• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1896-1901
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• 2008

Single crystalline copper nanowires are subjected to bending tests using molecular dynamics simulations and the embedded atom method. To observe behaviors of nanowire, bending tests are performed for various rates of deflection and different boundary conditions: fixed-free and fixed-fixed. When the deflection of nanowire becomes large, twinnings and dislocations appear, and <100> crystal structure transforms to <110>. At high rates, phase transformation occurs in whole nanowire. But, at low rates, atomic structure changes to <110> phase partially. The final deformed structures are affected by the rate of deflection and boundary conditions. These effects can be important design parameters at nanoscale.

• 한국태양에너지학회 논문집
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• 제28권3호
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• pp.21-26
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• 2008

Solar cells are renewable energy source which is not only environmentally friendly but also economically viable. For that matter, thin film materials are in observed with great in terest by a number of sources throughout the nations. Among these, CdTe (Cadium telluride) and CIS (copper indium diselenide) are the latest commercial products that are gathering attention in the solar cells markets. However there are some downsides to this newly invention. Since the materials are embedded, in the occasion of damage, certain amount of module residue can be released to water or soil. This paper outlines the results of our outdoor leaching experiments on photovoltaic (PV) samples broken into small fragments and been observed for 1 year.

• 한국군사과학기술학회지
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• 제6권3호
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• pp.44-53
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• 2003

Cu/C films were prepared at room temperature under $Cu(hfac)_2-Ar-H_2$ atmosphere in order to obtain metallized polymer by using ECR-MOCVD(Electron Cyclotron Resonance Metal Organic Chemical Vapor Deposition) coupled with a DC bias system. The room temperature MOCVD on polymer substrate could be possible by collaboration of ECR and a DC bias. Structural analysis of the films by ECR was found that fine copper grains embedded in an amorphous polymer matrix with indistinctive interfacial layer. The increase in $H_2$ contents brought on copper-rich film formation with low electric resistance. On the other hand carbon-rich films with low sheet electric resistance were prepared in argon atmosphere. The electric sheet resistance of Cu/C films with good interfacial property were controlled at $10^8$~$10^0$ Ohm/sq. ranges by the $H_2$/Ar mole ratio and the shielding effectiveness of the film showed maximum up to 45dB in the our experimental range.

• Restorative Dentistry and Endodontics
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• 제6권1호
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• pp.115-122
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• 1980

The corrosion of silver amalgam is regarded as one of major causes in the failures of dental amalgam restorations. To evaluate the corrosion resistance of dental amalgam alloys, electrochemical tests such as potential and polarization measurement were used widely. But these commonly used methods have not provided the sufficient informations on relative resistance of amalgam to corrosion. In this experiment, the corrosion currents were measured using electronic potentiostat to compare some commercial dental amalgam alloys. All alloys were triturated in a amalgamator and condensed into a mold described in A.D.A. Specification No. 1 to produce cylinder form specimens of 4mm diameter by 5mm long. After specimen kept for 1 week at $37^{\circ}C$, each specimen was embedded in epoxy resin. The surfaces of specimens were then polished with a emery paper, diamond dust, and $Al_2O_3$. These specimens were immersed in artifical saliva kept at $37^{\circ}C$, and currents of each specimen were measured for 24 hours at 0.0volt (SCE). The author obtained conclusions as follows: 1. High copper amalgam showed superior resistance against corrosion to conventional amalgam, but a pellet form of high copper amalgam seemed to be susceptible to corrosion. 2. In lathe-cut alloys, fine-cut had superior resistance against corrosion to regular-cut. 3. Non-zinc conventional amalgam alloys were more resistant to corrosion than that of zinc containing conventional amalgam alloys. 4. In both of high copper and conventional amalgams, predispensed forms tended to have better resisitance to corrosion than that of pellet forms.

