• Journal of Sensor Science and Technology
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• v.23 no.4
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• pp.234-237
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• 2014

In this paper, a copper foil-thick grapheme (thin graphite sheet)-copper foil structure is reported to achieve mechanically strong and high thermal conductive layer suitable for heat spreading components. Since graphene provides much higher thermal conductivity than copper, thick graphene embedded copper layer can achieve higher effective thermal conductivity which is proportional to graphene/copper thickness ratio. Since copper is nonreactive with carbon material which is graphene, chromium is used as adhesion layer to achieve copper-thick graphene-copper bonding for graphene embedded copper layer. Both sides of thick graphene were coated with chromium as an adhesion layer followed by copper by sputtering. The copper foil was bonded to sputtered copper layer on thick graphene. Angstrom's method was used to measure the thermal conductivity of fabricated copper-thick graphene-copper structure. The thermal conductivity of the copper-thick graphene-copper structures is measured as $686W/m{\cdot}K$ which is 1.6 times higher than thermal conductivity of pure copper.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.3
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• pp.506-511
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• 2006

Silver is one of the most appropriate Jewelry materials for Jewelry casting and bench working. The technique known as 'Mokumegane' is good for making silver jewelry with natural patterns, such as wood grain patterns, but the process is not easy for silversmithing because it requires complicated and heavy labour. Instead of using conventional Mokumegane technique, we propose a new modified silver-copper casting process that enables a similar surface effect with good metal bonding strength between silver and copper. Simply pouring the molten silver into pre-aligned copper granules or 0.5 mm to 1.5 mm-thick copper sheets leads to well embedded copper silver ingots. The rolled silver plates from those ingots show excellent bonding interface even after the silver plate rolled ten times. We successfully fabricated prototype rings with copper embedded silver plates. Our result implies that our newly proposed process nay be a simpler way to fabricate silver jewelry with a pseudo-Mokumegane effect.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.45-45
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• 2007

Capacitors among the embedded passive components are most widely studied because they are the major components in terms of size and number and hard to embed compared with resistors and inductors due to the more complicated structure. To fabricate a capacitor-embedded PCB for in-line process, it is essential to adopt a low temperature process (<$200^{\circ}C$). However, high dielectric materials such as ferroelectrics show a low permittivity and a high dielectric loss when they are processed at low temperatures. To solve these contradicting problems, we studied BMN materials as a candidate for dielectric capacitors. processed at PCB-compatible temperatures. The morphologies of BMN thin films were investigated by AFM and SEM equipment. The electric properties (C-F, I-V) of Pt/BMN/Cu/polymer were evaluated using an impedance analysis (HP 4194A) and semiconductor parameter analyzer (HP4156A). $Bi_2Mg_{2/3}Nb_{4/3}O_7$(BMN) thin films deposited on copper clad laminate substrates by sputtering system as a function of Ar/$O_2$ flow rate at room temperature showed smooth surface morphologies having root mean square roughness of approximately 5.0 nm. 200-nm-thick films deposited at RT exhibit a dielectric constant of 40, a capacitance density of approximately $150\;nF/cm^2$, and breakdown voltage above 6 V. The crystallinity of the BMN thin films was studied by TEM and XRD. BMN thin film capacitors are expected to be promising candidates as embedded capacitors for printed circuit board (PCB).

• Proceedings of the Korea Concrete Institute Conference
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• 1997.10a
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• pp.263-268
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• 1997

One of the principal causes of the deterioation of coastal concrete structures is the corrosion of reinforcing steel induced by the attack of chloride ions. An experimental study was performed to investigate the distribution of concentration of chloride ions in a coastal concrete structure and to measure the half-cell potential of embedded steel by using the copper-copper sulfate reference electrode. Quantitative analysis showed that the concentration of chloride ion in the aqueous phase near the surface of embedded steel exceeded a threshold value for corrosion, 0.05% by weight in concrete. The absolute value of half-cell potential at some members of embedded steel was measured to be higher than 350mV, indicating that the probability of corrosion is more than 90%. The prediction on corrosion based on the experimental measurements was confirmed by the observation of corrosion on the surface of steel bars in the concrete core taken out of the concrete structure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.313-313
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• 2008

Aerosol Deposition(AD) method is based on the impact consolidation phenomenon of ceramic fine particles at room temperature. AD is promising technology for the room temperature deposition of the dielectrics thin films with high quality. Embedding of passive components such as capacitors into printed circuit board is becoming an important strategy for electronics miniaturization and device reliability, manufacturing cost reduction. So, passive integration using aerosol deposition. In this study, we examine the effects of the characteristics of raw powder on the thickness, roughness, electrical properties of $BaTiO_3$ thin films. Thin films were deposited on the copper foil and copper plate. Electrical and material properties was investigated as a change of annealing temperature. We final aim the effects of before and after of laminated on the electrical properties and suit of embedded capacitor.

