operation of nuclear power plants. For evaluating the physical characteristics of the epoxy coating, adhesion strengths of two kinds of degraded epoxy coating systems on both steel surfaces and concrete surfaces were measured via accelerated aging. Comparatively impedance data taken by ultrasonic test were also taken to relate with adhesion data. After aging, in case of concrete, from half of specimens, aging of epoxy coating was developed. As for steel, on $4^{th}$ inspection day, adhesion force was failed. To improve reliability on quality degradation of epoxy, relationship between adhesion and impedance was analyzed. By tracing to co-respond to these data, it was possible to Fig. out physical state of as-built epoxy coating. The possibility to develop new methodology of time - dependent aging state on epoxy coating was found and discussed.

• Elastomers and Composites
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• v.57 no.2
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• pp.48-54
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• 2022

A polymeric adhesion promoter was synthesized to improve the adhesive strength of the Ni lead frame/epoxy composite. Poly(itaconic acid-co-acrylamide) (IAcAAM) was prepared by copolymerizing itaconic acid and acrylamide. We compared the adhesive strength between the Ni lead frame and epoxy composite according to the molecular weight of IAcAAM. The molecular weight of IAcAAM was controlled using an initiator, which made it possible to use IAcAAM in the epoxy molding compound (EMC) manufacturing process by modulating the melting temperature. The adhesive strength of Ni lead frame/epoxy composite increased with the addition of IAcAAM to the epoxy composite. In addition, as the molecular weight of IAcAAM increased, the adhesive strength of the Ni lead frame/epoxy composite slightly increased. We confirmed that IAcAAM with an appropriate molecular weight can be used in the EMC manufacturing process and increase the adhesive strength of the Ni lead frame/epoxy composite.

• Coupled systems mechanics
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• v.5 no.4
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• pp.355-369
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• 2016

Changes in chemical structure have profound effects on the physical properties of epoxy-based materials, and eventually affect the durability of the entire system. Microscopic structural voids generally existing in the epoxy cross-linked networks have a detrimental influence on the epoxy mechanical properties, but the relation remains elusive, which is hindered by the complex structure of epoxy-based materials. In this paper, we investigate the effect of structural voids on the epoxy-based materials by using our developed mesoscale model equipped with the concept of multiscale modeling, and SU-8 photoresist is used as a representative of epoxy-based materials. Developed from the results of full atomistic simulations, the mesoscopic model is validated against experimental measurements, which is suitable to describe the elastic deformation of epoxy-based materials over several orders of magnitude in time- and length scales. After that, a certain quantity of the structure voids is incorporated in the mesoscale model. It is found that the existence of structural voids reduces the tensile stiffness of the mesoscale epoxy network, when compared with the case without any voids in the model. In addition, it is noticed that a certain number of the structural voids have an insignificant effect on the epoxy elastic properties, and the mesoscale model containing structural voids is close to those found in real systems.

• Journal of the Korean Applied Science and Technology
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• v.27 no.3
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• pp.325-336
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• 2010

In this study, we experimented that how to synthesis waterborne urethane-epoxy hybrid resin for leather garment coatings. First of all, We had analyzed datas by FT-IR, SEM and TGA for the machanical properties. By instruments analysis measurement we confirmed that synthesis of urethane and epoxy. In this experiment we knew that polyurethane and urethane-epoxy hybrid resin have 4~5 grades of solvent resistance. Tensile strength measured in the urethane-epoxy resin(epoxy 12%, 2.033$kg_f/mm^2$) had the most strong strength than polyurethane(1.833 $kg_f/mm^2$) emulsion samples. Also urethane-epoxy hybrid resin had better result than polyurethane in acid resistance and abrasion test. As hight proportion of epoxy in hybid resin, we obtained low elongation and low flexibility. In this result, the mechanical properties of waterborne polyurethane-epoxy hybrid resin showed that how effect in leather coating by ratio of epoxy emulsion.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2019.11a
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• pp.31-32
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• 2019

In this study, oxidized graphene nanoplatelet(GO) was prepared by oxidizing graphene nanoplatelet(GNP) with nitric acid in order to solve the problem of dispersion of GNP, one of nano materials. GNP/Epoxy and GO/Epoxy paint were prepared by mixing GNP, GO with 0.1, 0.3, 0.5 and 1.0 wt.% in epoxy paint and the mechanical properties were evaluated. As a result, GNP/Epoxy and GO/Epoxy paints showed better mechanical properties than Neat Epoxy which did not incorporate GNP, GO. Especially, when 0.3 wt.% of GO was incorporated into epoxy resin, it showed higher tensile strength than Neat Epoxy. It was confirmed that acid treatment of GNP was effective in improving the mechanical properties of epoxy paint. However, graphene material was found that it was not effective in improving the bond performance of the epoxy paint.