• 한국해양공학회지
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• 제23권6호
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• pp.111-116
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• 2009

The cracking due to hydration heat in mass concrete must be resolved to improve the stability and durability of concrete structures. In this study, the economic efficiency was improved by replacing a copper pipe with a steel one for the heat pipe, and the heat pipe was standardized to significantly improve the operation efficiency, such as the processing, transport, assembly, and construction time. As a result of the experiment, the peak temperature of the ICSHP, ISSHP, and ISUHP specimens decreased by about $7.2{\sim}10.9^{\circ}C$ compared to the OPC specimen and the probability of a thermal crack being generated in the ICSHP, ISSHP, and ISUHP specimens decreased by up to 84~88%.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2003년도 추계학술발표대회 논문집
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• pp.46-49
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• 2003

Cu have been widely used as signal transmission materials for electrical electronic components owing to its high electrical conductivity. However, it's size have been limited to small ones due to its poor mechanical properties, Until now, strengthening of the copper at toy was obtained either by the solid solution and precipitation hardening by adding alloy elements or the work hardening by deformation process. Adding the at toy elements lead to reduction of electrical conductivity. In this aspect, if carbon nanofiber is used as reinforcement which have outstanding mechanical strength and electric conductivity, it is possible to develope Cu matrix nanocomposite having almost no loss of electric conductivity. It is expected to be innovative in electric conduct ing material market. The unidirectional alignment of carbon nanofiber is the most challenging task developing the copper matrix composites of high strength and electric conductivity In this study, the unidirectional alignment of carbon nanofibers which is used reinforced material are controlled by drawing process in order to manufacture the intermediary materials for the carbon nanofiber reinforced Cu matrix nanocomposite and align mechanism as well as optimized drawing process parameters are verified via experiments and numerical analysis. The materials used in this study were pure copper and the nanofibers of 150nm in diameter and of $10~20\mu\textrm{m}$ In length. The materials have been tested and the tensile strength was 75MPa with the elongation of 44% for the copper it is assumed that carbon nanofiber behave like porous elasto-plastic materials. Compaction test was conducted to obtain constitutive properties of carbon nanofiber. Optimal parameter for drawing process was obtained by experiments and numerical analysis considering the various drawing angles, reduction areas, friction coefficient, etc Lower reduction areas provides the less rupture of cu tube is not iced during the drawing process. Optimal die angle was between 5 degree and 12 degree. Relative density of carbon nanofiber embedded in the copper tube is higher as drawing diameter decrease and compressive residual stress is occurred in the copper tube. Carbon nanofibers are moved to the reverse drawing direct ion via shear force caused by deformation of the copper tube and alined to the drawing direction.

• JSTS:Journal of Semiconductor Technology and Science
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• 제1권1호
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• pp.84-93
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• 2001

An electromagnetic micro x-y stage for probe-based data storage (PDS) has been fabricated. The x-y stage consists of a silicon body inside which planar copper coils are embedded, a glass substrate bonded to the silicon body, and eight permanent magnets. The dimensions of flexures and copper coils were determined to yield $100{\;}\mu\textrm{m}$ in x and y directions under 50 mA of supplied current and to have 440 Hz of natural frequency. For the application to PDS devices, electromagnetic stage should have flat top surface for the prevention of its interference with multi-probe array, and have coils with low resistance for low power consumption. In order to satisfy these design criteria, conducting planar copper coils have been electroplated within silicon trenches which have high aspect ratio ($5{\;}\mu\textrm{m}$in width and $30{\;}\mu\textrm{m}$in depth). Silicon flexures with a height of $250{\;}\mu\textrm{m}$ were fabricated by using inductively coupled plasma reactive ion etching (ICP-RIE). The characteristics of a fabricated electromagnetic stage were measured by using laser doppler vibrometer (LDV) and dynamic signal analyzer (DSA). The DC gain was $0.16{\;}\mu\textrm{m}/mA$ and the maximum displacement was $42{\;}\mu\textrm{m}$ at a current of 180 mA. The measured natural frequency of the lowest mode was 325 Hz. Compared with the designed values, the lower natural frequency and DC gain of the fabricated device are due to the reverse-tapered ICP-RIE process and the incomplete assembly of the upper-sided permanent magnets for LDV measurements.