• Corrosion Science and Technology
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• v.3 no.3
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• pp.118-126
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• 2004

The correlation between sensor output and corrosion rate of reinforcing steel was evaluated by laboratory electrochemical tests in saturated $Ca(OH)_2$ with 3.5 wt.% NaCl and confirmed in concrete environment. In this paper, two types of electrochemical probes were developed: galvanic cells containing of steel/copper and steel/stainless steel couples. Potentiodynamic test, weight loss measurement, monitoring of open-circuit potential, linear polarization resistance (LPR) measurement and electrochemical impedance spectroscopy (EIS) were used to evaluate the corrosion behavior of steel bar embedded in concrete. Also, galvanic current measurements were conducted to obtain the charge of sensor embedded in concrete. In this study, steel/copper and steel/stainless steel sensors showed a good correlation in simulated concrete solution between sensor output and corrosion rate of steel bar. However, there was no linear relationship between steel/stainless steel sensor output and corrosion rate of steel bar in concrete environment due to the low galvanic current output. Thus, steel/copper sensor is a reliable corrosion monitoring sensor system which can detect corrosion rate of reinforcing steel in concrete structures.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1182-1185
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• 2003

Recently, the research of the nano technology has been done on a lot of area over the world. Especially, the interest of them is much higher for semiconductor companies and other super accuracy processing area. In this thesis, we have approached the characteristic of the tensile and bonding of copper, frequently used to nano wires, by molecular dynamics simulation. And the simulation was done by EAM, Embedded Atom Method which has the most highest accuracy for metal. Then the feature of copper at atom space is understood through the simulation of nano wire.

• Journal of Powder Materials
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• v.22 no.4
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• pp.247-253
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• 2015

The sintering mechanisms of nanoscale copper powders have been investigated. A molecular dynamics (MD) simulation with the embedded-atom method (EAM) was employed for these simulations. The dimensional changes for initial-stage sintering such as characteristic lengths, neck growth, and neck angle were calculated to understand the densification behavior of copper nano-powders. Factors affecting sintering such as the temperature, powder size, and crystalline misalignment between adjacent powders have also been studied. These results could provide information of setting the processing cycles and material designs applicable to nano-powders. In addition, it is expected that MD simulation will be a foundation for the multi-scale modeling in sintering process.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.8
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• pp.1471-1475
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• 2007

In this paper, a novel embedded ultra wideband (UWB) band-pass filter is presented on a FR-4 package substrate including high Dk resin coated copper (${\varepsilon}_r=30$) film. The proposed UWB filter is comprised of a parallel resonator with meander-type uniform impedance resonator (UIR) and two series resonators with high Q circular stacked spiral inductor and metal-insulator-metal (MIM) capacitor. In order to obtain excellent attenuation characteristics by generating attenuation poles in lower and upper stop bands, a single MIM capacitor is added to each resonator. The fabricated FR-4 embedded UWB filter has insertion loss of -1.0dB and return loss of -11dB, respectively. It has also extremely wide bandwidth (over 50%) and small size ($3.7{\times}4{\times}0.77\;mm^3$) which is compatible with LTCC devices.

• Journal of Powder Materials
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• v.25 no.5
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• pp.435-440
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• 2018

In the present study, we develop a conductive copper/carbon nanomaterial additive and investigate the effects of the morphologies of the carbon nanomaterials on the conductivities of composites containing the additive. The conductive additive is prepared by mechanically milling copper powder with carbon nanomaterials, namely, multi-walled carbon nanotubes (MWCNTs) and/or few-layer graphene (FLG). During the milling process, the carbon nanomaterials are partially embedded in the surfaces of the copper powder, such that electrically conductive pathways are formed when the powder is used in an epoxy-based composite. The conductivities of the composites increase with the volume of the carbon nanomaterial. For a constant volume of carbon nanomaterial, the FLG is observed to provide more conducting pathways than the MWCNTs, although the optimum conductivity is obtained when a mixture of FLG and MWCNTs is used.