• Proceedings of the KIEE Conference
• /
• 2003.10a
• /
• pp.297-299
• /
• 2003

In this paper, we present the fabrication of copper electrode array and test of electrochemical discharge machining for the fabrication of microholes on Borofloat33 glass. Copper electrode array is fabricated by the bonding of silicon upper substrate and lower substrate and copper electroplate. The silicon upper electrode having microholes fabricated by ICP-RIE is the mold of copper electroplate. The lower substrate is used as the seed layer for copper electroplate after Au - Au thermocompression bonding with the upper substrate.

• Korean Journal of Materials Research
• /
• v.24 no.10
• /
• pp.515-519
• /
• 2014

The aim of this paper is to consider the effect of annealing on the coefficient of thermal expansion (CTE) of electroplated Invar Fe-Ni alloy. The CTE of the as-electroplated alloy is lower than those of alloys annealed at $400^{\circ}C$ and $800^{\circ}C$. XRD peaks become sharper as the as-electroplated alloy is annealed, which means the grain growth. The average grain sizes of as-electroplated and as-annealed alloys at $400^{\circ}C$ and $800^{\circ}C$ are 10 nm, 70 nm, and $2{\mu}m$, respectively, as determined by TEM and EBSD analyses. The CTE variation for the various grain sizes after annealing may come from the magnetostriction effect, which generates strain due to changes in the magnetization state of the alloys. The thermal expansion coefficient is considered to be affected by nano grain size in electroplated Fe-Ni Invar alloys. As grain size decreases, ferromagnetic forces might change to paramagnetic forces. The effect of lattice vibration damping of nano grain boundaries could lead to the decrease of CTE.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1996.04a
• /
• pp.19-23
• /
• 1996

Deburring and edge finishing technology as the last process of machining operation is required for manufacturing of advanced procesion components, duburring has treated as a difficult problem on going tothe highefficency, automation in the FMS. Removal of butt with various shapes, dimensions and properties coultn't has a standard and has depended on manual treatment. Especially, deburring for cross hole inside owing to passing through out perpendicular to a main hole is more difficult, the electrolytic method is proper as its solution at practical aspects. Therefore, for the high effciency and automation of intermal deburring in the cross hole, development of electrolytic debutting technology is needed. So, the new process in the burr treatment is supposed. In this study, in the eliminating burr inside cross hole, the principle and machining performances of electrochemical deburring by Cubic-Boron-Nitrade abrasive electroplate wheel are investigated, Design and manufacture of CBN electroplated wheel and analysis of characteristics with electrolytic debutting are achieved. Also deburring efficiency and electrolytic performance for cross hole were examined according to electrolytic current and electrolytic deburring condition corresponding to acquired edge quality was found out.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.33 no.7
• /
• pp.621-628
• /
• 2009

Nickel-phosphorus alloys are attractive materials for diamond turning applications such as fabrication of large optics and other high precision parts. It is also well-known that the higher phosphorus content of the alloys minimizes the diamond tool wear. Due to the weakness of electoless nickel plating that the phosphorus contents is limited to 13-14% (wgt), increased attention has been paid at electro-nickel plating which enables the alloys with 15-16% phosphorus. In this study, experiments were carried out to observe the wear characteristic of single crystal diamond tools in micro-grooving of electro-nickel plated drums. The experiments shows that long distance (50km) machining of micro-grooving on electro-nickel plated drum is possible with a single crystal diamond tool without any significant tool wear and defective machined surface.

• Korean Journal of Metals and Materials
• /
• v.48 no.3
• /
• pp.218-224
• /
• 2010

Direct copper electroplating on Mg alloy AZ31B was carried out in a traditional pyrophosphate copper bath containing potassium fluoride. Electrochemical impedance spectroscopy and polarization methods were used to study the effects of added potassium fluoride on electrochemical behavior. The chemical state of magnesium alloy in the electroplating bath was analyzed by X-ray photoelectron spectroscopy. Adhesion of the copper electroplated layer was also tested. Due to the added potassium fluoride, a magnesium fluoride film was formed in the pyrophosphate copper bath. This fluoride film inhibits dissolution of Mg alloy and enables to electroplate copper directly on it. A dense copper layer was formed on the Mg alloy. Moreover, this copper layer has a good adhesion with Mg alloy substrate.

• The korean journal of orthodontics
• /
• v.33 no.2 s.97
• /
• pp.131-140
• /
• 2003

The purpose of this study was to evaluate clinical applications of electroplating method through investigation of the physical properties of orthodontic rectangular wires according to varying their cross section. For the study, it was accomplished to electroplate the 0.016-inched orthodontic rectangular stainless steel wire. The cross section of stainless steel orthodontic rectangular wire increased from $0.016{\times}0.016inch\;to\;0.017{times}0.017inch$ by electroplating. The wire was heat treated to improve an adhesion between the wire and electroplated metal. h three-point bending test and torsion test were conducted in order to compare physical properties among three wire groups; $0.016{\times}0.016wires(group 016),\; electroplated\;0.016{\times}0.016wires(group\;016P)\;and\;0.017{\times}0.017$ wires (group 017). Through the investigations of each wire group, following results were obtained 1. At three-point bending test, the group Ol6P showed higher tendency in the degree of stiffness, yield strength and ultimate tensile strength than the group 016. Stiffness and ultimate tensile strength showed statistically significant differences between two groups at three-point bending test (p<0.05). 2. Stiffness, yield strength, and ultimate tensile strength of the group 016P showed lower tendency than those of the group 017 Stiffness showed statistically significant differences between two groups at three-point bending test (p<0.05). 3. Torque/twist rate, yield torsional moment, and ultimate torsional moment of the group 016P showed higher tendency than those of the group 016. All measurements showed statistically significant differences between two groups alter torsion test (p<0.05). 4. Torque/twist rate, yield torsional moment, and ultimate torsional moment of the group 0166P showed lower tendency than those of the group 017. Yield torsional moment, and ultimate torsional moment showed statistically significant differences between two groups after torsion test (p<0.05).

• Journal of the Microelectronics and Packaging Society
• /
• v.11 no.2 s.31
• /
• pp.59-66
• /
• 2004

This paper presents a novel fabrication process for a tapered hollow metallic microneedle array using backside exposure of SU-8, and analytic solutions of critical buckling of a tapered hollow microneedle. An SU-8 meta was formed on a Pyrex glass substrate and another SU-8 layer, which was spun on top of the SU-8 mesa, was exposed through the backside of the glass substrate. An array of SU-8 tapered pillar structures. with angles in the range of $3.1^{\circ}{\sim}5^{\circ}$ was formed on top of the SU-8 mesa. Conformal electrodeposition of metal was carried out followed by a mechanical polishing using a pianarizing polymeric layer. All organic layers were then removed to create a metallic hollow microneedle array with a fluidic reservoir on the backside. Both $200{\mu}m\;and\;400{\mu}m$ tall, 10 by 10 arrays of metallic microneedles with inner diameters of the tip in the range of $33.6{\sim}101\;{\mu}m$ and wall thickness of $10{\mu}m\;-\;20{\mu}m$ were fabricated. Analytic solutions of the critical buckling of arbitrary-angled truncated cone-shaped columns are also presented. It was found that a single $400{\mu}m$ tall hollow cylindrical microneedle made of electroplated nickel with a wall thickness of $20{\mu}m$, a tapered angle of $3.08^{\circ}$ and a tip inner diameter of $33.6{\mu}m$ has a critical buckling force of 1.8 N. This analytic solution can be used for square or rectangular cross-sectioned column structures with proper modifications.