• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1504-1505
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• 2007

In this paper, fully embedded high Dk BTO MIM capacitors have been developed into a multi-layered organic package substrate for low cost RF SOP (System on Package) applications. These embedded MIM capacitors were designed and simulated by using CST 3D EM simulators for finding out optimal geometries and verifying their applicability. The embedded MIM capacitor with a size of $550\;{\times}\;550\;um^2$ has a capacitance of 5.3pF and quality factor of 43 at 1.5 GHz, respectively. The measured performance characteristics were well matched with 3D EM simulated ones. Equivalent circuit parameters of the embedded capacitors were extracted for making a design library.

• Journal of Korea Society of Digital Industry and Information Management
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• v.17 no.3
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• pp.9-15
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• 2021

In this paper, the Embedded MEMS system to the power apparatus used Edge Impulse machine learning tools and therefore an improved predictive system design is implemented. The proposed MEMS embedded system is developed based on nRF52840 system and the sensor with 3-Axis Digital Magnetometer, I2C interface and magnetic measurable range ±120 uT, BM1422AGMV which incorporates magneto impedance elements to detect magnetic field and the ARM M4 32-bit processor controller circuit in a small package. The MEMS embedded platform is consisted with Edge Impulse Machine Learning and system driver implementation between hardware and software drivers using SensorQ which is special queue including user application temporary sensor data. In this paper by experimenting, TensorFlow machine learning training output is applied to the power apparatus for analyzing the status such as "Normal, Warning, Hazard" and predicting the performance at level of 99.6% accuracy and 0.01 loss.

• Journal of information and communication convergence engineering
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• v.7 no.2
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• pp.215-218
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• 2009

In this paper, temperature stable current and voltage references using simple CMOS bias circuit are proposed. To obtain temperature stable characteristics of bias circuit a bandgap reference concept is used in a conventional circuit. The parasitic bipolar transistors or MOS transistors having different threshold voltage are required in a bandgap reference. Thereby the chip area increase or the extra CMOS process is required compared to a standard CMOS process. The proposed reference circuit can be integrated on a single chip by a standard CMOS process without the extra CMOS process. From the simulation results, the reference current variation is less than ${\pm}$0.44% over a temperature range from - $20^{\circ}C$ to $80^{\circ}C$. And the voltage variation is from - 0.02% to 0.1%.

• ETRI Journal
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• v.28 no.2
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• pp.182-190
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• 2006

The circuit modeling of interdigitated capacitors fabricated by high-k low-temperature co-fired ceramic (LTCC) sheets was investigated. The s-parameters of each test structure were measured from 50 MHz to 10 GHz, and the modeling was performed using these measured sparameters up to the first resonant frequency. Each test structure was divided into appropriate building blocks. The equivalent circuit of each building block was composed based on the partial element equivalent circuit (PEEC) method. Modeling was executed to optimize the parameters in the equivalent circuit of each building block. The validity of the extracted parameters was verified by the predictive modeling for the test structures with different geometry. After that, Monte Carlo analysis and sensitivity analysis were performed based on the extracted parameters. The modeling methodology can allow a device designer to improve the yield and to save time and cost for the design and manufacturing of devices.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.60-60
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• 2008

We manufactured Liquid Crystal Polymer (LCP) and (1-x)$BaTiO_3-xSrTiO_3$(BST) ceramic composites and investigated dielectric properties to use as embedded capacitor in printed circuit boards and replace LTCC substrates. The dielectric properties of these composites are varied with volume fraction of BST and ratios of BT/ST. Dielectric constants are in the range of 3~28. In addition, we could get low TCC and High Q value that could not achieve in other ceramic-polymer composites. Especially, in composite with x=0.4 and 50vol% BST, the dieletric constant and Q-value are 27 and 300, respectively. And more TCC is -116~145ppm/$^{\circ}C$ in the temperature range of -55~$125^{\circ}C$. We think that this composites can be used high-Q substrate material like LTCC and embedded temperature compensation capacitor in printed circuit boards.

• The KIPS Transactions:PartA
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• v.10A no.3
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• pp.255-260
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• 2003

In recent, as a typical example of RFID, the contactless IC card is widely used in traffic, access control system and so forth. And its use becomes a general tendency more and more because of the development of RF technology and improvement of requirement for user convenience. This paper describes the hardware module to process embedded contactless protocol for implementation contactless IC card. And the hardware module consists of analog circuits and specific digital logic circuits. This paper also describes more effective design method of contactless IC card, which method separates into analog circuit parts, digital logic circuit part, and software parts according to the role of the design parts.

• Journal of electromagnetic engineering and science
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• v.14 no.1
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• pp.43-45
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• 2014

We propose a printed circuit board (PCB)-embedded antenna for millimeter-wave chip-to-chip communication. The antenna is 0.18 mm in height which is 1/20 wavelength at 80 GHz. In order to realize such a low profile, a zeroth-order resonator antenna with a periodic array of four unit cells is employed, and its geometry is optimized to cover an 8-GHz bandwidth from 76 to 84 GHz. With this;the antenna is capable of radiating in a direction parallel to the board length despite the short distance between the ground and the radiator. Simulation and measurement results show that the optimized design has low reflection coefficients and consistent radiation patterns throughout the target bandwidth.

• IEMEK Journal of Embedded Systems and Applications
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• v.12 no.2
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• pp.79-88
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• 2017

One of the important applications of activity sensing in the home is energy monitoring. Many previous methodologies for detecting and recognizing household appliances have been proposed. This paper presents an approach that uses an energy metering circuit (EMC) to classify and identify the various electrical devices in home based on root-mean-square (RMS) consumed current value. EMC gathers the RMS current values created by appliance state transition (e.g., on to off) and apparatus operating process. In this paper, an identification algorithm is proposed to detect a change in current levels using the standard deviation of current signals and their average values. In addition, characteristic of the appliance is extracted concerning four feature parameters concerning the number of current levels, the minimum level, the maximum level, and signal-to-noise ratio (SNR) of them. Experiment results validate the reliable performance of the proposed identification method for 11 representative appliances.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.139-142
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• 2001

As microeletronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important for many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (5-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.781-782
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• 2006

This treatise proposed environment for Embedded system's development. Virtual platform can help to solve problem that hardware designer can experience at design process of hardware. Compose circuit of most suitable that is verified before mix parts by various kinds method and compose circuit by board level because can do simulation with software and software that is optimized to hardware and offer flexibility that can test. Therefore, can shorten expense that is cost in development and time. Embody development platform for 8051 systems for verification of development platform, and compose and verified system in various kinds structure.