• 한국분말재료학회지
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• 제25권4호
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• pp.291-295
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• 2018

A conductive additive is prepared by dispersing multi-walled carbon nanotubes (MWCNTs) on Cu powder by mechanical milling and is distributed in epoxy to enhance its electrical conductivity. During milling, the MWCNTs are dispersed and partially embedded on the surface of the Cu powder to provide electrically conductive pathways within the epoxy-based composite. The degree of dispersion of the MWCNTs is controlled by varying the milling medium and the milling time. The MWCNTs are found to be more homogeneously dispersed when solvents (particularly, non-polar solvent, i.e., NMP) are used. MWCNTs gradually disperse on the surface of Cu powder because of the plastic deformation of the ductile Cu powder. However, long-time milling is found to destroy the molecular structure of MWCNTs, instead of effectively dispersing the MWCNTs more uniformly. Thus, the epoxy composite film fabricated in this study exhibits a higher electrical conductivity than 1.1 S/cm.

• Restorative Dentistry and Endodontics
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• 제16권2호
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• pp.1-17
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• 1991

The purpose of this study was to analyze the in vivo amalgam corrosion products qualitatively. 30 molars with large, intact amalgam restorations were selected. All the restorations were more than 5 years old. Twenty of the removed amalgams were embedded in acrylic resin block. The exposed surfaces of fifteen embedded amalgams were polished by amalgam polishing kit, and the rest were observed without polishing. The remaining 10 amalgams were fractured centrally and perpendiculary to the occlusal surface with a wire-cutter. After all specimens were cleaned ultrasonically in distilled water, each surface was examined under S.E.M. and E.D.A.X. (Energy Dispersive Micro X-ray Analyzer) to determine the morphology and chemical nature of the corrosion products. The following results were obtained: 1. The surfaces of the unpolished amalgam restorations were covered with thin amorphous layer of Sn-Ca-P-S complex with numerous cracks. 2. In the conventional amalgams, the major corrosion products were Sn-Cl phases however, tin oxide phases were also observed. 3. Only tin oxide phase was identified in the high copper amalgam, but it was less frequently observed than in the conventional amalgam. 4. It was easier to observe the corrosion product morphology in the fractured surfaces than in the polished ones. The morphologies of the corrosion product crystals looked like a stack of slightly bended plates in the Sn-Cl phases and polyhedra or polygonal prisms in the tin oxide phases.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.1117-1120
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• 2001

Chemical mechanical planarization(CMP) has emerged as the planarization technique of choice in both front-end and back-end integrated circuit manufacturing. Conventional CMP process utilize a polyurethane polishing pad and liquid chemical slurry containing abrasive particles. There have been serious problems in CMP in terms of repeatability and defects in patterned wafers. Since IBM's official announcement on Copper Dual Damascene(Cu2D) technology, the semiconductor world has been engaged in a Cu2D race. Today, even after~3years of extensive R&D work, the End-of-Line(EOL) yields are still too low to allow the transition of technology to manufacturing. One of the reasons behind this is the myriad of defects associated with Cu technology. Especially, dishing and erosion defects increase the resistance because they decrease the interconnection section area, and ultimately reduce the lifetime of the semiconductor. Methods to reduce dishing & erosion have recently been interface hardness of the pad, optimization of the pattern structure as dummy patterns. Dishing & erosion are initially generated an uneven pressure distribution in the materials. These defects are accelerated by free abrasive and chemical etching. Therefore, it is known that dishing & erosion can be reduced by minimizing the abrasive concentration. Minimizing the abrasive concentration by using Ce$O_2$ is the best solution for reducing dishing & erosion and for removal rate. This paper introduce dishing & erosion generating mechanism and a method for developing a semi-rigid abrasive pad to minimize dishing & erosion during CMP.