• 제목, 요약, 키워드: epoxy

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Flexural behavior of carbon nanotube-modified epoxy/basalt composites

  • Kim, Man-Tae;Rhee, Kyong-Yop
    • Carbon letters
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    • v.12 no.3
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    • pp.177-179
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    • 2011
  • The use of carbon nanotubes (CNTs) as a reinforcing material in a polymer matrix has increased in various industries. In this study, the flexural behavior of CNT-modified epoxy/basalt (CNT/epoxy/basalt) composites is investigated. The effects of CNT modification with silane on the flexural properties of CNT/epoxy/basalt composites were also examined. Flexural tests were performed using epoxy/basalt, oxidized CNT/epoxy/basalt, and silanized CNT/epoxy/basalt multi-scale composites. After the flexural tests, the fracture surfaces of the specimens were examined via scanning electron microscopy (SEM) to investigate the fracture mechanisms of the CNT/epoxy/basalt multi-scale composites with respect to the CNT modification process. The flexural properties of the epoxy/basalt composites were improved by the addition of CNTs. The flexural modulus and strength of the silane-treated CNT/epoxy/basalt multi-scale composites increased by approximately 54% and 34%, respectively, compared to those of epoxy/basalt composites. A SEM examination of the fracture surfaces revealed that the improvement in the flexural properties of the silane-treated CNT/epoxy/basalt multi-scale composites could be attributed to the improved dispersion of the CNTs in the epoxy.

첨가제 사용에 의한 Epoxy Resin 용액의 인화점 측정 (Measurement of Flash Points of Epoxy Resin Solutions by Using Additives)

  • 하동명
    • 한국안전학회지
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    • v.22 no.3
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    • pp.22-27
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    • 2007
  • The knowledge of the flash point of the various liquid substances is required because of process safety and control in industrial fire protection. The epoxy resin is one of versatile resins that has wide selection of using curing agents and additives to achieve various applications such as coatings, adhesives, interior materials, reinforced plastics and electrical insulation. In this study, the lower flash points for p-xylene+epoxy resin, o-xylene+epoxy resin and n-butanol+epoxy resin systems were measured by using Pensky-Martens closed cup tester. The lower flash points for p-xylene+epoxy resin, o-xylene+epoxy resin and n-butanol+epoxy resin systems rapidly increased 80wt%, 90wt% and 95wt% of epoxy resin concentration, respectively. This results serve as a guide to estimate flash point of any epoxy resin solution.

WLP(Wafer Level Package)적용을 위한 SEMC(Sheet Epoxy Molding Compounds)용 Naphthalene Type Epoxy 수지의 경화특성연구 (Cure Characteristics of Naphthalene Type Epoxy Resins for SEMC (Sheet Epoxy Molding Compound) for WLP (Wafer Level Package) Application)

  • 김환건
    • 반도체디스플레이기술학회지
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    • v.19 no.1
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    • pp.29-35
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    • 2020
  • The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

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Effects of Reactive Diluents on the Electrical Insulation Breakdown Strength and Mechanical Properties in an Epoxy System

  • Park, Jae-Jun
    • Transactions on Electrical and Electronic Materials
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    • v.14 no.4
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    • pp.199-202
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    • 2013
  • In order to study the effect of reactive diluents on the electrical insulation breakdown strength and mechanical properties of, a polyglycol and an aliphatic epoxy were individually introduced to an epoxy system. Reactive diluents were used in order to decrease the viscosity of the epoxy system; polyglycol acted as a flexibilizer and 1,4-butanediol diglycidyl ether (BDGE) acted as an aliphatic epoxy, which then acted as a chain extender after curing reaction. The ac electrical breakdown strength was estimated in sphere-to-sphere electrodes and the electrical breakdown strength was estimated by Weibull statistical analysis. The scale parameters of the electrical breakdown strengths for the epoxy resin, epoxy-polyglycol, and epoxy-BDGE were 45.0, 46.2, and 45.1 kV/mm, respectively. The flexural and tensile strengths for epoxy-BDGE were lower than those of the epoxy resin and those for epoxy-polyglycol were lower than those of the epoxy resin.

CTBN/PU/Epoxy의 파괴인성에서 폴리우레탄의 영향 (Effect of Polyurethane on Fracture Toughness in CTBN/PU/Epoxy)

  • 김종석;홍석표
    • 공업화학
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    • v.9 no.2
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    • pp.172-176
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    • 1998
  • 에폭시 adduct carboxyl terminated butadiene acrylonitrile(CTBN)은 CTBN과 에폭시수지를 블렌딩하여 제조하였다. CTBN과 폴리우레탄(PU) 및 에폭시수지로 CTBN/PU/epoxy를 제조하였다. CTBN이 5 wt%에서 CTBN/PU/Epoxy는 PU의 함량이 증가할 수록 damping 피크가 이동하였다. PU의 함량이 증가할수록 상용성이 증가함을 의미한다. 그러나 CTBN의 함량이 증가함에 따라 상용성은 감소하였다. CTBN/PU/epoxy에서는 PU의 함량이 10wt%에서 최대 굴곡값을 나타냈으나, PU 함량이 증가할수록 감소하였다. CTBN/epoxy에서 PU를 첨가함에 따라 파괴인성은 증가하였다. 파괴단면에서 전단변형과 공동화에 의한 응력백화현상을 보였다. CTBN의 공동화와 PU를 도입한 에폭시 매트릭스의 전단변형이 CTBN/PU/epoxy의 강인화기구이다.

