• Journal of the Korea Institute of Military Science and Technology
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• v.4 no.2
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• pp.122-129
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• 2001

A characterization procedure for analyzing symmetric coupled MIS(Metal-Insulator-Semiconductor) transmission line is used the same procedure as a general single layer symmetric coupled line with perfect dielectric substrate from the extraction of the characteristic impedance and propagation constant for even- and odd-mode. In this paper, an analysis for a new substrate shielding symmetric coupled MIS structure consisting of grounded crossbar at the interface between Si and SiO2 layer using the Finite- Difference Time-Domain(FDTD) method is presented. In order to reduce the substrate effects on the transmission line characteristics, a shielding structure consisting of grounded crossbar lines over time-domain signal has been examined. Symmetric coupled MIS transmission line parameters for even- and odd-mode are investigated as the functions of frequency, and the extracted distributed frequency- dependent transmission line parameters and corresponding equivalent circuit parameters as well as quality factor for the new MIS crossbar embedded structure are also presented. It is shown that the quality factor of the symmetric coupled transmission line can be improved without significant change in the characteristic impedance and effective dielectric constant.

• Journal of the Korean Society for Railway
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• v.10 no.6
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• pp.730-734
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• 2007

In this paper, we suggest the criticality of Hidden Failure with regard to the design of watch dog timer, used to detect HALT on railway signaling embedded controller, via FMEA and FTA. Hidden Failure means reliability and safety degradation of the system due to any failure occurred on elements added for fault tolerance. In this paper, therefore, we design vital watch dog timer to prevent the system from operating in low SIL conditions and assess the safety of circuit on failure occurrence to demonstrate that safety degradation problems owing to existing design are supplemented.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.6
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• pp.781-792
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• 2016

This paper presents a new approach to enhance the data retention of logic-compatible embedded DRAMs. The memory bit-cell in this work consists of two logic transistors implemented in generic triple-well CMOS process. The key idea is to use the parasitic junction capacitance built between the common cell-body and the data storage node. For each write access, a voltage transition on the cell-body couples up the data storage levels. This technique enhances the data retention and the read performance without using additional cell devices. The technique also provides much strong immunity from the write disturbance in the nature. Measurement results from a 64-kbit eDRAM test chip implemented in a 130 nm logic CMOS technology demonstrate the effectiveness of the proposed circuit technique. The refresh period for 99.9% bit yield measures $600{\mu}s$ at 1.1 V and $85^{\circ}C$, enhancing by % over the conventional design approach.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.178-182
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• 2003

This paper presents the embedded inductors in PCB (Printed Circuit Board) for PAM(Power Amplifier Module) of mobile terminations. The inductors are designed, simulated, and compared to conventional chip inductors. The Quality factor(Q) and self-resonance frequency(SRF) of the inductors are evaluated. The quality factors of the inductors are two times higher than those of the chip inductors, and the self-resonance frequency is 1.3 times higher than those of chip inductors at the inductance of 2.7 nH and 3.3 nH respectively.

• Journal of Broadcast Engineering
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• v.13 no.3
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• pp.415-418
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• 2008

Some embedded microprocessors do not have an FPU(Floating Point Unit) due to a circuit complexity and power consumption. The performance speed of MPEG-4 AAC decoder on this hardware environment would be slower than corresponding speed for playing back of the decoded results. Therefore, irritating and high-pitched noises are interleaved in the original the audio data. So, in order to play MPEG-4 AAC file on such PDA, a new algorithm that transforms floating-point arithmetic to one with integers, is needed. We have developed a transformation algorithm from floating-point operation to integer operation and implemented the PDA's AAC Player. We also show the efficiency of our proposed method with the experimental results.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.84-88
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• 2013

These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.6
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• pp.495-500
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• 2009

The ceramic($BaTiO_3$)-polymer(epoxy) composites have been widely investigated as dielectric materials for embedded capacitors in printed circuit boards (PCBs). The dielectric properties of $BaTiO_3$/epoxy composites prepared using the agglomerated $BaTiO_3$ particles were investigated in the present study. The dielectric constants of the composites prepared using the agglomerated $BaTiO_3$ particles were about 2 times higher than those of the composites with the dispersed $BaTiO_3$ particles. The insulation resistance of the composites prepared using the agglomerated $BaTiO_3$ particles were lower than those of the composites with dispersed $BaTiO_3$ particles. As a result, there is tradeoff between high dielectric constant and insulation resistance in the $BaTiO_3$/epoxy composites. So it is important to select proper agglomerated or dispersed $BaTiO_3$ particles in accordance with needs.

• IEMEK Journal of Embedded Systems and Applications
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• v.11 no.1
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• pp.47-56
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• 2016

There are many assistive devices for the visually impaired. They are becoming smart. In this paper, we propose a device that help route guidance for a visually impaired person. It is composed of a smart phone, cane, and hands-free devices. The smart phone helps a route guidance. The cane detects an obstacle and transmits it to the hands-free device. The hands-free device communicates with a visually impaired person. We here present their architecture, signal flow, configuration, and their circuit diagrams.

• IEMEK Journal of Embedded Systems and Applications
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• v.8 no.1
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• pp.43-50
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• 2013

The narrow dynamic range of most smart phone cameras is severely limited. It usually is narrower than the dynamic range of most scenes. So we proposes a illuminance dynamic range expansion using multi-point knee for smart phone camera. Such as logarithmic functions the proposed method compress the image sensor output signal. Additionally, the proposed method was merged into the gamma that is essential circuit for any cameras. To justifying multi-point knee effectiveness, we configure the control and quality evaluation system for smart phone camera module. Experimental results show that the lost information by cut off and saturated affectively reconstructed in darker and in brighter areas. Finally this methods have advantage to implement without any changing hardware for conventional smart phones.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.55-60
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• 2002

The recent trend in electronic devices has been towards light weight, low cost, high performance and improved reliability. Passive components are very important parts of microelectronic devices. The number of passive components used in hand held devices and computers continue to increase. To achieve improvements in costs, component density, performance, and reliability, embedding of these passive components into the printed circuit boards (PCBs) is required. This paper introduces the embedding of passive components, and discusses the remained challenges in the commercialization of this technique.