• Transactions on Electrical and Electronic Materials
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• v.13 no.3
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• pp.116-120
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• 2012

In this paper, ZnO-Epoxy nanocomposites (NEP) were prepared and epoxy composites that contain 5 wt% micro ZnO (MEP) and deliberately not well dispersed nano ZnO (NDNEP) were also prepared for purpose of comparison. The effects of the particle size and dispersion of ZnO on dielectric properties of epoxy resin were chiefly studied. Test results showed that: at a loading of 5 wt%, the three epoxy composites seem to have no significant difference on resistivity compared to epoxy resin; Dielectric constants of all the epoxy composites are also basically the same but they are bigger compared to that of the pure epoxy resin (unfilled); Dielectric dissipation factors ($tan{\delta}$) of NDNEP is greater than that of NEP and MEP. NEP has the minimum dielectric loss factor, whereas dielectric loss factors of the three epoxy composites are larger than that of the pure epoxy resin. The decreasing order of electrical breakdown strength for the three epoxy composites and for the pure epoxy resin is as follows: NEP>MEP>NDNEP>EP. Finally, in order to explain the experimental results the aggregation interface phase was proposed. Furthermore, addition of well dispersed nano filler has proved to have a positive effect on the improvement of the dielectric properties of epoxy resin.

• Conservation Science in Museum
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• v.26
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• pp.1-12
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• 2021

The bisphenol A epoxy resin currently used for the conservation of stone cultural heritage items is known to suffer from yellowing discoloration. In order to mitigate this yellowing and explore the availability of more diverse materials for the conservation of stone cultural heritage items, a hydrogenated Bisphenol A-based epoxy resin was prepared and compared with the epoxy resin currently used in the conservation treatment of stone cultural heritage items. The newly prepared epoxy resin showed improved physical properties relative to the existing materials, especially in terms of tensile strength, adhesion, and machinability, while the yellowing discoloration was reduced by a factor of roughly five to eight. The results suggest that epoxy resin could be used as a stable material for the conservation treatment of stone cultural heritage items, most of which are located outdoors.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.

• Journal of Adhesion and Interface
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• v.16 no.1
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• pp.22-28
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• 2015

In this study, Waterborne polyurethanes (WPU) using Epoxy group were synthesized with polyester polyol, epoxy resin, 4,4-dicyclohexylmethane diisocyanate ($H_{12}MDI$), dimethylol propionic acid (DMPA) to improve the hydrolysis resistance and adhesion. In addition, the properties of the synthesized waterborne polyurethane was evaluated through DSC, UTM, adhesion strength. Tg of the synthesized waterborne polyurethane is shown in the vicinity of $-50^{\circ}C$. Tg were increased with as epoxy resin contents increased. The tensile strength was increased as the content of epoxy resin increases, elongation was decreased. Optimum adhesion and hydrolysis-resistance strength were obtained when polyol : epoxy ratio was 99 : 1.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.1
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• pp.6-12
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• 2019

Bonding properties of epoxy-containing solder joints were investigated by a high temperature aging test. Specimens were prepared by bonding an R3216 standard chip resistor to an OSP-finished PCB by a reflow process with two basic types of solder (SAC305 & Sn58Bi) pastes and two epoxy-solder (SAC305+epoxy & Sn58Bi+epoxy) pastes. In all epoxy solder joints, an epoxy fillet was formed in the hardened epoxy, lying around the outer edge of the solder joint, between the chip and the Cu pad. In order to analyze the bonding characteristics of solder joints at high temperatures, a high-temperature aging test at $150^{\circ}C$ was carried out for 14 days (336 h). After aging, the intermetallic compound $Cu_6Sn_5$ was found to have formed in the solder joint on the Cu pad, and the shear stress on the conventional solder joint was reduced by a significant amount. The reason that the shear force did not decrease much, even though in epoxy solder, was thatbecause epoxy hardened at the outer edge of the supported solder joints. Using epoxy solder, strong bonding behavior can be ensured due to this resistance to shear force, even in metallurgical changes such as those where intermetallic compounds form at solder joints.