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새로운 반도체 Packaging용 Ethoxysilyl Bisphenol A Type Epoxy Resin System의 경화특성 연구 (Cure Characteristics of Ethoxysilyl Bisphenol A Type Epoxy Resin Systems for Next Generation Semiconductor Packaging Materials)

  • 김환건
    • 반도체디스플레이기술학회지
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    • v.16 no.2
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    • pp.19-26
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    • 2017
  • The cure properties of ethoxysilyl bisphenol A type epoxy resin (Ethoxysilyl-DGEBA) systems with different hardeners were investigated, comparing with DGEBA and Diallyl-DGEBA epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The Ethoxysilyl-DGEBA epoxy resin system showed lower cure conversion rates than DGEBA and Diallyl-DGEBA epoxy resin systems. The conversion rates of these epoxy resin systems with DDM hardener are lower than those with HF-1M hardener. It can be considered that the optimum hardener for Ethoxysilyl-DGEBA epoxy resin system is Phenol Novolac type. These lower cure conversion rates in the Ethoxysilyl-DGEBA epoxy resin systems could be explained by the retardation of reaction molecule movements according to the formation of organic-inorganic hybrid network structure by epoxy and ethoxysilyl group in Ethoxysilyl- DGEBA epoxy resin system.

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각종 양생조건에 따른 비스페놀 A형 에폭시수지 혼입 모르타르의 강도성상 (Strength Properties of Bisphenol A-Type Epoxy-Modified Mortars under Various Curing Conditions)

  • 김완기
    • 한국건축시공학회:학술대회논문집
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    • pp.55-59
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    • 2009
  • The epoxy resin without hardener can harden by a ring-opening reaction in the presence of the alkalies produced by the hydration of cement in epoxy-modified mortars and concretes. This paper investigates the effect of curing conditions on the strength improvement of polymer-modified mortars using bisphenol A-type epoxy resin without hardener. The polymer-modified mortars using epoxy resin are prepared with various polymer-cement ratios, and subjected to ideal, water, dry and heat cures. In the heat cure, the epoxy-modified mortars are sealed or unsealed with a PVDC (polyvinylidene chloride) film. The epoxy-modified mortars are tested for flexural and compressive strengths at desired curing methods. The microstructures of the epoxy-modified mortars are also observed by scanning electron microscope. The effects of curing conditions on the strength development of the epoxy-modified mortars are examined. From the test results, the marked effectiveness of the heat cure under the PVDC film sealing against the development of the strength of the epoxy-modified mortar without the hardener is recognized. The flexural and compressive strengths of 7-day-90℃ heat-cured, PVDC film-sealed epoxy-modified mortars without hardener reach 7 to 17MPa and 24 to 44MPa respectively, and are two to three times of Unmodified mortar. Such high strength development of the epoxy-modified mortars may be achieved by the dense microstructure formation by cement hydrates and the hardening of the epoxy resin in the mortars.

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The effect of chemical surface treatment on the fracture toughness of microfibrillated cellulose reinforced epoxy composites

  • Yeo, Jun-Seok;Kim, Oh Young;Hwang, Seok-Ho
    • Journal of Industrial and Engineering Chemistry
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    • v.45
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    • pp.301-306
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    • 2017
  • We conducted the surface modification of a microfibrillated cellulose (MFC) as a reinforcing filler of epoxy resin with triethoxy(3-glycidylpropyl)silane (GPS) to increase the mechanical properties of epoxy composite. The chemical modification for the surface of pristine MFCs was confirmed by FT-IR and SEM/EDX. Two different epoxy composite series were prepared using the pristine MFCs and GPS-modified MFCs (GPS-MFCs) to investigate the mechanical properties and fracture toughness of the epoxy composites according to the cellulosic filler contents. The tensile and impact properties of the epoxy composites showed the better performance of GPS-MFC/epoxy composites than of the pristine MFC/epoxy composites. The results of the critical stress intensity factor ($K_{IC}$) and the critical strain energy release rate ($G_{IC}$) show the improved interfacial adhesion between epoxy matrix and cellulosic filler in the GPS-MFC/epoxy composites, and their enhanced fracture toughness.

산화 그래핀 나노플레이트릿을 강화제로 사용한 에폭시 도료의 역학적 특성 (Mechanical Properties of Epoxy Paint using Oxidized Graphene Nanoplatelet as a Reinforcement)

  • 서원우;김규용;윤민호;이보경;남정수
    • 한국건축시공학회지
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    • v.17 no.5
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    • pp.465-471
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    • 2017
  • 본 연구에서는 그래핀 나노플레이트릿(Graphene nanoplatelet ; GNP)의 분산에 대한 문제를 해결하고자 질산으로 이를 산화시켜 GO를 제조하였다. 이렇게 제조한 GO를 에폭시 도료에 혼입하기 전, 푸리에변환적외선분광법(Fourier transform infrared spectroscopy; FT-IR)을 이용한 화학조성 분석과 용매에서의 분산안정성을 확인하였다. 그 후, GNP, GO를 에폭시 도료에 0.1, 0.3, 0.5, 1.0wt.% 혼입하여 GNP/Epoxy, GO/Epoxy 도료를 제조하고 역학적 특성을 평가하였다. 실험 결과, FT-IR 분석을 통해 GO에서 하이드록시기, 에폭시기, 카르복시기 기능기가 생성된 것을 확인할 수 있었다. 또한, GO는 GNP보다 증류수와 에탄올에서 분산안정성이 향상되는 것을 확인하였다. 한편, GO/Epoxy 도료는 Neat Epoxy, GNP/Epoxy에 비해 역학적 특성이 향상되었으며, 특히 0.3wt.% 혼입률에서 높은 역학적 특성을 나타내었다. 따라서 GO를 에폭시 수지에 강화제로써 혼입할 경우 에폭시 도료의 역학적 특성을 향상시키는데 효과적인 것으로 판단된다.