• Corrosion Science and Technology
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• v.7 no.6
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• pp.344-349
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• 2008

Epoxy coatings were prepared to give a different corrosion protection by reacting it with two different kinds of curing agent, and then effects of the curing agents on the structure, surface hydrophobic tendency, water transport behavior and hence corrosion protection of epoxy coatings were examined using hygrothermal cyclic test, and impedance analysis. In the results of EIS, the corrosion protection of epoxy coating cured by polyamide shows better than epoxy coating cured by polyamide epoxy adduct. It was well agreed with its water transport behavior and hydrophobic tendency.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2003.05a
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• pp.262-268
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• 2003

Organic coatings are widely used to control the corrosion of steel structure. The water in coatings may cause swelling or solvation of coatings, leading to the degradation of coatings. In addition, water affects the permeation of oxygen and other corrosive agents, and consequently the presence of such substances at coating-metal interface promotes corrosion of metal substrate. In this study, the anticorrosive properties of 4 types of coating, such as epoxy-epoxy, epoxy-urethane, urethane-epoxy, urethane-urethane, were evaluated. The evaluation tests were carried out under cyclic water-absorption/desorption conditions, consisting of alternative exposure to diluted 0.001M-LiCl($a_{1120}{\fallingdotseq}1$) and concentrated l0M-LiCl($a_{1120}{\fallingdotseq}0.05$). The anticorrosive performances of coatings were found to decrease in the order of urethane-urethane> urethane-epoxy> epoxy-epoxy coating.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.2
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• pp.219-227
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• 2013

This paper reported a study on the thermal, mechanical and electrical insulation properties of epoxy/mica composites. To investigate the effect of mica content, glass transition temperature, mechanical properties such as tensile and flexural strength, and insulation breakdown properties for epoxy composites with various contents of mica. The effect of insulation thickness on insulation breakdown property was also studied. It was observed that tensile and flexural strength decreased with increasing mica content, while elastic modulus increased as the mica content increased. AC insulation breakdown strength for all epoxy/mica composites was higher than that of neat epoxy and that of the system with 20 wt% mica was 14.4% improved. As was expected, insulation breakdown strength at $30^{\circ}C$ was far higher than that at $130^{\circ}C$, and it was also found that insulation breakdown strength was inversely proportion to insulation thickness.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.7
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• pp.1218-1224
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• 2016

This paper presents the results of a study on the effect of surface modified alumina nanocomposites on electrical tree growth in epoxy insulation. Treeing experiments were conducted at a fixde AC voltage (500kV/mm, 10kV/60Hz)on unfilled epoxy sample as well as epoxy nanocomposites of 4 types with different loading and surface modified GDE gram. Time for tree growth as well as tree propagation length were studied. The results show that there is a significant improvement tree propagation time compare unfilled epoxy to epoxy nano alumina composites. Different tree propagation shapes as well as slower tree growth with 4 types nano alumina composites were observed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.9
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• pp.565-570
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• 2016

In this work, the complex permittivity of epoxy resins is measured. Epoxy resins, epoxy with micro size fillers and epoxy with micro+nano alumina composites have been evaluated for dielectric properties according to frequency variation. The dielectric spectroscopy measurement and analyses are carried out in the frequency range of $10^{-2}Hz$ to 1MHz and constant to room temperature. The results of dielectric loss suggest that significant improvement in the electrical performance can be expected by using samples containing nano and micro fillers mixture when compared to materials containing only microfillers. As the result, we verified the specific characteristics of dielectric permittivity and dielectric loss namely, relative permittivity become low with improving dispersibility of nano+micro mixture composites and become rise with agglomerate of nano particles.

• Journal of Welding and Joining
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• v.18 no.2
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• pp.222-222
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)

• Journal of Welding and Joining
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• v.18 no.2
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• pp.95-99
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB banking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB banking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate.

• Progress in Superconductivity and Cryogenics
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• v.8 no.4
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• pp.26-29
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• 2006

The study to be presented related on initial behavior of quench concerned with many considerations, such as epoxy impregnated coil, critical current density related on strain and temperature, winding effect and behavior of internal superconducting wire. Especially, the deformation behavior of coils under magnetic field and thermal contractions at cryogenic temperatures to be dealt with the analytical method related on Fracture Mechanics. From the results, we know that the strain by self weight contribute to epoxy cracking at the edge of deformed coils and the deformation behavior relate on epoxy cracking must be dealt with biaxial loading problem. Then, the epoxy crack on $r\theta-plane$ under biaxial loading have been propagated with inclined crack angle and joined superconducting wire. Also, we can explain transfer of epoxy crack propagation energy from epoxy resin to superconducting wire.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.09a
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• pp.47-51
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• 2001

The electrical degradation phenomena of epoxy composites to be used as a molding material for transformers were studied. The electrets were first manufactured by applying high voltages to five kinds of specimens given a mixing rate, and then TSC(Thermally Stimulated Current) values at the temperature range of $-160\sim200[^{\circ}C]$ were measured from a series of experiments. The behaviour of carrier and its origin in epoxy composites were examined, respectively, And various effects of electrical degradation on epoxy composites were also discussed in this study.

• Proceedings of the KIEE Conference
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• 1990.07a
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• pp.275-278
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• 1990

This study investigated electrical characteristics of solid and liquid epoxy rosins by measuring dielectric breakdown and dielectric loss when epoxy resins were exposed to a mixing cure, i.e., Fusion Blend Method. It was found that mixing epoxy resins were superior to dielectric breakdown and has shorter curing time compare with those of pure liquid epoxy resins.